EN 62258-1:2010

Semiconductor die products - Part 1: Procurement and use

IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including: - product identity, - product data, - die mechanical information, - test, quality, assembly and reliability information, - handling, shipping and storage information. The main changes that have been introduced in this edition have been to ensure consistency across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7 and IEC/TR 62258-8. New requirements include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8).

Halbleiter-Chip-Erzeugnisse – Teil 1: Beschaffung und Anwendung

Produits de puces de semiconducteurs - Partie 1: Approvisionnement et utilisation

La CEI 62258-1:2009 a été élaborée afin de faciliter la production, la fourniture et l'utilisation de produits de puces de semi-conducteurs, y compris: - lest tranches, - les puces nues isolées, - les puces et tranches munies de leurs structures de connexion, - les puces et tranches à encapsulation minimale ou partielle. Cette norme définit les exigences minimales applicables aux données nécessaires à la description desdits produits de puces et constitue une aide à la conception et à l'approvisionnement d'ensembles intégrant des produits de puces. Les exigences ainsi couvertes comprennent: - l'identification du produit, - les données du produit, - les informations mécaniques concernant les puces, - les informations concernant les essais, la qualité, l'assemblage et la fiabilité, - les informations relatives à la manifulation, à l'expédition et au stockage. Les principales modifications ayant été introduites dans la présente édition sont destinées à assurer la cohérence entre toutes les parties de la norme. L'ordre des paragraphes, notamment à l'Article 6, a été modifié de manière à être plus logique, et le texte de certaines des exigences, a été amendé de manière à ajouter les exigences relatives aux informations supplémentaires objet de la CEI/TR 62258-4, de la CEI/TR 62258-7 et de la CEI/TR 62258-8. Les nouvelles exigences comprennent les informations sur la permutabilité des bornes et des éléments fonctionnels (6.6.4) et surla sensibilité à l'humidité des dispositifs partiellement encapsulés (8.8).

Izdelki iz polprevodniških čipov - 1. del: Nabava in uporaba (IEC 62258-1:2009)

Ta del IEC 62258 je bil razvit, da olajšuje proizvodnjo, nabavo in uporabo izdelkov iz polprevodniških čipov, vključno s/z – ploščicami, -  individualnimi nepokritimi čipi – čipi in ploščicami s pritrjenimi povezovalnimi strukturami; - minimalno ali delno inkapsuliranimi čipi in ploščicami. Ta standard opredeljuje minimalne zahteve za podatke, ki so potrebni za opis teh izdelkov iz čipov, ter je namenjen v pomoč načrtovanju in naročevanju sklopov, ki vsebujejo izdelke iz čipov. Zajema zahteve za podatke, vključno s/z – prepoznavanje izdelka – podatke o izdelku – informacije o mehanskih lastnosti čipov – informacije o preskušanju, montaži in zanesljivosti – informacije o rokovanju, odpremi in shranjevanju. Zajema posebne zahteve za podatke, ki so potrebni za opis geometričnih lastnosti čipov, njihovih fizičnih lastnosti in načine povezave, ki so potrebni za njihovo uporabo pri razvoju in proizvodnji izdelkov. Prav tako v dodatkih zajema slovar in seznam skupnih akronimov.

General Information

• Status: Published
• Publication Date: 14-Oct-2010
• Withdrawal Date: 30-Sep-2013
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 15-Oct-2010
• Completion Date: 15-Oct-2010
• Ref Project: SIST EN 62258-1:2011 - Semiconductor die products - Part 1: Procurement and use (IEC 62258-1:2009)

Relations

• Replaces: EN 62258-1:2005 - Semiconductor die products - Part 1: Requirements for procurement and use
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-januar-2011
1DGRPHãþD
SIST EN 62258-1:2007
,]GHONLL]SROSUHYRGQLãNLKþLSRYGHO1DEDYDLQXSRUDED,(&
Semiconductor die products - Part 1: Procurement and use (IEC 62258-1:2009)
Halbleiter-Chip-Erzeugnisse - Teil 1: Beschaffung und Anwendung (IEC 62258-1:2009)
Produits de puces de semiconducteurs - Partie 1: Approvisionnement et utilisation (CEI
62258-1:2009)
Ta slovenski standard je istoveten z: EN 62258-1:2010
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 62258-1
NORME EUROPÉENNE
October 2010
EUROPÄISCHE NORM
ICS 31.080.99 Supersedes EN 62258-1:2005

English version
Semiconductor die products -
Part 1: Procurement and use
(IEC 62258-1:2009)
Produits de puces de semiconducteurs -  Halbleiter-Chip-Erzeugnisse -
Partie 1: Approvisionnement et utilisation Teil 1: Beschaffung und Anwendung
(CEI 62258-1:2009) (IEC 62258-1:2009)

This European Standard was approved by CENELEC on 2010-10-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62258-1:2010 E
Foreword
The text of document 47/1974/CDV, future edition 2 of IEC 62258-1, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62258-1 on 2010-10-01.
This European Standard supersedes EN 62258-1:2005.
The main changes that have been introduced in this issue have been to ensure consistency across all
parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be
more logical and the text of some of the requirements has been amended to add requirements on further
information as covered by CLC/TR 62258-4, CLC/TR 62258-7 and CLC/TR 62258-8. New requirements
include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity
for partially encapsulated devices (8.8).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2011-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2013-10-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62258-1:2009 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068 series NOTE  Harmonized in EN 60068 series (not modified).
IEC 60749-26 NOTE  Harmonized as EN 60749-26.
IEC 60749-27 NOTE  Harmonized as EN 60749-27.
IEC 61340-5-1 NOTE  Harmonized as EN 61340-5-1.
IEC 61340-5-2 NOTE  Harmonized as EN 61340-5-2.
IEC 61340-5-2 NOTE  Harmonized as EN 61340-5-2.
ISO 9000 NOTE  Harmonized as EN ISO 9000.
__________
- 3 - EN 62258-1:2010
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60050 Series International Electrotechnical Vocabulary - -
(IEV)
IEC 60191 Series Mechanical standardization of semiconductor EN 60191 Series
devices
IEC 60191-4 1999 Mechanical standardization of semiconductor EN 60191-4 1999
+ A1 2001 devices - + A1 2002
+ A2 2002 Part 4: Coding system and classification into + A2 2002
forms of package outlines for semiconductor
device packages
IEC 61360-1 - Standard data elements types with EN 61360-1 -
associated classification scheme for electric
items -
Part 1: Definitions - Principles and methods

IEC 62258-2 - Semiconductor die products - EN 62258-2 -
Part 2: Exchange data formats
IEC/TR 62258-3 - Semiconductor die products - CLC/TR 62258-3 -
Part 3: Recommendations for good practice in
handling, packing and storage
IEC/TR 62258-4 - Semiconductor die products - CLC/TR 62258-4 -
Part 4: Questionnaire for die users and
suppliers
IEC 62258-5 - Semiconductor die products - EN 62258-5 -
Part 5: Requirements for information
concerning electrical simulation

IEC 62258-6 - Semiconductor die products - EN 62258-6 -
Part 6: Requirements for information
concerning thermal simulation
IEC/TR 62258-7 - Semiconductor die products - CLC/TR 62258-7 -
Part 7: XML schema for data exhange

IEC/TR 62258-8 - Semiconductor die products - CLC/TR 62258-8 -
Part 8: EXPRESS model schema for data
exchange
ISO 14644-1 1999 Cleanrooms and associated controlled EN ISO 14644-1 1999
environments -
Part 1: Classification of air cleanliness

IEC 62258-1 ®
Edition 2.0 2009-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor die products –
Part 1: Procurement and use
Produits de puces de semiconducteurs –
Partie 1 : Approvisionnement et utilisation

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
X
CODE PRIX
ICS 31.080.99 ISBN 2-8318-1036-7
– 2 – 62258-1 © IEC:2009
CONTENTS
FOREWORD.5
INTRODUCTION.7
1 Scope.8
2 Normative references.8
3 Terms and definitions .9
3.1 Basic definitions .9
3.2 General terminology .10
3.3 Semiconductor manufacturing and interconnection terminology.12
4 General requirements .13
5 Data exchange .13
6 Requirements for all devices .14
6.1 Data package .14
6.1.1 General .14
6.1.2 Information source.14
6.1.3 Data version .14
6.1.4 Data exchange formats .14
6.2 Identity and source .14
6.2.1 General .14
6.2.2 Type number .14
6.2.3 Manufacturer .14
6.2.4 Supplier .14
6.2.5 Signature.14
6.3 Function .14
6.4 Physical characteristics .15
6.4.1 Semiconductor material .15
6.4.2 Technology.15
6.5 Ratings and limiting conditions.15
6.5.1 Power dissipation.15
6.5.2 Operating temperature .15
6.6 Connectivity.15
6.6.1 General .15
6.6.2 Terminal count.15
6.6.3 Terminal information .15
6.6.4 Permutability.16
6.7 Documentation .16
6.8 Form of supply.16
6.8.1 Physical form .16
6.8.2 Packing .16
6.9 Simulation and modelling .16
6.9.1 General .16
6.9.2 Electrical modelling and simulation.16
6.9.3 Thermal data and modelling.16
7 Requirements for bare die and wafers with or without connection structures .17
7.1 General .17
7.2 Identity .17
7.2.1 General .17

62258-1 © IEC:2009 – 3 –
7.2.2 Die name.17
7.2.3 Die version .17
7.3 Materials .17
7.3.1 Substrate material.17
7.3.2 Substrate connection .17
7.3.3 Backside detail .17
7.3.4 Passivation material.17
7.3.5 Metallisation .17
7.3.6 Terminal material.17
7.3.7 Terminal structure.18
7.3.8 Vias.18
7.4 Geometry .
...