Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für Halbleiterbauelemente

Normalisation mécanique des dispositifs à semiconducteurs - Partie 4: Système de codification et classification en formes des structures des boîtiers pour dispositifs à semiconducteurs

Standardizacija mehanskih lastnosti polprevodniških elementov - 4. del: Kodirni sistem in klasifikacija oblik okrovov polprevodniških elementov - Dopolnilo A1 (IEC 60191-4:2013/A1:2018)

General Information

Status
Published
Publication Date
17-May-2018
Withdrawal Date
30-Apr-2021
Current Stage
6060 - Document made available - Publishing
Start Date
18-May-2018
Completion Date
18-May-2018

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EN 60191-4:2014/A1:2018
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SLOVENSKI STANDARD
SIST EN 60191-4:2014/A1:2018
01-julij-2018
Standardizacija mehanskih lastnosti polprevodniških elementov - 4. del: Kodirni
sistem in klasifikacija oblik okrovov polprevodniških elementov - Dopolnilo A1
(IEC 60191-4:2013/A1:2018)
Mechanical standardization of semiconductor devices - Part 4: Coding system and
classification into forms of package outlines for semiconductor device packages (IEC
60191-4:2013/A1:2018)
Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für
Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für
Halbleiterbauelemente (IEC 60191-4:2013/A1:2018)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 4: Système de
codification et classification en formes des structures des boîtiers pour dispositifs à
semiconducteurs (IEC 60191-4:2013/A1:2018)
Ta slovenski standard je istoveten z: EN 60191-4:2014/A1:2018
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 60191-4:2014/A1:2018 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60191-4:2014/A1:2018

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SIST EN 60191-4:2014/A1:2018


EUROPEAN STANDARD EN 60191-4:2014/A1

NORME EUROPÉENNE

EUROPÄISCHE NORM
May 2018
ICS 31.080

English Version
Mechanical standardization of semiconductor devices - Part 4:
Coding system and classification into forms of package outlines
for semiconductor device packages
(IEC 60191-4:2013/A1:2018)
Normalisation mécanique des dispositifs à semiconducteurs Mechanische Normung von Halbleiterbauelementen - Teil
- Partie 4: Système de codification et classification en 4: Codierungssystem für Gehäuse und Eingruppierung der
formes des structures des boîtiers pour dispositifs à Gehäuse nach der Gehäuseform für Halbleiterbauelemente
semiconducteurs (IEC 60191-4:2013/A1:2018)
(IEC 60191-4:2013/A1:2018)
This amendment A1 modifies the European Standard EN 60191-4:2014; it was approved by CENELEC on 2018-05-01. CENELEC
members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this amendment the
status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This amendment exists in three official versions (English, French, German). A version in any other language made by translation under the
responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as
the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 60191-4:2014/A1:2018 E

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SIST EN 60191-4:2014/A1:2018
EN 60191-4:2014/A1:2018 (E)
European foreword
The text of document 47D/897/CDV, future edition 3 of IEC 60191-4:2013/A1, prepared by
IEC/TC 47D "Semiconductor devices packaging, of IEC technical committee 47: Semiconductor
devices" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as
EN 60191-4:2014/A1:2018.

The following dates are fixed:
• latest date by which the document has to be (dop) 2019-02-01
implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2021-05-01
• latest date by which the national
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 60191-4:2013/A1:2018 was approved by CENELEC as a
European Standard without any modification.

2

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SIST EN 60191-4:2014/A1:2018



IEC 60191-4

®


Edition 3.0 2018-0
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