ASTM D5109-12
(Test Method)Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)
ABSTRACT
These test methods establish the standard procedures for testing copper-clad laminates produced from fiber-reinforced thermosetting polymeric materials intended for fabrication of printed wiring boards. The properties that these test methods shall examine are as follows: dielectric breakdown voltage parallel to laminations; dimensional instability; dissipation factor; flammability rating; flatwise flexural strength at room and elevated temperatures; behavior during oven blister test; peel strength at room and elevated temperatures; permittivity; pin holes and scratches in copper surface; purity of copper; behavior upong solder float test; solvent resistance; surface and volume resistivity; thickness; warp or twist; and water absorption.
SCOPE
1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
1.2 The procedures appear in the following sections:
Procedure
Section
Referenced Documents
2
Conditioning
4
Dielectric Breakdown Voltage Parallel to Laminations
13
Dimensional Instability
19
Dissipation Factor
14
Flammability Rating Test
16
Flexural Strength, Flatwise at Elevated Temperature
15
Flexural Strength, Flatwise at Room Temperature
15
Oven Blister Test
17
Peel Strength Test at Elevated Temperature
10
Peel Strength Test at Room Temperature
9
Permittivity
14
Pin Holes in Copper Surface
20
Purity of Copper
5
Scratches in Copper Surface
21
Solder Float Test
8
Solvent Resistance
7
Surface Resistivity
11
Volume Resistivity
11
Terminology
3
Thickness & Thickness Variation
18
Warp or Twist
6
Water Absorption
12
1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.
WITHDRAWN RATIONALE
These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
Formerly under the jurisdiction of Committee D09 on Electrical and Electronic Insulating Materials, these test methods were withdrawn in March 2020. This standard is being withdrawn without replacement because it is no longer being maintained.
General Information
Standards Content (Sample)
NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: D5109 − 12
Standard Test Methods for
Copper-Clad Thermosetting Laminates for Printed Wiring
1
Boards
This standard is issued under the fixed designation D5109; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope* 2. Referenced Documents
2
2.1 ASTM Standards:
1.1 These test methods cover the procedures for testing
D150 Test Methods forAC Loss Characteristics and Permit-
copper-clad laminates produced from fiber-reinforced, thermo-
tivity (Dielectric Constant) of Solid Electrical Insulation
setting polymeric materials intended for fabrication of printed
D229 Test Methods for Rigid Sheet and Plate Materials
wiring boards.
Used for Electrical Insulation
1.2 The procedures appear in the following sections:
D257 Test Methods for DC Resistance or Conductance of
Insulating Materials
Procedure Section
Referenced Documents 2
D374 Test Methods for Thickness of Solid Electrical Insu-
Conditioning 4
3
lation (Withdrawn 2013)
Dielectric Breakdown Voltage Parallel to Laminations 13
Dimensional Instability 19 D618 Practice for Conditioning Plastics for Testing
Dissipation Factor 14
D1531 Test Methods for Relative Permittivity (Dielectric
Flammability Rating Test 16
Constant) and Dissipation Factor by Fluid Displacement
Flexural Strength, Flatwise at Elevated Temperature 15
3
Flexural Strength, Flatwise at Room Temperature 15 Procedures (Withdrawn 2012)
Oven Blister Test 17
D1711 Terminology Relating to Electrical Insulation
Peel Strength Test at Elevated Temperature 10
D1825 Practice for Etching and Cleaning Copper-Clad Elec-
Peel Strength Test at Room Temperature 9
Permittivity 14 trical Insulating Materials and Thermosetting Laminates
3
Pin Holes in Copper Surface 20
for Electrical Testing (Withdrawn 2012)
Purity of Copper 5
D1867 Specification for Copper-Clad Thermosetting Lami-
Scratches in Copper Surface 21
Solder Float Test 8 nates for Printed Wiring
Solvent Resistance 7
D3636 Practice for Sampling and Judging Quality of Solid
Surface Resistivity 11
Electrical Insulating Materials
Volume Resistivity 11
Terminology 3 E53 Test Method for Determination of Copper in Unalloyed
Thickness & Thickness Variation 18
Copper by Gravimetry
Warp or Twist 6
Water Absorption 12 2.2 Other Standard:
NEMA Publication Number LI 1-1975 Test for Hot Peel
1.3 Metric units are the preferred units for these test
Strength of Copper-Clad Industrial Laminates for Printed
methods. Inch-pound units, where shown, are presented for
4
Circuits
information only.
1.4 This standard does not purport to address all of the
3. Terminology
safety concerns, if any, associated with its use. It is the
3.1 Definitions: Definitions of terms used in these test
responsibility of the user of this standard to establish appro-
methods are found in Terminology D1711.
priate safety and health practices and determine the applica-
3.2 Definitions of Terms Specific to This Standard:
bility of regulatory limitations prior to use. For specific hazard
statements, see 7.2.1, 8.1, and 11.3.1.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
1
These test methods are under the jurisdiction of ASTM Committee D09 on Standards volume information, refer to the standard’s Document Summary page on
Electrical and Electronic Insulating Materials and are the direct responsibility of the ASTM website.
3
Subcommittee D09.07 on Flexible and Rigid Insulating Materials. The last approved version of this historical standard is referenced on
Current edition approved Nov. 1, 2012. Published November 2012. Originally www.astm.org.
4
approved in 1990. Last previous edition approved in 2004 as D5109 – 99(2004). Available from National Electronic Manufacturer’sAssociation (NEMA), 2101
DOI: 10.1520/D5109-12. L St., NW, Washington, DC 20037.
*A Summary of Changes section appears at the end of this standard
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1
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D5109 − 12
3.2.1 blister, copper, n—a gas pocket (a void) located at the temperatures. It is important that such exposure not adversely
interface of the dielectric and the copper foil in a copper-clad affect the suitability of the dielectric portion of the laminate for
laminate. its intended use.
3.2.2 blister, core, n—a gas pocket (a void) located between
7.2 Procedure:
2
the laminations in the dielectric core of a copper-clad laminate. 7.2.1 Take a specimen of laminate of 10 to 40–cm area.
Etch all of the c
...
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