EN 60749-30:2005

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30: Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor Zuverlässigkeitsprüfungen

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 30: Préconditionnement des composants pour montage en surface non hermétiques avant les essais de fiabilité

Etablit une procédure normalisée de détermination du préconditionnement pour les composants pour montage en surface (CMS) non hermétiques avant les essais de fiabilité. Cette méthode d'essai définit une refusion de préconditionnement pour les CMS à l'état solide non hermétiques représentative d'une opération de refusion de soudure multiple industrielle type. Il convient que les CMS soient soumis à la séquence de préconditionnement appropriée décrite dans ce document avant d'être soumis aux essais de fiabilité sur place spécifiques pour évaluer la fiabilité à long terme.

Polprevodniški elementi – Mehanske in klimatske preskusne metode – 30. del: Predkondicioniranje nehermetičnih elementov za površinsko namestitev pred preskušanjem zanesljivosti (IEC 60749-30:2005)

General Information

• Status: Withdrawn
• Publication Date: 28-Feb-2005
• Withdrawal Date: 31-Jan-2008
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 21-Sep-2023
• Completion Date: 21-Sep-2023
• Ref Project: SIST EN 60749-30:2005 - Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Relations

• Replaced By: EN IEC 60749-30:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• Effective Date: 27-Jan-2023
• Amended By: EN 60749-30:2005/A1:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 60749-30:2005

STANDARD
december 2005
Polprevodniški elementi – Mehanske in klimatske preskusne metode – 30.
del: Predkondicioniranje nehermetičnih elementov za površinsko namestitev
pred preskušanjem zanesljivosti (IEC 60749-30:2005)
Semiconductor devices – Mechanical and climatic test methods – Part 30:
Preconditioning of non-hermetic surface mount devices prior to reliability testing
(IEC 60749-30:2005)
ICS 31.080.01 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 60749-30
NORME EUROPÉENNE
EUROPÄISCHE NORM March 2005
ICS 31.080.01
English version
Semiconductor devices -
Mechanical and climatic test methods
Part 30: Preconditioning of non-hermetic surface mount devices
prior to reliability testing
(IEC 60749-30:2005)
Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques Prüfverfahren
Partie 30: Préconditionnement Teil 30: Behandlung nicht hermetisch
des composants pour montage verkappter oberflächenmontierbarer
en surface non hermétiques Bauelemente vor
avant les essais de fiabilité Zuverlässigkeitsprüfungen
(CEI 60749-30:2005) (IEC 60749-30:2005)

This European Standard was approved by CENELEC on 2005-02-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60749-30:2005 E
Foreword
The text of document 47/1790/FDIS, future edition 1 of IEC 60749-30, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-30 on 2005-02-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-11-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-02-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-30:2005 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 60749-30:2005
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
- 1) 2)
IEC 60749-4 Semiconductor devices - Mechanical and EN 60749-4 2002
climatic test methods
Part 4: Damp heat, steady state, highly
accelerated stress test (HAST)

1) 2)
IEC 60749-5 - Part 5: Steady-state temperature humidity EN 60749-5 2003
bias life test
1) 2)
IEC 60749-11 - Part 11: Rapid change of temperature - EN 60749-11 2002
Two-fluid-bath method
IEC 60749-20 2002 Part 20: Resistance of plastic- EN 60749-20 2003
encapsulated SMDs to the combined
effect of moisture and soldering heat

1) 2)
IEC 60749-24 - Part 24: Accelerated moisture resistance EN 60749-24 2004
- Unbiased HAST
IEC 60749-25 2003 Part 25: Temperature cycling EN 60749-25 2003

1) 2)
IEC 60749-33 - Part 33: Accelerated moisture resistance EN 60749-33 2004
- Unbiased autoclave
1)
Undated reference.
2)
Valid edition at date of issue.

NORME CEI
INTERNATIONALE IEC
60749-30
INTERNATIONAL
Première édition
STANDARD
First edition
2005-01
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques
et climatiques –
Partie 30:
Préconditionnement des composants
pour montage en surface non hermétiques
avant les essais de fiabilité
Semiconductor devices –
Mechanical and climatic test methods –
Part 30:
Preconditioning of non-hermetic surface
mount devices prior to reliability testing
 IEC 2005 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
CODE PRIX
Commission Electrotechnique Internationale PRICE CODE N
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
Pour prix, voir catalogue en vigueur
For price, see current catalogue

60749-30 ¤ IEC:2005 – 3 –
CONTENTS
FOREWORD.5
1 Scope .11
2 Normative references .11
3 General description .13
4 Test apparatus and materials.13
4.1 Moisture chamber.13
4.2 Solder equipment .13
4.3 Optical microscope .13
4.4 Electrical test equipment.13
4.5 Drying (bake) oven .15
4.6 Temperature cycle chamber (optional) .15
5 Procedure .15
5.1 General .15
5.2 Initial measurements.15
5.3 Temperature cycling (optional).15
5.4 Drying (bake out).15
5.5 Soak conditions for dry-packed SMDs .17
5.6 Method C for soak conditions for non-dry-packed SMDs in accordance with
IEC 60749-20 .19
5.7 Solder reflow .19
5.8 Flux application simulation (optional) .21
5.9 Final measurements .21
5.10 Applicable reliability tests .21
6 Summary.21
Table 1 – Moisture soak conditions for dry-packed SMDs (method A).17
Table 2 – Required soak times in hours for method B, conditions B2–B6
(MSL levels 3–6).19
Table 3 – Moisture soak conditions for non-dry-packed SMDs.19
Table 4 – Preconditioning sequence flows .23
Table 4a – Preconditioning sequence flow for method A (conditions A1/A2)
in accordance with IEC 60749-20 (dry-packed devices) .23
Table 4b – Preconditioning sequence flow for method B (conditions B1–B5)
in accordance with IEC 60749-20 (dry-packed devices) .25
Table 4c – Preconditioning sequence flow for conditions C and D in accordance
with IEC 60749-20 (non dry-packed devices) .27

60749-30 ¤ IEC:2005 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 30: Preconditioning of non-hermetic surface mount devices
prior to reliability testing
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as
“IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee
interested in the subject dealt with may participate in this preparatory work. International, governmental and
non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates
closely with the International Organization for Standardization (ISO) in accordance with conditions determined
by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of
IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other
IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-30 has been prepared by IEC technical committee 47:
Semiconductor devices.
This first edition cancels and replaces IEC/PAS 62182 published in 2000 and constitutes a
technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1790/FDIS 47/1798/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

60749-30 ¤ IEC:2005 – 7 –
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 60749 consists of the following parts, under the general title Semiconductor devices –
Mechanical and climatic test methods:
Part 1: General
Part 2
...