ASTM D4300-01
(Test Method)Standard Test Methods for Ability of Adhesive Films to Support or Resist the Growth of Fungi
Standard Test Methods for Ability of Adhesive Films to Support or Resist the Growth of Fungi
SCOPE
1.1 These test methods test the ability of adhesive films to inhibit or support the growth of selected fungal species growing on agar plates by providing means of testing the films on two agar substrates, one which promotes microbial growth, and one which does not.
1.2 These test methods are not appropriate for all adhesives. The activity of certain biocides may not be demonstrated by these test methods as a result of irreversible reaction with some of the medium constituents.
Note 1—As an example, quaternary ammonium compounds are inactivated by agar.
1.3 A test method is included for use with low-viscosity adhesives along with an alternative method for use with mastic-type adhesives. Also, a method approved by the government is given.
1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.
1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. These test methods are designed to be used by persons trained in correct microbiological techniques. Specific precautionary statements are given in Section 7 and in 14.3.2.
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Designation:D4300–01
Standard Test Methods for
Ability of Adhesive Films to Support or Resist the Growth of
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Fungi
This standard is issued under the fixed designation D 4300; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1. Scope* D 1286 Methods of Test for Effect of Mold Contamination
on Permanence of Adhesive Preparations and Adhesive
1.1 These test methods test the ability of adhesive films to
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Bonds
inhibit or support the growth of selected fungal species
G21 Practice for Determining Resistance of Synthetic
growing on agar plates by providing means of testing the films
Polymeric Materials to Fungi
on two agar substrates, one which promotes microbial growth,
2.2 TAPPI Method:
and one which does not.
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T487 Fungus Resistance for Paper and Paperboard
1.2 These test methods are not appropriate for all adhesives.
The activity of certain biocides may not be demonstrated by
3. Terminology
thesetestmethodsasaresultofirreversiblereactionwithsome
3.1 Definitions—Many terms in this test method are defined
of the medium constituents.
in Terminology D 907.
NOTE 1—As an example, quaternary ammonium compounds are inac-
3.2 Definitions of Terms Specific to This Standard:
tivated by agar.
3.2.1 adhesive preparation, n—the adhesive as packaged
1.3 A test method is included for use with low-viscosity
for distribution, storage, and use.
adhesives along with an alternative method for use with
3.2.2 adhesive film, n—the small portion of the adhesive
mastic-type adhesives. Also, a method approved by the gov-
preparation, as prepared for use by the consumer, either with
ernment is given.
additives or as received, which is cast on a substrate, cured 24
1.4 The values stated in SI units are to be regarded as the
h, and represents the glue line.
standard. The values given in parentheses are for information
3.2.2.1 Discussion—For purposes of these test methods the
only.
adhesive film is the thin layer of adhesive spread on either the
1.5 This standard does not purport to address all of the
21-mm fiberglass disk as described in 14.2, or the adhesive
safety concerns, if any, associated with its use. It is the
layer 3 mm thick which is cast on the tile squares as described
responsibility of the user of this standard to establish appro-
in 15.1.
priate safety and health practices and determine the applica-
3.2.3 zone of inhibition, n—the area on an inoculated agar
bility of regulatory limitations prior to use. These test methods
plate surrounding the adhesive-coated disk or tile, showing a
are designed to be used by persons trained in correct micro-
reduced fungal growth or an absence thereof.
biological techniques. Specific precautionary statements are
3.3 Abbreviations:
given in Section 7 and in 14.3.2.
3.3.1 PDA—potato dextrose agar.
3.3.2 MSA—mineral salts agar.
2. Referenced Documents
3.3.3 ZI—zone of inhibition.
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2.1 ASTM Standards:
4. Significance and Use
D 907 Terminology of Adhesives
4.1 These test methods are designed to be used to determine
the susceptibility of the adhesive film to biodegradation and
whether the adhesive will carry into the bond line sufficient
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These test methods are under the jurisdiction of ASTM Committee D14 on
anti-fungal properties to prevent growth of fungi frequently
Adhesives and are the direct responsibility of Subcommittee D14.30 on Wood
Adhesives.
present on the gluing equipment, on adherends, or in the
Current edition approved Oct. 10, 2001. Published December 2001. Originally
adhesive as applied.
published as D 4300 – 83. Last previous edition D 4300 – 98a. Replaces
D 1286 – 57 (1979).
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For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
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Standards volume information, refer to the standard’s Document Summary page on Withdrawn.
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the ASTM website. Available from TAPPI, P. O. Box 105113, Atlanta, GA 30348.
*A Summary of Changes section appears at the end of this standard.
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D4300–01
4.2 Potato dextrose agar (PDA) provides a complete me- 5.1.6 Glass Rods, 305 mm in length having a diameter of
dium for the growth of fungi, while mineral salts agar (MSA) 6.3 mm.
lacks a carbohydrate source and provides a less favorable 5.1.7 Glove Bag, 68 cm in length and width, 38 cm in
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medium. Use of PDA tests the adhesive film for its ability to height.
resist
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