SIST EN 60749-20:2010

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008)

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of
semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is
destructive.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme (IEC 60749-20:2008)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20: Résistance des CMS à boîtiers plastique à l'effet combiné de l'humidité et de la chaleur de brasage (IEC 60749-20:2008)

La CEI 60749-20:2008 fournit des moyens d'évaluer la résistance à la chaleur de brasage des semiconducteurs sous emballage comme les composants à boîtier plastique à montage en surface (CMS). Cet essai est destructif. Cette seconde édition annule et remplace la première édition publiée en 2002 et constitue une révision technique. Les principales modifications sont les suivantes:  - concilier certaines classifications de la CEI 60749-20 avec celles de l'IPC/JEDEC J-STD-020C;  - faire référence à la CEI 60749-35 à la place de l'annexe A de la CEI 60749-20 Edition 1;  - effectuer une mise à jour pour la brasure sans plomb;  - corriger certaines erreurs de l'Edition 1 originale.

Polprevodniške naprave - Metode za mehansko in klimatsko preskušanje - 20. del: Odpornost elementov SMD v plastičnih ohišjih proti kombiniranemu učinkovanju vlage in spajkalne vročine (IEC 60749-20:2008)

Ta del IEC 60749 predpisuje način ocenjevanja odpornosti polprevodnikov v obliki elementov SMD v plastičnih ohišjih proti spajkalni vročini. Ta preskus je uničujoč.

General Information

• Status: Withdrawn
• Publication Date: 15-Dec-2009
• Withdrawal Date: 12-Oct-2023
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 13-Oct-2023
• Due Date: 05-Nov-2023
• Completion Date: 13-Oct-2023
• Ref Project: EN 60749-20:2009 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Relations

• Replaces: SIST EN 60749-20:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
• Effective Date: 28-Jan-2023
• Replaces: SIST EN 60749-20:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
• Effective Date: 01-Jan-2010
• Replaced By: SIST EN IEC 60749-20:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN IEC 60749-20:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
• Effective Date: 13-Oct-2020
• Revised: SIST EN IEC 60749-20:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
• Effective Date: 16-Apr-2019
• Revised: SIST EN 60749-20:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
• Effective Date: 04-Sep-2012

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60749-20:2010
01-januar-2010
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SIST EN 60749-20:2004
3ROSUHYRGQLãNHQDSUDYH0HWRGH]DPHKDQVNRLQNOLPDWVNRSUHVNXãDQMHGHO
2GSRUQRVWHOHPHQWRY60'YSODVWLþQLKRKLãMLKSURWLNRPELQLUDQHPXXþLQNRYDQMX
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of
plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC
60749-20:2008)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20:
Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD)
gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme (IEC 60749-
20:2008)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
20: Résistance des CMS à boîtiers plastique à l'effet combiné de l'humidité et de la
chaleur de brasage (IEC 60749-20:2008)
Ta slovenski standard je istoveten z: EN 60749-20:2009
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-20:2010 en,fr
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-20:2010

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SIST EN 60749-20:2010

EUROPEAN STANDARD
EN 60749-20

NORME EUROPÉENNE
November 2009
EUROPÄISCHE NORM

ICS 31.080.01 Supersedes EN 60749-20:2003


English version


Semiconductor devices -
Mechanical and climatic test methods -
Part 20: Resistance of plastic encapsulated SMDs
to the combined effect of moisture and soldering heat
(IEC 60749-20:2008)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques - Prüfverfahren -
Partie 20: Résistance Teil 20: Beständigkeit kunststoffverkappter
des CMS à boîtiers plastique oberflächenmontierbarer Bauelemente
à l'effet combiné de l'humidité (SMD) gegenüber der kombinierten
et de la chaleur de brasage Beanspruchung von Feuchte
(CEI 60749-20:2008) und Lötwärme
(IEC 60749-20:2008)



This European Standard was approved by CENELEC on 2009-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: Avenue Marnix 17, B - 1000 Brussels


© 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-20:2009 E

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SIST EN 60749-20:2010
EN 60749-20:2009 – 2 –
Foreword
The text of document 47/1989/FDIS, future edition 2 of IEC 60749-20, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-20 on 2009-09-01.
This European Standard supersedes EN 60749-20:2003.
The main changes are as follows:
– to reconcile certain classifications of EN 60749-20 and those of IPC/JEDEC J-STD-020C;
– reference EN 60749-35 instead of Annex A of EN 60749-20:2003;
– update for lead-free solder;
– correct certain errors in EN 60749-20:2003.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2010-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2012-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-20:2008 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 60749-20:2010
– 3 – EN 60749-20:2009

Annex ZA
...