EN 61188-5-5:2007

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.

Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-5: Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Bauelemente mit Gullwing-Anschlüssen auf vier Seiten

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-5: Considérations sur les liaisons pistes-soudures - Composants à sorties en aile de mouette sur quatre côtés

La CEI 61188-5-5:2007 fournit des informations sur la géométrie des plages d'accueil utilisées pour la fixation en surface des composants électronique à sorties en aile de mouette sur quatre côtés. Le but des informations indiquées dans la présente norme est de fournir les dimensions, formes et tolérances appropriées des plages d'accueil pour montage en surface afin de garantir une surface suffisante pour le raccord de brasure, mais également pour permettre l'inspection, la mise en essai et les retouches des joints de brasure. Cette publication doit être lue conjointement avec la CEI 61188-5-1 :2002.

Tiskane plošče in sestavi tiskanih plošč - Načrtovanje in uporaba - 5-5. del: Zahteve za posamezne dele - Pregledovanje povezav (ploskev/stik) - Komponente z gull-wing vodili na štirih straneh (IEC 61188-5-5:2007)

General Information

• Status: Published
• Publication Date: 22-Nov-2007
• Withdrawal Date: 31-Oct-2010
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 23-Nov-2007
• Due Date: 23-Nov-2007
• Completion Date: 23-Nov-2007
• Ref Project: SIST EN 61188-5-5:2008 - Printed boards and printed board assemblies - Design and use -- Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

Standards Content (Sample)

SLOVENSKI STANDARD
01-junij-2008
7LVNDQHSORãþHLQVHVWDYLWLVNDQLKSORãþ1DþUWRYDQMHLQXSRUDEDGHO
=DKWHYH]DSRVDPH]QHGHOH3UHJOHGRYDQMHSRYH]DYSORVNHYVWLN.RPSRQHQWH
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Printed boards and printed board assemblies - Design and use - Part 5-5: Sectional
requirements - Attachment (land/joint) considerations - Components with gull-wing leads
on four sides
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-5:
Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Bauelemente mit Gullwing-
Anschlüssen auf vier Seiten
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-5:
Considérations sur les liaisons pistes-soudures - Composants a sorties en aile de
mouette sur quatre côtés
Ta slovenski standard je istoveten z: EN 61188-5-5:2007
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 61188-5-5
NORME EUROPÉENNE
November 2007
EUROPÄISCHE NORM
ICS 31.180
English version
Printed boards and printed board assemblies -
Design and use -
Part 5-5: Attachment (land/joint) considerations -
Components with gull-wing leads on four sides
(IEC 61188-5-5:2007)
Cartes imprimées et  Leiterplatten und Flachbaugruppen -
cartes imprimées équipées - Konstruktion und Anwendung -
Conception et utilisation - Teil 5-5: Betrachtungen zur Montage
Partie 5-5: Considérations (Anschlussfläche/Verbindung) -
sur les liaisons pistes-soudures - Bauelemente mit
Composants à sorties Gullwing-Anschlüssen
en aile de mouette sur quatre côtés auf vier Seiten
(CEI 61188-5-5:2007) (IEC 61188-5-5:2007)

This European Standard was approved by CENELEC on 2007-11-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61188-5-5:2007 E
Foreword
The text of document 91/704/FDIS, future edition 1 of IEC 61188-5-5, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61188-5-5 on 2007-11-01.
This standard is to be used in conjunction with EN 61188-5-1.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-08-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2010-11-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61188-5-5:2007 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-54 NOTE  Harmonized as EN 60068-2-54:2006 (not modified).
IEC 60068-2-58 NOTE  Harmonized as EN 60068-2-58:2004 (not modified).
IEC 61191-1 NOTE  Harmonized as EN 61191-1:1998 (not modified).
__________
- 3 - EN 61188-5-5:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1) 2)
IEC 61188-5-1 - Printed boards and printed board EN 61188-5-1 2002
assemblies - Design and use -
Part 5-1: Attachment (land/joint)
considerations - Generic requirements

1)
Undated reference.
2)
Valid edition at date of issue.

IEC 61188-5-5
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
Printed boards and printed board assemblies – Design and use –
Part 5-5: Attachment (land/joint) considerations – Components with gull-wing
leads on four sides
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
X
ICS 31.180 ISBN 2-8318-9342-9
– 2 – 61188-5-5 © IEC:2007(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope.7
2 Normative references .7
3 General information.7
3.1 General component description .7
3.2 Marking .7
3.3 Carrier packaging format .8
3.4 Process considerations .8
4 PQFP (square) .8
4.1 Field of application .8
4.2 Component descriptions .8
4.3 Component dimensions .9
4.4 Solder joint fillet design .13
4.5 Land pattern dimensions .14
5 PQFP (rectangular) .17
5.1 Field of application .17
5.2 Component descriptions .18
5.3 Component dimensions .19
5.4 Solder joint fillet design .19
5.5 Land pattern dimensions .21
6 PLQFP (square) .23
6.1 Field of application .23
6.2 Component descriptions .23
6.3 Component dimensions .24
6.4 Solder joint fillet design .26
6.5 Land pattern dimensions .28
7 PLQFP (rectangular) .31
7.1 Field of application .31
7.2 Component descriptions .31
7.3 Component dimensions .32
7.4 Solder joint fillet design .33
7.5 Land pattern dimensions .34
8 PTQFP (square) .35
8.1 Field of application .35
8.2 Component descriptions .35
8.3 Component dimensions .36
8.4 Solder joint fillet design .39
8.5 Land pattern dimensions .40

Figure 1 – PQFP (square).9
Figure 2 – PQFP (square) component dimensions .10
Figure 3 – Solder joint fillet design.14
Figure 4 – PQFP (square) land pattern dimensions.17

61188-5-5 © IEC:2007(E) – 3 –
Figure 5 – PQFP (rectangular) .18
Figure 6 – PQFP (rectangular) component dimensions .19
Figure 7 – Solder joint fillet design.21
Figure 8 – PQFP (rectangular) land pattern dimensions .22
Figure 9 – PLQFP (square) .23
Figure 10 – PLQFP (square) component dimensions .24
Figure 11 – Solder joint fillet design.28
Figure 12 – PLQFP (square) land pattern dimensions .31
Figure 13 – PLQFP (rectangular) .32
Figure 14 – PLQFP (rectangular) component dimensions.32
Figure 15 – Solder joint fillet design.34
Figure 16 – PLQFP (rectangular) land pattern dimensions .35
Figure 17 – PTQFP (square).36
Figure 18 – PTQFP component dimensions .37
Figure 19 – Solder joint fillet design.40
Figure 20 – PTQFP land pattern dimensions.42

– 4 – 61188-5-5 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-5: Attachment (land/joint) considerations –
Components with gull-wing leads on four sides

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation fro
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