EN 60191-4:2014

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition: a) Material code 'S' is added to indicate a silicon based package. b) Description of 'WL' is added to be used for general use.

Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für Halbleiterbauelemente

Normalisation mécanique des dispositifs à semiconducteurs - Partie 4: Système de codification et classification en formes des structures des boîtiers pour dispositifs à semiconducteurs

La CEI 60191-4:2013 spécifie une méthode pour la désignation des structures des boîtiers et pour la classification des formes des structures de boîtiers des dispositifs à semiconducteurs, ainsi qu'une méthode générale pour établir des codes de désignation descriptifs universels pour les boîtiers à semiconducteurs. Le code de désignation descriptif fournit un outil de communication utile mais n'intègre pas de contrôle permettant d'assurer l'interchangeabilité des boîtiers. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) Un matériau désigné par le code 'S' est ajouté pour indiquer un boîtier à base de silicium. b) La description de 'WL' qui est ajoutée est destinée à un usage général.

Standardizacija mehanskih lastnosti polprevodniških elementov - 4. del: Kodirni sistem in klasifikacija oblik okrovov polprevodniških elementov (IEC 60191-4:2013)

Ta del standarda IEC 60191 določa metodo za označevanje okrovov in klasifikacijo oblik okrovov polprevodniških elementov ter sistematično metodo za vzpostavitev univerzalnih opisnih oznak za polprevodniške elemente. Opisna oznaka je uporabno komunikacijsko orodje, vendar ne ponuja nadzora za zagotavljanje medsebojne zamenljivosti.

General Information

• Status: Published
• Publication Date: 20-Mar-2014
• Withdrawal Date: 13-Nov-2016
• ICS: 31.080 - Semiconductor devices
• Technical Committee: CLC/SR 47D - Mechanical standardization of semiconductor devices
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 21-Mar-2014
• Completion Date: 21-Mar-2014
• Ref Project: SIST EN 60191-4:2014 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Relations

• Replaces: EN 60191-4:1999/A1:2002 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 28-Jan-2023
• Replaces: EN 60191-4:1999/A2:2002 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 28-Jan-2023
• Replaces: EN 60191-4:1999 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 28-Jan-2023
• Amended By: EN 60191-4:2014/A1:2018 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• Effective Date: 23-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60191-4:2014
01-maj-2014
1DGRPHãþD
SIST EN 60191-4:2002
SIST EN 60191-4:2002/A1:2005
SIST EN 60191-4:2002/A2:2005
Standardizacija mehanskih lastnosti polprevodniških elementov - 4. del: Kodirni
sistem in klasifikacija oblik okrovov polprevodniških elementov (IEC 60191-4:2013)
Mechanical standardization of semiconductor devices - Part 4: Coding system and
classification into forms of package outlines for semiconductor device packages
Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für
Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für
Halbleiterbauelemente
Normalisation mécanique des dispositifs à semiconducteurs - Partie 4: Système de
codification et classification en formes des boîtiers pour dispositifs à semiconducteurs
Ta slovenski standard je istoveten z: EN 60191-4:2014
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 60191-4:2014 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60191-4:2014

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SIST EN 60191-4:2014


EUROPEAN STANDARD
EN 60191-4

NORME EUROPÉENNE
March 2014
EUROPÄISCHE NORM

ICS 31.080 Supersedes EN 60191-4:1999 + A1:2002 + A2:2002


English version


Mechanical standardization of semiconductor devices -
Part 4: Coding system and classification into forms of package outlines
for semiconductor device packages
(IEC 60191-4:2013)



Normalisation mécanique des dispositifs à Mechanische Normung von
semiconducteurs - Halbleiterbauelementen -
Partie 4: Système de codification et Teil 4: Codierungssystem für Gehäuse
classification en formes des boîtiers pour und Eingruppierung der Gehäuse nach
dispositifs à semiconducteurs der Gehäuseform für
(CEI 60191-4:2013) Halbleiterbauelemente
(IEC 60191-4:2013)





This European Standard was approved by CENELEC on 2013-11-14. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2014 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-4:2014 E

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SIST EN 60191-4:2014
EN 60191-4:2014 - 2 -
Foreword
The text of document 47D/837/FDIS, future edition 3 of IEC 60191-4, prepared by SC 47D,
Semiconductor devices packaging, of IEC TC 47, Semiconductor devices, was submitted to the IEC-
CENELEC parallel vote and was approved by CENELEC as EN 60191-4:2014.
The following dates were fixed:
– latest date by which the EN has to be implemented (dop) 2014-09-21
at national level by publication of an identical
national standard or by endorsement
– latest date by which the national standards conflicting (dow) 2016-11-14
with the EN have to be withdrawn
This European Standard supersedes EN 60191-4:1999 and its Amendments A1:2002 and A2:2002.
EN 60191-4:2014 includes the following significant changes with respect to EN 60191-4:1999:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.

Endorsement notice
The text of the International Standard IEC 60191-4:2013 was approved by CENELEC as a European
Standard with
...