SIST EN IEC 60747-15:2025

Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 60747-15:2024)

IEC 60747-15:2024 gives the requirements for isolated power semiconductor devices. These requirements are additional to those given in other parts of IEC 60747 for the corresponding non-isolated power devices and parts of IEC 60748 for ICs. This third edition includes the following significant technical changes with respect to the previous edition:
a) The intelligent power semiconductor modules (IPM), which was previously excluded from the first and second edition, is now included in this document (Annex C);
b) The thermal resistance is described for each switch (6.2.4);
c) Added isolation test between temperature sensor and terminals, in case there is an agreement with the user (6.1.2).

Halbleiterbauelemente - Einzel-Halbleiterbauelemente - Teil 15: Isolierte Leistungshalbleiter (IEC 60747-15:2024)

Dispositifs à semiconducteurs - Partie 15: Dispositifs discrets - Dispositifs de puissance à semiconducteurs isolés (IEC 60747-15:2024)

IEC 60747-15:2024 est disponible sous forme de IEC 60747-15:2024 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L'IEC 60747-15:2024 spécifie les exigences relatives aux dispositifs de puissance à semiconducteurs isolés. Ces exigences s’ajoutent à celles qui figurent dans d’autres parties de l’IEC 60747 pour les dispositifs de puissance non isolés correspondants et dans des parties de l’IEC 60748 pour les circuits intégrés. Cette troisième édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) les modules de puissance à semiconducteurs intelligents (IPM, Intelligent Power semiconductor Module), qui étaient auparavant exclus des première et deuxième éditions, sont désormais inclus dans le présent document (Annexe C);
b) la résistance thermique est décrite pour chaque interrupteur (6.2.4);
c) ajout d’un essai d’isolement entre le capteur de température et les bornes, en cas d’accord avec l’utilisateur (6.1.2).

Polprevodniški elementi - 15. del: Diskretni elementi - Izolirani močnostni polprevodniški elementi (IEC 60747-15:2024)

General Information

• Status: Published
• Public Enquiry End Date: 31-Oct-2023
• Publication Date: 08-Dec-2024
• ICS: 31.080.01 - Semiconductor devices in general
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 04-Dec-2024
• Due Date: 08-Feb-2025
• Completion Date: 09-Dec-2024
• Ref Project: EN IEC 60747-15:2024 - Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices

Relations

• Revises: SIST EN 60747-15:2012 - Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
• Effective Date: 23-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-januar-2025
Polprevodniški elementi - 15. del: Diskretni elementi - Izolirani močnostni
polprevodniški elementi (IEC 60747-15:2024)
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor
devices (IEC 60747-15:2024)
Halbleiterbauelemente - Einzel-Halbleiterbauelemente - Teil 15: Isolierte
Leistungshalbleiter (IEC 60747-15:2024)
Dispositifs à semiconducteurs - Partie 15: Dispositifs discrets - Dispositifs de puissance à
semiconducteurs isolés (IEC 60747-15:2024)
Ta slovenski standard je istoveten z: EN IEC 60747-15:2024
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 60747-15

NORME EUROPÉENNE
EUROPÄISCHE NORM November 2024
ICS 31.080.99 Supersedes EN 60747-15:2012
English Version
Semiconductor devices - Part 15: Discrete devices - Isolated
power semiconductor devices
(IEC 60747-15:2024)
Dispositifs à semiconducteurs - Partie 15: Dispositifs Halbleiterbauelemente - Einzel-Halbleiterbauelemente - Teil
discrets - Dispositifs de puissance à semiconducteurs isolés 15: Isolierte Leistungshalbleiter
(IEC 60747-15:2024) (IEC 60747-15:2024)
This European Standard was approved by CENELEC on 2024-11-26. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60747-15:2024 E

European foreword
The text of document 47E/832/FDIS, future edition 3 of IEC 60747-15, prepared by SC 47E "Discrete
semiconductor devices" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 60747-15:2024.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2025-11-30
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2027-11-30
document have to be withdrawn
This document supersedes EN 60747-15:2012 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60747-15:2024 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 60112:2020 NOTE Approved as EN IEC 60112:2020 (not modified)
IEC 61287-1:2014 NOTE Approved as EN 61287-1:2014 (not modified)
IEC 62368-1:2018 NOTE Approved as EN IEC 62368-1:2020 (not modified) +A11:2020
IEC 62477-1:2022 NOTE Approved as EN IEC 62477-1:2023 (not modified)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-1 2007 Environmental testing - Part 2-1: Tests - EN 60068-2-1 2001
Test A: Cold
IEC 60270 2000 High-voltage test techniques - Partial EN 60270 2001
discharge measurements
+ A1 2015  + A1 2016
IEC 60664-1 2020 Insulation coordination for equipment EN IEC 60664-1 2020
within low-voltage supply systems - Part 1:
Principles, requirements and tests
IEC 60721-3-3 2019 Classification of environmental conditions - EN IEC 60721-3-3 2019
Part 3-3: Classification of groups of
environmental parameters and their
severities - Stationary use at weather
protected locations
IEC 60747-1 2006 Semiconductor devices - Part 1: General - -
+ A1 2010  - -
IEC 60747-2 2016 Semiconductor devices - Discrete devices - -
and integrated circuits - Part 2: Rectifier
diodes
IEC 60747-6 2016 Semi conductor devices - Part 6: Thyristors - -
IEC 60747-7 2019 Semiconductor discrete devices and - -
integrated circuits - Part 7: Bipolar
transistors
IEC 60747-8 2021 Semiconductor devices - Part 8: Field- - -
effect transistors
IEC 60747-9 2019 Semiconductor devices - Discrete devices - - -
Part 9: Insulated-gate bipolar transistors
(IGBTs)
IEC 60748 series Semiconductor devices - Integrated circuits - -
IEC 60749-5 2017 Semiconductor devices - Mechanical and EN 60749-5 2017
climatic test methods - Part 5: Steady-state
temperature humidity bias life test
IEC 60749-6 2017 Semiconductor devices - Mechanical and EN 60749-6 2017
climatic test methods - Part 6: Storage at
high temperature
IEC 60749-10 2002 Semiconductor devices - Mechanical and EN 60749-10 2002
climatic test methods - Part 10: Mechanical
shock
IEC 60749-12 2017 Semiconductor devices - Mechanical and EN IEC 60749-12 2018
climatic test methods - Part 12: Vibration,
variable frequency
IEC 60749-15 2020 Semiconductor devices - Mechanical and EN IEC 60749-15 2020
climatic test methods - Part 15: Resistance
to soldering temperature for through-hole
mounted devices
IEC 60749-21 2011 Semiconductor devices - Mechanical and EN 60749-21 2011
climatic test methods - Part 21:
Solderability
IEC 60749-25 2003 Semiconductor devices - Mechanical and EN 60749-25 2003
climatic test methods - Part 25:
Temperature cycling
IEC 60749-34 2010 Semiconductor devices - Mechanical and EN 60749-34 2010
climatic test methods - Part 34: Power
cycling
IEC 60747-15 ®
Edition 3.0 2024-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 15: Discrete devices – Isolated power semiconductor devices

Dispositifs à semiconducteurs –

Partie 15: Dispositifs discrets – Dispositifs de puissance à semiconducteurs

isolés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99  ISBN 978-2-8322-9789-6

– 2 – IEC 60747-15:2024 © IEC 2024
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Letter symbols . 9
4.1 General . 9
4.2 Additional subscripts/symbols . 9
4.3 List of letter symbols . 9
4.3.1 Voltages and currents . 9
4.3.2 Mechanical symbols . 10
4.3.3 Other symbols . 10
5 Essential ratings (limiting values) and characteristics . 10
5.1 General . 10
5.2 Ratings (limiting values) . 10
5.2.1 Isolation voltage or isolation test voltage (V ) . 10
isol
5.2.2 Peak case non-rupture current (where appropriate) . 10
5.2.3 Terminal current (I ) (where appropriate) . 10
tRMS
5.2.4 Temperatures . 11
5.2.5 Mechanical ratings . 11
5.2.6 Climatic ratings (where appropriate) . 11
5.3 Characteristics . 12
5.3.1 Mechanical characteristics . 12
5.3.2 Parasitic inductance (L ). 12
p
5.3.3 Parasitic capacitances (C ) . 12
p
5.3.4 Partial discharge inception voltage (V or V ) (where appropriate) . 12
iM i(RMS)
5.3.5 Partial discharge extinction voltage (V or V ) (where

eM e(RMS)
appropriate) . 12
5.3.6 Thermal resistances . 12
5.3.7 Transient thermal impedance (Z ) . 13
th
6 Measurement methods . 13
6.1 Verification of isolation voltage rating . 13
6.1.1 Verification of isolation voltage rating between terminals and base plate
(V ) . 13
isol
6.1.2 Verification of isolation voltage rating between temperature sensor and
terminals (V ) . 15
isol1
6.2 Methods of measurement . 15
6.2.1 Partial discharge inception and extinction voltages (V ) (V ) . 15
i e
6.2.2 Parasitic inductance (L ). 15
p
6.2.3 Parasitic capacitance terminal to case (C ) . 17
p
6.2.4 Thermal characteristics . 18
7 Acceptance and reliability . 21
7.1 General requirements . 21
7.2 List of endurance tests . 21
7.3 Acceptance defining criteria . 21
7.4 Type tests and routine tests . 22

IEC 60747-15:2024 © IEC 2024 – 3 –
7.4.1 Type tests . 22
7.4.2 Routine tests . 23
Annex A (informative) Test method of peak case non-rupture current . 24
A.1 Purpose .
...