EN 62326-20:2016

Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

IEC 62326-20:2016 specifies the properties of the printed circuit board (hereafter described as PCB) for high-brightness LEDs. Many aspects of the PCB for high-brightness LEDs are identical with those of ordinary PCBs, therefore, some aspects of this standard also describe general aspects. This edition includes the following significant technical changes with respect to the previous edition: a) this edition focuses on the technical content of the printed circuit board for high-brightness LEDs; b) the figures related to the printed circuit board for high-brightness LEDs have been refined.

Leiterplatten - Teil 20: Elektronische Leiterplatte für Hochleistungs-LEDs

Cartes imprimées - Partie 20: Cartes de circuits imprimés destinées aux LED à haute luminosité

L'IEC 62326-20:2016 spécifie les propriétés des cartes de circuits imprimés (ci après dénommées PCB, Printed Circuit Board) destinées aux LED à haute luminosité. Les PCB destinées aux LED à haute luminosité partagent avec les PCB ordinaires de nombreux aspects. Certains aspects d'ordre général sont donc décrits dans la présente norme. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) la présente édition se concentre sur le contenu technique des cartes de circuits imprimés destinées aux diodes électroluminescentes (LED) à haute luminosité; b) les figures relatives aux cartes de circuits imprimés destinées aux LED à haute luminosité ont été affinées.

Plošče tiskanih vezij - 20. del: Tiskana vezja za visoko sijave svetleče diode

Ta del standarda IEC 62326 določa lastnosti tiskanih vezij za visoko sijave svetleče diode. Številne lastnosti tiskanih vezij za visoko sijave svetleče diode so enake lastnostim običajnih tiskanih vezij, zato so v tem standardu zajete tudi splošne lastnosti.

General Information

• Status: Published
• Publication Date: 12-May-2016
• Withdrawal Date: 08-Mar-2019
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 13-May-2016
• Completion Date: 13-May-2016
• Ref Project: SIST EN 62326-20:2016 - Printed boards - Part 20: Printed circuit board for high-brightness LEDs

Standards Content (Sample)

SLOVENSKI STANDARD
01-julij-2016
3ORãþHWLVNDQLKYH]LMGHO7LVNDQDYH]MD]DYLVRNRVLMDYHVYHWOHþHGLRGH
Printed boards - Part 20: Printed circuit board for high-brightness LEDs
Ta slovenski standard je istoveten z: EN 62326-20:2016
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 62326-20

NORME EUROPÉENNE
EUROPÄISCHE NORM
May 2016
ICS 31.180
English Version
Printed boards - Part 20: Printed circuit boards for high-
brightness LEDs
(IEC 62326-20:2016)
Cartes imprimées - Partie 20: Cartes de circuits imprimés Leiterplatten - Teil 20: Elektronische Leiterplatte für
destinées aux LED à haute luminosité Hochleistungs-LEDs
(IEC 62326-20:2016) (IEC 62326-20:2016)
This European Standard was approved by CENELEC on 2016-03-09. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62326-20:2016 E
European foreword
The text of document 91/1311/FDIS, future edition 1 of IEC 62326-20, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 62326-20:2016.

The following dates are fixed:
(dop) 2016-12-09
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2019-03-09
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62326-20:2016 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-1 NOTE Harmonized as EN 60068-1.
IEC 60068-2-1 NOTE Harmonized as EN 60068-2-1.
IEC 60068-2-2 NOTE Harmonized as EN 60068-2-2.
IEC 60068-2-6 NOTE Harmonized as EN 60068-2-6.
IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20.
IEC 60068-2-21 NOTE Harmonized as EN 60068-2-21.
IEC 60068-2-30 NOTE Harmonized as EN 60068-2-30.
IEC 60068-2-38 NOTE Harmonized as EN 60068-2-38.
IEC 60068-2-53 NOTE Harmonized as EN 60068-2-53.
IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58.
IEC 60068-2-64 NOTE Harmonized as EN 60068-2-64.
IEC 60068-2-66 NOTE Harmonized as EN 60068-2-66.
IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78.
IEC 60068-2-80 NOTE Harmonized as EN 60068-2-80.
IEC 61189-1 NOTE Harmonized as EN 61189-1.
IEC 61189-2 NOTE Harmonized as EN 61189-2.
IEC 61189-11 NOTE Harmonized as EN 61189-11.
IEC 61189-3-913 NOTE Harmonized as EN 61189-3-913.
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1.
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2.
IEC 61190-1-3 NOTE Harmonized as EN 61190-1-3.
IEC 61249-2-8 NOTE Harmonized as EN 61249-2-8.
IEC 62137-1-3 NOTE Harmonized as EN 62137-1-3.
IEC 62137-1-4 NOTE Harmonized as EN 62137-1-4.
IEC 62326-1 NOTE Harmonized as EN 62326-1.
IEC 62326-4 NOTE Harmonized as EN 62326-4.
ISO 291 NOTE Harmonized as EN ISO 291.
ISO 2409 NOTE Harmonized as EN ISO 2409.
ISO 3599 NOTE Harmonized as EN ISO 3599.
ISO 3611 NOTE Harmonized as EN ISO 3611.
ISO 4957 NOTE Harmonized as EN ISO 4957.
ISO 291 NOTE Harmonized as EN ISO 291.
ISO 6906 NOTE Harmonized as EN ISO 6906.
ISO 8512-1 NOTE Harmonized as EN ISO 8512-1.
ISO 8512-2 NOTE Harmonized as EN ISO 8512-2.
ISO 9445-1 NOTE Harmonized as EN ISO 9445-1.
ISO 9453 NOTE Harmonized as EN ISO 9453.
ISO 9454-1 NOTE Harmonized as EN ISO 9454-1.
ISO 9455 (series) NOTE Harmonized as EN ISO 9455 (series).
ISO 13385-1 NOTE Harmonized as EN ISO 13385-1.
ISO 15184 NOTE Harmonized as EN ISO 15184.

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194 -  Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions
IEC 61189-3 2007 Test methods for electrical materials, EN 61189-3 2008
printed boards and other interconnection
structures and assemblies -- Part 3: Test
methods for interconnection structures
(printed boards)
IEC 61249-2-6 -  Materials for printed boards and other EN 61249-2-6 -
interconnecting structures -- Part 2-6:
Reinforced base materials, clad and unclad
- Brominated epoxide non-woven/woven E-
glass reinforced laminated sheets of
defined flammability (vertical burning test),
copper-clad
IEC 61249-2-7 -  Materials for printed boards and other EN 61249-2-7 -
interconnecting structures -- Part 2-7:
Reinforced base materials, clad and unclad
- Epoxide woven E-glass laminated sheet
of defined flammability (vertical burning
test), copper-clad
IEC 62878-1-1 -  Device embedded substrate - Generic EN 62878-1-1 -
specification - Test method
IEC 62326-20 ®
Edition 1.0 2016-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Printed boards –
Part 20: Printed circuit boards for high-brightness LEDs

Cartes imprimées –
Partie 20: Cartes de circuits imprimés destinées aux LED à haute luminosité

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-3152-4

– 2 – IEC 62326-20:2016 © IEC 2016
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references. 8
3 Terms, definitions and abbreviations . 8
3.1 Terms and definitions . 8
3.2 Abbreviations . 8
4 Classification and class of the printed circuit board for high-brightness LEDs . 9
5 Design rules and allowance . 10
5.1 Panel and board sizes . 10
5.1.1 Board size . 10
5.1.2 Allowance of dimensions . 11
5.1.3 Perforation and slit . 11
5.1.4 V-cut . 12
5.2 Total board thickness . 13
5.3 Holes . 14
5.3.1 Insertion holes and vias . 14
5.3.2 Datum hole . 16
5.3.3 Assembly hole (a through-hole without wall plating) . 16
5.4 Conductor . 17
5.4.1 Width of conductor pattern and its allowance . 17
5.4.2 Distance between conductors and its allowance . 17
5.4.3 Thickness of the insulating layer . 18
5.5 Printed contact . 18
5.5.1 Allowance of the distance between the centers of two adjacent printed
contacts . 18
5.5.2 Allowance of the terminal width of printed contacts . 19
5.5.3 Shift of the center of printed contacts on front and back sides of a board . 19
5.6 Land pattern . 20
5.6.1 Allowance of the distance between the centers of two lands . 20
5.6.2 Allowance of the width of a land . 20
5.6.3 Land diameter and its allowance for BGA/CSP . 21
5.7 Fiducial mark and mark for component positioning . 22
5.7.1 Typical form and size of the fiducial mark . 22
5.7.2 Dimensional allowance of fiducial mark and component positioning mark . 23
5.7.3 Position allowance of the component positioning mark . 23
5.8 Interlayer connection – Copper plating . 23
6 Quality . 24
6.1 Gap between conductor and the wall of a component insertion hole or a via . 24
6.2 Positional deviation between conductor layers of a multilayer board . 24
6.3 Minimum land width . 24
6.4 Surface treatment . 25
6.4.1 Gold plating for printed contact . 25
6.4.2 Other surface treatment . 26
6.5 Defects of solder resist . 26
6.6 Symbol mark . 28
6.6.1 General . 28

IEC 62326-20:2016 © IEC 2016 – 3 –
6.6.2 Conductor surface . 28
6.6.3 Between conductors . 28
6.6.4 Defects within insulating layers . 29
6.6.5 Routing and drilling . 30
6.6.6 Conductor pattern . 30
6.7 Land . 30
6.8 Land of a land pattern . 31
6.9 Defects in a land for BGA/CSP mounting . 32
6.10 Printe
...