SIST EN 62326-20:2016

Printed boards - Part 20: Printed circuit board for high-brightness LEDs

This part of IEC 62326 specifies the properties of the printed circuit board (hereafter
described as PCB) for high-brightness LEDs. Many aspects of the PCB for high-brightness
LEDs are identical with those of ordinary PCBs, therefore, some aspects of this standard also
describe general aspects.

Leiterplatten - Teil 20: Elektronische Leiterplatte für Hochleistungs-LEDs

Cartes imprimées - Partie 20: Cartes de circuits imprimés destinées aux LED à haute luminosité

L'IEC 62326-20:2016 spécifie les propriétés des cartes de circuits imprimés (ci après dénommées PCB, Printed Circuit Board) destinées aux LED à haute luminosité. Les PCB destinées aux LED à haute luminosité partagent avec les PCB ordinaires de nombreux aspects. Certains aspects d'ordre général sont donc décrits dans la présente norme. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) la présente édition se concentre sur le contenu technique des cartes de circuits imprimés destinées aux diodes électroluminescentes (LED) à haute luminosité;
b) les figures relatives aux cartes de circuits imprimés destinées aux LED à haute luminosité ont été affinées.

Plošče tiskanih vezij - 20. del: Tiskana vezja za visoko sijave svetleče diode

Ta del standarda IEC 62326 določa lastnosti tiskanih vezij za visoko sijave svetleče diode. Številne lastnosti tiskanih vezij za visoko sijave svetleče diode so enake lastnostim običajnih tiskanih vezij, zato so v tem standardu zajete tudi splošne lastnosti.

General Information

• Status: Published
• Publication Date: 13-Jun-2016
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 23-May-2016
• Due Date: 28-Jul-2016
• Completion Date: 14-Jun-2016
• Ref Project: EN 62326-20:2016 - Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62326-20:2016
01-julij-2016
3ORãþHWLVNDQLKYH]LMGHO7LVNDQDYH]MD]DYLVRNRVLMDYHVYHWOHþHGLRGH
Printed boards - Part 20: Printed circuit board for high-brightness LEDs
Ta slovenski standard je istoveten z: EN 62326-20:2016
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 62326-20:2016 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62326-20:2016

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SIST EN 62326-20:2016


EUROPEAN STANDARD EN 62326-20

NORME EUROPÉENNE

EUROPÄISCHE NORM
May 2016
ICS 31.180

English Version
Printed boards - Part 20: Printed circuit boards for high-
brightness LEDs
(IEC 62326-20:2016)
Cartes imprimées - Partie 20: Cartes de circuits imprimés Leiterplatten - Teil 20: Elektronische Leiterplatte für
destinées aux LED à haute luminosité Hochleistungs-LEDs
(IEC 62326-20:2016) (IEC 62326-20:2016)
This European Standard was approved by CENELEC on 2016-03-09. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.



European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 62326-20:2016 E

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SIST EN 62326-20:2016
EN 62326-20:2016
European foreword
The text of document 91/1311/FDIS, future edition 1 of IEC 62326-20, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 62326-20:2016.

The following dates are fixed:
(dop) 2016-12-09
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2019-03-09
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 62326-20:2016 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-1 NOTE Harmonized as EN 60068-1.
IEC 60068-2-1 NOTE Harmonized as EN 60068-2-1.
IEC 60068-2-2 NOTE Harmonized as EN 60068-2-2.
IEC 60068-2-6 NOTE Harmonized as EN 60068-2-6.
IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20.
IEC 60068-2-21 NOTE Harmonized as EN 60068-2-21.
IEC 60068-2-30 NOTE Harmonized as EN 60068-2-30.
IEC 60068-2-38 NOTE Harmonized as EN 60068-2-38.
IEC 60068-2-53 NOTE Harmonized as EN 60068-2-53.
IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58.
IEC 60068-2-64 NOTE Harmonized as EN 60068-2-64.
IEC 60068-2-66 NOTE Harmonized as EN 60068-2-66.
IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78.
IEC 60068-2-80 NOTE Harmonized as EN 60068-2-80.
IEC 61189-1 NOTE Harmonized as EN 61189-1.
2

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SIST EN 62326-20:2016
EN 62326-20:2016
IEC 61189-2 NOTE Harmonized as EN 61189-2.
IEC 61189-11 NOTE Harmonized as EN 61189-11.
IEC 61189-3-913 NOTE Harmonized as EN 61189-3-913.
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1.
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2.
IEC 61190-1-3 NOTE Harmonized as EN 61190-1-3.
IEC 61249-2-8 NOTE Harmonized as EN 61249-2-8.
IEC 62137-1-3 NOTE Harmonized as EN 62137-1-3.
IEC 62137-1-4 NOTE Harmonized as EN 62137-1-4.
IEC 62326-1 NOTE Harmonized as EN 62326-1.
IEC 62326-4 NOTE Harmonized as EN 62326-4.
ISO 291 NOTE Harmonized as EN ISO 291.
ISO 2409 NOTE Harmonized as EN ISO 2409.
ISO 3599 NOTE Harmonized as EN ISO 3599.
ISO 3611 NOTE Harmonized as EN ISO 3611.
ISO 4957 NOTE Harmonized as EN ISO 4957.
ISO 291 NOTE Harmonized as EN ISO 291.
ISO 6906 NOTE Harmonized as EN ISO 6906.
ISO 8512-1 NOTE Harmonized as EN ISO 8512-1.
ISO 8512-2 NOTE Harmonized as EN ISO 8512-2.
ISO 9445-1 NOTE Harmonized as EN ISO 9445-1.
ISO 9453 NOTE Harmonized as EN ISO 9453.
ISO 9454-1 NOTE Harmonized as EN ISO 9454-1.
ISO 9455 (series) NOTE Harmonized as EN ISO 9455 (series).
ISO 13385-1 NOTE Harmonized as EN ISO 13385-1.
ISO 15184 NOTE Harmonized as EN ISO 15184.

3

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SIST EN 62326-20:2016
EN 62326-20:2016

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194 -  Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions
IEC 61189-3 2007 Test methods for electrical materials, EN 61189-3 2008
printed boards and other interconnection
structures and assemblies -- Part 3: Test
methods for interconnection structures
(printed boards)
IEC 61249-2-6 -  Materials for printed boards and other EN 61249-2-6 -
interconnecting structures -- Part 2-6:
Reinforced base materials, clad and unclad
- Brominated epoxide non-woven/woven E-
glass reinforced laminated sheets of
defined flammability (vertical burning test),
copper-clad
IEC 61249-2-7 -  Materials for printed boards and other EN 61249-2-7 -
interconnecting structures -- Part 2-7:
Reinforced base materials, clad and unclad
- Epoxide woven E-glass laminated sheet
of defined flammability (vertical burning
test), copper-clad
IEC 62878-1-1 -  Device embedded substrate - Generic EN 62878-1-1 -
specification - Test method

4

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SIST EN 62326-20:2016




IEC 62326-20

®


Edition 1.0 2016-02




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Printed boards –

Part 20: Printed circuit boards for high-brightness LEDs




Cartes imprimées –

Partie 20: Cartes de circuits imprimés destinées aux LED à haute luminosité

















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.180 ISBN 978-2-8322-3152-4



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62326-20:2016
– 2 – IEC 62326-20:2016 © IEC 2016
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references. 8
3 Terms, definitions and abbreviations . 8
3.1 Terms and definitions . 8
3.2 Abbreviations . 8
4 Classification and class of the printed circuit board for high-brightness LEDs . 9
5 Design rules and allowance . 10
5.1 Panel and board sizes . 10
5.1.1 Board size . 10
5.1.2 Allowance of dimensions . 11
5.1.3 Perforation and slit . 11
5.1.4 V-cut . 12
5.2 Total board thickness . 13
5.3 Holes . 14
5.3.1 Insertion holes and vias . 14
5.3.2 Datum hole . 16
5.3.3 Assembly hole (a through-hole without wall plating) . 16
5.4 Conductor . 17
5.4.1 Width of conductor pattern and its allowance . 17
5.4.2 Distance between conductors and its allowance . 17
5.4.3 Thickness of the insulating layer . 18
5.5 Printed contact . 18
5.5.1 Allowance of the distance between the centers of two adjacent printed
contacts . 18
5.5.2 Allowance of the terminal width of printed contacts . 19
5.5.3 Shift of the center of printed contacts on front and back sides of a board . 19
5.6 Land pattern . 20
5.6.1 Allowance of the distance between the centers of two lands . 20
5.6.2 Allowance of the width of a land . 20
5.6.3 Land diameter and its allowance for BGA/CSP . 21
5.7 Fiducial mark and mark for component positioning . 22
5.7.1 Typical form and size of the fiducial mark . 22
5.7.2 Dimensional allowance of fiducial mark and component positioning mark . 23
5.7.3 Position allowance of the component positioning mark . 23
5.8 Interlayer connection – Copper plating . 23
6 Quality . 24
6.1 Gap between conductor and the wall of a component insertion hole or a via . 24
6.2 Positional deviation between conductor layers of a multilayer board . 24
6.3 Minimum land width . 24
6.4 Surface treatment . 25
6.4.1 Gold plating for printed contact . 25
6.4.2 Other surface treatment . 26
6.5 Defects of solder resist . 26
6.6 Symbol mark . 28
6.6.1 General . 28

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SIST EN 62326-20:2016
IEC 62326-20:2016 © IEC 2016 – 3 –
6.6.2 Conductor surface . 28
6.6.3 Between conductors . 28
6.6.4 Defects within insulating layers . 29
6.6.5 Routing and drilling . 30
6.6.6 Conductor pattern . 30
6.7 Land . 30
6.8 Land of a land pattern . 31
6.9 Defects in a land for BGA/CSP mounting . 32
6.10 Printed contact . 32
7 Performance and test methods . 34
7.1 Resistance of conductors . 34
7.2 Current proof of conductor and plated through hole . 35
7.3 Observation of component mountings and vias . 36
7.3.1 Observation with standard conditions . 36
7.3.2 Observation after thermal shock test . 38
8 Marking, packaging and storage . 39
8.1 Marking on a product . 39
8.2 Marking on the package . 39
8.3 Packaging and storage . 40
8.3.1 Packaging . 40
8.3.2 Storage . 40
Annex A (informative) Classification and class of the PCB for high-brightness LEDs . 41
Bibliography . 46

Figure 1 – Example of a classification and its application . 10
Figure 2 – Board arrangement in a panel . 11
Figure 3 – Distances from the datum point to perforation and slit . 12
Figure 4 – Distance from the datum point to the V-cut . 12
Figure 5 – Allowance of position off-set of V-cuts on front and back surfaces . 13
Figure 6 – PWB board with symbol mark, solder resist, copper foil and plating . 13
Figure 7 – Positions of component insertion holes . 15
Figure 8 – Distance between the wall of a hole and the board edge . 15
Figure 9 – Wall of a hole and the minimum designed spacing to the inner conductor . 16
Figure 10 – Width of finished conductor . 17
Figure 11 – Distance between conductor and board edge . 18
Figure 12 – Thickness of the insulating layer . 18
Figure 13 – Distance between centers of terminals of printed contacts . 19
Figure 14 – Terminal width of a printed contact . 19
Figure 15 – Shift of the center of printed contacts on front and back sides of a board . 20
Figure 16 – Land pattern . 20
Figure 17 – Land width of a land pattern . 21
Figure 18 – Land diameter of BGA/CSP formed of a conductor only . 21
Figure 19 – Land diameter (d) of BGA/CSP formed at the opening of solder resist . 22
Figure 20 – Examples of fiducial mark and component positioning mark . 23
Figure 21 – Minimum land width . 25

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SIST EN 62326-20:2016
– 4 – IEC 62326-20:2016 © IEC 2016
Figure 22 – Exposure of conductor . 26
Figure 23 – Minimum land with caused by the shift of solder resist . 27
Figure 24 – Overlap, smear and shift of solder resist . 27
Figure 25 – Examples of smear or blur . 28
Figure 26 – Example of measling . 29
Figure 27 – Examples of crazing . 29
Figure 28 – Conductor nicks. 30
Figure 29 – Conductor residue . 30
Figure 30 – Land . 31
Figure 31 – Defects in a land of a land pattern. 31
Figure 32 – Defects in BGA/CSP mounting lands . 32
Figure 33 – Areas to be checked for defects of a printed contact . 33
Figure 34 – Defects in a printed contact . 33
Figure 35 – Relations between resistance and width, thickness and temperature of a
conductor . 35
Figure 36 – Relationship between current, conductor width and thickness and
temperature rise . 36
Figure 37 – Defect on a plating of a component hole . 37
Figure 38 – Resin smear . 38
Figure 39 – Corner crack . 38
Figure 40 – Barrel crack . 39
Figure 41 – Foil crack . 39
Figure A.1 – Relation between thermal conductive parameter and heat transfer
coefficient parameter . 42

Table 1 – Application and classification . 9
Table 2 – Panel dimensions . 11
Table 3 – Allowance of dimensions . 11
Table 4 – Allowance of the distances from the datum point to perforation and slit . 12
Table 5 – Allowance of the distance from the datum point to the center of the V-cut . 13
Table 6 – Total thickness and its allowance . 14
Table 7 – Allowance of holes for component insertion . 14
Table 8 – Position allowance of component insertion holes . 15
Table 9 – Distance between the wall of a hole and board edge . 16
Table 10 – Minimum clearance between the wall of a hole and the inner layer
conductor . 16
Table 11 – Allowance of conductor width . 17
Table 12 – Allowance of the distance between conductors . 18
Table 13 – Allowance of terminal width of a printed contact . 19
Table 14 – Allowance of terminal width of a printed contact . 20
Table 15 – Allowance of the width of a land of a land pattern . 21
Table 16 – Land diameter and its allowance for BGA/CSP . 22
Table 17 – Allowance of the land diameter (d) of BGA/CSP formed at the opening of
solder resist . 22

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SIST EN 62326-20:2016
IEC 62326-20:2016 © IEC 2016 – 5 –
Table 18 – Shapes and sizes of typical fiducial marks and component positioning
marks . 23
Table 19 – Minimum thickness of copper plating . 23
Table 20 – Minimum thickness of copper plating . 24
Table 21 – Minimum land width . 27
Table 22 – Overlap, smear and shift of solder resist over a fool print . 28
Table 23 – Allowance of the area of a defect, remaining width and protrusion of a land . 31
Table 24 – Defect of a land of a land pattern . 32
Table 25 – Defects in BGA/CSP mounting lands . 32
Table 26 – Defects in a printed contact . 34
Table 27 – Specification and test methods of resistance of conductors . 34
Table 28 – Specification and test methods of current proof . 35
Table 29 – Allowance in horizontal sectioning . 38
Table A.1 – Relation between thermal conductive parameter and heat transfer
coefficient parameter . 42
Table A.2 – Related test methods . 43

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SIST EN 62326-20:2016
– 6 – IEC 62326-20:2016 © IEC 2016
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

PRINTED BOARDS –

Part 20: Printed circuit boards for high-brightness LEDs

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62326-20 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This first edition cancels and replaces the IEC/PAS 62326-20 published in 2011, and
constitutes a technical revision.
This edition includes the following sig
...