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SIST CECC 23 800-801:2002

(Main)

Capability Detail Specification: Flexible multilayer printed boards with through connections

Capability Detail Specification: Flexible multilayer printed boards with through connections

D97/081: CECC/SC 52 disbanded

Bauartspezifikation zur Anerkennung der Befähigung: Flexible Mehrlagen-Leiterplatten mit Durchverbindungen

Spécification particulière d'agrément: Cartes imprimées multicouches souples avec connexions transversales

Capability Detail Specification: Flexible multilayer printed boards with through connections

General Information

Status
Published
Publication Date
30-Apr-2002
ICS
31.180 - Printed circuits and boards
Technical Committee
ITIV - Electronics assembly technology and Environmental standardization
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
01-May-2002
Due Date
01-May-2002
Completion Date
01-May-2002
Ref Project
CECC 23 800-801:1998 - Capability Detail Specification: Flexible multilayer printed boards with through connections

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Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Capability Detail Specification: Flexible multilayer printed boards with through connectionsBauartspezifikation zur Anerkennung der Befähigung: Flexible Mehrlagen-Leiterplatten mit DurchverbindungenSpécification particulière d'agrément: Cartes imprimées multicouches souples avec connexions transversalesCapability Detail Specification: Flexible multilayer printed boards with through connections31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:CECC 23 800-801:1998SIST CECC 23 800-801:2002en01-maj-2002SIST
...

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