SIST EN IEC 63364-1:2023
(Main)Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection (IEC 63364-1:2022)
Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection (IEC 63364-1:2022)
This part of IEC 63364-1 provides terms, test method, and report of sound variation detection system based on IoT. It provides the evaluation method for each part of the sound variation detection system based on IoT in the block diagram, the characterization parameters, symbols, test setups and the conditions. In addition, this document defines the configuration items and criteria of standard space and firing situation for the quality evaluation measurement of sound field variation detection system with IoT.
Halbleiterbauelemente - Halbleiterbauelemente für IOT-Systeme - Teil 1: Prüfverfahren für die Erkennung von Schallschwankungen (IEC 63364-1:2022)
Dispositifs à semiconducteurs - Dispositifs à semiconducteurs pour système IDO - Partie 1: Méthode d’essai de détection de variation acoustique (IEC 63364-1:2022)
L’IEC 63364-1:2022 spécifie les termes, la méthode d’essai et le rapport du système de détection de variation acoustique basé sur l’IDO. Elle fournit la méthode d’évaluation pour chaque partie du système de détection de variation acoustique basé sur l’IDO dans le schéma de principe, les paramètres de caractérisation, les symboles, les montages d’essai et les conditions. En outre, le présent document définit les éléments de configuration et les critères de l’espace normalisé et de la situation d’application de flamme pour la mesure de l’évaluation de la qualité du système de détection de variation de champ acoustique avec IDO.
Polprevodniški elementi - Polprevodniški elementi za sistem IOT - 1. del: Preskusna metoda zaznavanja zvočnih variacij (IEC 63364-1:2022)
Ta del standarda IEC 63364-1 določa izraze, preskusno metodo in poročilo o sistemu za zaznavanje zvočnih sprememb na podlagi interneta stvari (IoT). Zagotavlja metodo vrednotenja za vsak del sistema za zaznavanje sprememb zvoka na podlagi interneta stvari v blokovni shemi, karakteristične parametre, simbole, preskusne nastavitve in pogoje. Poleg tega ta dokument opredeljuje elemente konfiguracije in merila standardne situacije prostora in rafala za meritve vrednotenja kakovosti sistema za zaznavanje sprememb zvočnega polja s pomočjo interneta stvari.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 63364-1:2023
01-april-2023
Polprevodniški elementi - Polprevodniški elementi za sistem IOT - 1. del:
Preskusna metoda zaznavanja zvočnih variacij (IEC 63364-1:2022)
Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of
sound variation detection (IEC 63364-1:2022)Halbleiterbauelemente - Halbleiterbauelemente für IOT-Systeme - Teil 1: Prüfverfahren
für die Erkennung von Schallschwankungen (IEC 63364-1:2022)Dispositifs à semiconducteurs - Dispositifs à semiconducteurs pour système IDO - Partie
1: Méthode d’essai de détection de variation acoustique (IEC 63364-1:2022)Ta slovenski standard je istoveten z: EN IEC 63364-1:2023
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN IEC 63364-1:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN IEC 63364-1:2023
EUROPEAN STANDARD EN IEC 63364-1
NORME EUROPÉENNE
EUROPÄISCHE NORM January 2023
ICS 31.080.99
English Version
Semiconductor devices - Semiconductor devices for IoT system
- Part 1: Test method of sound variation detection
(IEC 63364-1:2022)
Dispositifs à semiconducteurs - Dispositifs à Halbleiterbauelemente - Halbleiterbauelemente für IOT-
semiconducteurs pour système IDO - Partie 1: Méthode Systeme - Teil 1: Prüfverfahren für die Erkennung von
d'essai de détection de variation acoustique Schallschwankungen(IEC 63364-1:2022) (IEC 63364-1:2022)
This European Standard was approved by CENELEC on 2023-01-18. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 63364-1:2023 E---------------------- Page: 3 ----------------------
SIST EN IEC 63364-1:2023
EN IEC 63364-1:2023 (E)
European foreword
The text of document 47/2782/FDIS, future edition 1 of IEC 63364-1, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 63364-1:2023.The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2023-10-18
level by publication of an identical national standard or by endorsement• latest date by which the national standards conflicting with the (dow) 2026-01-18
document have to be withdrawnAttention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.Endorsement notice
The text of the International Standard IEC 63364-1:2022 was approved by CENELEC as a European
Standard without any modification.---------------------- Page: 4 ----------------------
SIST EN IEC 63364-1:2023
IEC 63364-1
Edition 1.0 2022-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Semiconductor devices for IoT system –
Part 1: Test method of sound variation detection
Dispositifs à semiconducteurs – Dispositifs à semiconducteurs pour système
IDO –
Partie 1: Méthode d’essai de détection de variation acoustique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-6214-6
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical CommissionMarque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 5 ----------------------
SIST EN IEC 63364-1:2023
– 2 – IEC 63364-1:2022 © IEC 2022
CONTENTS
FOREWORD ........................................................................................................................... 3
1 Scope .............................................................................................................................. 5
2 Normative references ...................................................................................................... 5
3 Terms and definitions ...................................................................................................... 5
4 Evaluation method and test setup .................................................................................... 6
4.1 General ................................................................................................................... 6
4.2 Equipment and tools ............................................................................................... 7
4.3 Block diagram and semiconductor components ....................................................... 7
4.3.1 General ........................................................................................................... 7
4.3.2 Microphone sensor .......................................................................................... 8
4.3.3 Speaker ........................................................................................................... 8
4.3.4 Micro controller ................................................................................................ 8
4.3.5 Transmitting module ........................................................................................ 8
4.4 Test methods .......................................................................................................... 8
4.4.1 Cubic box ........................................................................................................ 8
4.4.2 Measurement and data analysis .................................................................... 10
4.4.3 Evaluation method for the parts of sound variation detection system forIoT-based sound field detection ..................................................................... 11
4.5 Test report ............................................................................................................ 12
Figure 1 – Sound field space with boundary conditions and governing equation ...................... 6
Figure 2 – Variation of transfer function due to obstacles in security area ............................... 7
Figure 3 – Block diagram of the sound variation detection system for IoT-based event
detection ................................................................................................................................. 8
Figure 4 – Cubic box for experiment for sound field variation detection system ....................... 9
Figure 5 – Inner configuration within a cubic box .................................................................... 9
Figure 6 – Experimental SPL spectra in the 3 744 Hz – 4 256 Hz range with 4 Hz steps
in the cube ............................................................................................................................ 10
Figure 7 – FEM simulation of SPL spectra in the 3 744 Hz – 4 256 Hz range with 4 Hz
steps in the cube .................................................................................................................. 11
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IEC 63364-1:2022 © IEC 2022 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR DEVICES FOR IOT SYSTEM –
Part 1: Test method of sound variation detection
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 63364-1 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.The text of this International Standard is based on the following documents:
Draft Report on voting
47/2782/FDIS 47/2792/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.The language used for the development of this International Standard is English.
---------------------- Page: 7 ----------------------
SIST EN IEC 63364-1:2023
– 4 – IEC 63364-1:2022 © IEC 2022
This document was drafted in accor
...
SLOVENSKI STANDARD
oSIST prEN IEC 63364-1:2022
01-marec-2022
Polprevodniški elementi - Polprevodniški elementi za sistem IOT - 1. del:
Preskusna metoda zaznavanja zvočnih variacij
Semiconductor devices - Semiconductor devices for IOT system - Part 1: Test method of
sound variation detectionDispositifs à semiconducteurs - Dispositifs à semiconducteurs pour système IOT - Partie
1: Méthode d’essai de détection de variation acoustiqueTa slovenski standard je istoveten z: prEN IEC 63364-1:2021
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
oSIST prEN IEC 63364-1:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------oSIST prEN IEC 63364-1:2022
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oSIST prEN IEC 63364-1:2022
47/2742/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 63364-1 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2021-12-24 2022-03-18
SUPERSEDES DOCUMENTS:
47/2701/CD, 47/2741/CC
IEC TC 47 : SEMICONDUCTOR DEVICES
SECRETARIAT: SECRETARY:
Korea, Republic of Mr Cheolung Cha
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
ISO/IEC JTC 1/SC 41
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel votingThe attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which
they are aware and to provide supporting documentation.TITLE:
Semiconductor devices – Semiconductor devices for IOT system – Part 1: Test method of sound variation
detectionPROPOSED STABILITY DATE: 2027
NOTE FROM TC/SC OFFICERS:
At the WG 6 online meeting on 2021-10-05, the project leader presented a resolution on the CD document and
proceeding to the next stage (CDV) was approved.Copyright © 2021 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.---------------------- Page: 3 ----------------------
oSIST prEN IEC 63364-1:2022
IEC CDV 63364-1/Ed1 IEC (E) – 2 – 47/2742/CDV
1 CONTENTS
3 FOREWORD ........................................................................................................................... 3
4 1 Scope .............................................................................................................................. 5
5 2 Normative references ...................................................................................................... 5
6 3 Terms and definitions ...................................................................................................... 5
7 4 Evaluation method and test setup .................................................................................... 6
8 4.1 General ................................................................................................................... 6
9 4.2 Equipment and tools ............................................................................................... 6
10 4.3 Block diagram and semiconductor components ....................................................... 7
11 4.3.1 Microphone sensor .......................................................................................... 7
12 4.3.2 Speaker ........................................................................................................... 8
13 4.3.3 Micro controller ................................................................................................ 8
14 4.3.4 Transmitting module ........................................................................................ 8
15 4.4 Test methods .......................................................................................................... 8
16 4.4.1 Cubic box ........................................................................................................ 8
17 4.4.2 Measurement and data analysis ...................................................................... 9
18 4.4.3 Evaluation method for the parts of sound variation detection system for19 IoT-based sound field detection ..................................................................... 10
20 4.5 Test Report ........................................................................................................... 11
23 Figure 1 – Sound field space with boundary conditions and governing equation ...................... 6
24 Figure 2 - Variation of transfer function due to obstacles in security area: Speaker and
25 microphone are used to measure the transfer function of given space .................................... 7
26 Figure 3 - The block diagram of the sound variation detection system for IoT-based
27 event detection ....................................................................................................................... 7
28 Figure 4 – A cubic box for experiment for sound field variation detection system ………………8
29 Figure 5 – Inner configuration within a cubic box ……………………………………………………..930 Figure 6 – Experimental SPL spectra in the 1744–2256 Hz range with 4 Hz steps in the cube:
31 (hollow circle with a dotted line) before and (solid circle with a solid line) after a temperature
32 changing: (a) mic. #1, (b) mic. #2 ……………………………………………………………………….933 Figure 7 – FEM simulation of SPL spectra in the 1744–2256 Hz range with 4 Hz steps in the
34 cube: (dotted line) before and (solid line) after a temperature changing: (a) mic. #1, (b) mic. #2
35 ………………………………………………………………………………………………………………..10---------------------- Page: 4 ----------------------
oSIST prEN IEC 63364-1:2022
IEC CDV 63364-1/Ed1 IEC (E) – 3 – 47/2742/CDV
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
41 SEMICONDUCTOR DEVICES –
42 SEMICONDUCTOR DEVICES FOR IOT SYSTEM –
44 Part 1: Test method of sound variation detection
FOREWORD
48 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
49 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
50 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
51 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
52 Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
53 preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
54 may participate in this preparatory work. International, governmental and non-governmental organizations liaising
55 with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
56 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
57 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
58 consensus of opinion on the relevant subjects since each technical committee has representation from all
59 interested IEC National Committees.60 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
61 Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
62 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
63 misinterpretation by any end user.64 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
65 transparently to the maximum extent possible in their national and regional publications. Any divergence between
66 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
67 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
68 assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
69 services carried out by independent certification bodies.70 6) All users should ensure that they have the latest edition of this publication.
71 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
72 members of its technical committees and IEC National Committees for any personal injury, property damage or
73 other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
74 expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
75 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
76 indispensable for the correct application of this publication.77 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
78 rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 63364-1 has been prepared by IEC technical committee47:Semiconductor devices.
The text of this International Standard is based on the following documents:
CD Report on voting
47/XXXX/CD 47/XXXX/RVD
Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.The language used for the development of this International Standard is English.
86 This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in accordance
87 with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available at
88 www.iec.ch/members_experts/refdocs. The main document types developed by IEC are described in
89 greater detail at http://www.iec.ch/standardsdev/publications.---------------------- Page: 5 ----------------------
oSIST prEN IEC 63364-1:2022
IEC CDV 63364-1/Ed1 IEC (E) – 4 – 47/2742/CDV
91 The committee has decided that the contents of this document will remain unchanged until the stability
92 date indicated on the IEC website under webstore.iec.ch in the data related to the specific document.
93 At this date, the document will be95 • reconfirmed,
96 • withdrawn,
97 • replaced by a revised edition, or
98 • amended.
100
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oSIST prEN IEC 63364-1:2022
IEC CDV 63364-1/Ed1 IEC (E) – 5 – 47/2742/CDV
101 SEMICONDUCTOR DEVICES –
102
103 SEMICONDUCTOR DEVICES FOR IOT SYSTEM
104
105 Part 1: Test method of sound variation detection
106
107
108
1 Scope
109
This part of IEC 63364-1 provides terms, test method, and report of sound variation detection
110system based on IoT. It provides the evaluation method for each part of the sound variation
111detection system based on IoT in the block diagram, the characterization parameters, symbols,
112test setups and the conditions. In addition, this document defines t
...
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