Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage

IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 42: Lagerung bei Wärme und Feuchte

Dispositifs à semiconducteurs - Méthodes d’essais mécaniques et climatiques - Partie 42: Stockage de température et d'humidité

L'IEC 60749-42:2014 décrit une méthode d'essai pour évaluer l'endurance des dispositifs à semiconducteurs utilisés dans les environnements à température élevée et à forte humidité. Cette méthode d'essai est utilisée pour évaluer la résistance à la corrosion des interconnexions métalliques des puces des dispositifs à semiconducteurs sous boîtiers moulés en plastique ou contenus dans d'autres types de boîtiers. Elle est aussi utilisée comme moyen pour accélérer le phénomène de fuite dû à la pénétration d'humidité à travers le film de passivation et comme préconditionnement en vue de différents types d'essais.

Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 42. del: Shranjevanje pri določeni temperaturi in vlažnosti (IEC 60749-42:2014)

Ta del standarda IEC 60749 podaja preskusno metodo za ocenjevanje vzdržljivosti polprevodniških elementov, uporabljenih v okoljih z visoko temperaturo in visoko vlažnostjo. Ta preskusna metoda se uporablja za ocenjevanje vzdržljivosti proti koroziji kovinskih medsebojnih povezav čipov polprevodniških elementov na plastičnih modulih in drugih vrstah embalaže. Uporablja se tudi kot sredstvo za pospeševanje fenomena puščanja zaradi prodiranja vlage skozi pasivirano plast in kot predpriprava za različne preskuse.

General Information

Status
Published
Publication Date
02-Oct-2014
Drafting Committee
Current Stage
6060 - Document made available
Due Date
03-Oct-2014
Completion Date
03-Oct-2014

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SLOVENSKI STANDARD
SIST EN 60749-42:2014
01-december-2014
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Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature

humidity storage

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie

42: Stockage - Température et humidité
Ta slovenski standard je istoveten z: EN 60749-42:2014
ICS:
19.060 Mehansko preskušanje Mechanical testing
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-42:2014 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-42:2014
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SIST EN 60749-42:2014
EUROPEAN STANDARD EN 60749-42
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2014
ICS 31.080.01
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 42: Temperature and humidity storage
(IEC 60749-42:2014)

Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische

mécaniques et climatiques - Partie 42: Stockage de Prüfverfahren - Teil 42: Lagerung bei Wärme und Feuchte

température et d'humidité (IEC 60749-42:2014)
(CEI 60749-42:2014)

This European Standard was approved by CENELEC on 2014-09-16. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels

© 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN 60749-42:2014 E
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SIST EN 60749-42:2014
EN 60749-42:2014 - 2 -
Foreword

The text of document 47/2200/FDIS, future edition 1 of IEC 60749-42, prepared by IEC/TC 47

"Semiconductor devices." was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN 60749-42:2014.
The following dates are fixed:
(dop) 2015-06-16
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2017-09-16
• latest date by which the national
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such

patent rights.
Endorsement notice

The text of the International Standard IEC 60749-42:2014 was approved by CENELEC as a European

Standard without any modification.
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SIST EN 60749-42:2014
- 3 - EN 62056-9-7:2014
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are

indispensable for its application. For dated references, only the edition cited applies. For undated

references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:

www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60749-20 - Semiconductor devices - Mechanical and EN 60749-20 -
climatic test methods -- Part 20: Resistance
of plastic encapsulated SMDs to the
combined effect of moisture and soldering
heat
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SIST EN 60749-42:2014
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SIST EN 60749-42:2014
IEC 60749-42
Edition 1.0 2014-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 42: Temperature and humidity storage
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 42: Stockage de température et d'humidité
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX H
ICS 31.080.01 ISBN 978-2-8322-1785-6

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN 60749-42:2014
– 2 – IEC 60749-42:2014 © IEC 2014
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope .............................................................................................................................. 5

2 Normative references ...................................................................................................... 5

3 Test equipment ................................................................................................................ 5

3.1 Capacity of the equipment ...................................................................................... 5

3.2 Materials and construction of the thermostatic/humidistatic chamber ...................... 5

3.3 Water to be used in the test .................................................................................... 5

4 Procedure ........................................................................................................................ 5

4.1 Preconditioning ....................................................................................................... 5

4.2 Initial measurements ............................................................................................... 6

4.3 Tests ...................................................................................................................... 6

4.3.1 Inserting and removing specimens ................................................................... 6

4.3.2 Test conditions ................................................................................................ 6

4.3.3 Test duration ................................................................................................... 6

4.3.4 Post treatment ................................................................................................. 7

4.3.5 End-point measurement ................................................................................... 7

5 Failure criteria ................................................................................................................. 7

6 Information to be given in applicable procurement document ........................................... 8

Figure 1 – Unsaturated pressurized vapour test conditions profile........................................... 7

Table 1 – Temperature and humidity storage test conditions ................................................... 6

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SIST EN 60749-42:2014
IEC 60749-42:2014 © IEC 2014 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 42: Temperature and humidity storage
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

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governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate,
...

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