iTeh StandardsiTeh Standards
EURUSD
Your shopping cart is empty.
CLC

CLC/TR 62258-4:2007

(Main)

Semiconductor die products - Part 4: Questionnaire for die users and suppliers

Semiconductor die products - Part 4: Questionnaire for die users and suppliers

Superseded by CLC/TR 62258-4:2013 * IEC/TR published without FDIS stage

Halbleiter-Chip-Erzeugnisse - Teil 4: Fragebogen für Chip-Anwender und -Lieferanten

Produits à puce de semi-conducteur - Partie 4: Questionnaire pour les utilisateurs et les fournisseurs de puces

Izdelki s polprevodniškimi čipi – 4. del: Vprašalnik za uporabnike in dobavitelje čipov (IEC/TR 62258-4:2007)

General Information

Status
Withdrawn
Publication Date
04-Oct-2007
ICS
31.080.99 - Other semiconductor devices
Technical Committee
CLC/SR 47 - Semiconductor devices
Drafting Committee
IEC/TC 47 - IEC_TC_47
Parallel Committee
IEC/TC 47 - IEC_TC_47
Current Stage
9960 - Withdrawal effective - Withdrawal
Completion Date
11-Jan-2013
Ref Project
SIST-TP CLC/TR 62258-4:2008 - Semiconductor die products -- Part 4: Questionnaire for die users and suppliers

Relations

Replaced By
CLC/TR 62258-4:2013 - Semiconductor die products - Part 4: Questionnaire for die users and suppliers
Effective Date
28-Jan-2023

Buy Standard

TP CLC/TR 62258-4:2008 - + CD-ROM z vprašalnikom (Excel)TP CLC/TR 62258-4:2008 - + CD-ROM z vprašalnikom (Excel)
PreviousNext
Technical report
TP CLC/TR 62258-4:2008 - + CD-ROM z vprašalnikom (Excel)
English language
22 pages
sale 10% off
Preview
sale 10% off
Preview
e-Library read for
1 day

Standards Content (Sample)

SLOVENSKI STANDARD
SIST-TP CLC/TR 62258-4:2008
01-januar-2008
,]GHONLVSROSUHYRGQLãNLPLþLSL±GHO9SUDãDOQLN]DXSRUDEQLNHLQGREDYLWHOMH
þLSRY ,(&75
Semiconductor die products - Part 4: Questionnaire for die users and suppliers (IEC/TR
62258-4:2007)
Halbleiter-Chip-Erzeugnisse - Teil 4: Fragebogen für Chip-Anwender und -Lieferanten
(IEC/TR 62258-4:2007)
Produits a puce de semi-conducteur - Partie 4: Questionnaire pour les utilisateurs et les
fournisseurs de puces (IEC/TR 62258-4:2007)
Ta slovenski standard je istoveten z: CLC/TR 62258-4:2007
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST-TP CLC/TR 62258-4:2008 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

TECHNICAL REPORT
CLC/TR 62258-4

RAPPORT TECHNIQUE
October 2007
TECHNISCHER BERICHT

ICS 31.080.99


English version


Semiconductor die products -
Part 4: Questionnaire for die users and suppliers
(IEC/TR 62258-4:2007)


Produits à puce de semi-conducteur -  Halbleiter-Chip-Erzeugnisse -
Partie 4: Questionnaire Teil 4: Fragebogen für Chip-Anwender
pour les utilisateurs und -Lieferanten
et les fournisseurs de puces (IEC/TR 62258-4:2007)
(CEI/TR 62258-4:2007)






This Technical Report was approved by CENELEC on 2007-09-01.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland and the United Kingdom.





CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. CLC/TR 62258-4:2007 E

---------------------- Page: 2 ----------------------

CLC/TR 62258-4:2007 - 2 -
Foreword
The text of document 47/1884/DTR, future edition 1 of IEC/TR 62258-4, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC Parallel Unique Acceptance Procedure and
was approved by CENELEC as CLC/TR 62258-4 on 2007-09-01.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the Technical Report IEC/TR 62258-4:2007 was approved by CENELEC as a Technical Report
without any modification.
__________

---------------------- Page: 3 ----------------------

- 3 - CLC/TR 62258-4:2007
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year
IEC 60050 Series International Electrotechnical Vocabulary – –


IEC 62258-1 2005 Semiconductor die products - EN 62258-1 2005
Part 1: Requirements for procurement and
use


IEC 62258-2 2005 Semiconductor die products - EN 62258-2 2005
Part 2: Exchange data formats

---------------------- Page: 4 ----------------------

IEC/TR 62258-4
Edition 1.0 2007-08
TECHNICAL
REPORT

Semiconductor die products –
Part 4: Questionnaire for die users and suppliers


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
R
ICS 31.080.99 ISBN 2-8318-9281-3

---------------------- Page: 5 ----------------------

– 2 – TR 62258-4 © IEC:2007(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5

1 Scope.6
2 Normative references.6
3 Terms and definitions .6
4 General .6
5 Data exchange .
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.

This May Also Interest You

CLC
EN IEC 63364-1:2023(Main)
Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection
SIST EN IEC 63364-1:2023

This part of IEC 63364-1 provides terms, test method, and report of sound variation detection system based on IoT. It provides the evaluation method for each part of the sound variation detection system based on IoT in the block diagram, the characterization parameters, symbols, test setups and the conditions. In addition, this document defines the configuration items and criteria of standard space and firing situation for the quality evaluation measurement of sound field variation detection system with IoT.

  • Standard
    14 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 63373:2022(Main)
Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices
SIST EN IEC 63373:2022

In general, dynamic ON-resistance testing is a measure of charge trapping phenomena in GaN power transistors. This publication describes the guidelines for testing dynamic ON-resistance of GaN lateral power transistor solutions. The test methods can be applied to the following: a) GaN enhancement and depletion-mode discrete power devices [1] b) GaN integrated power solutions c) the above in wafer and package levels Wafer level tests are recommended to minimize parasitic effects when performing high precision measurements. For package level tests, the impact of package thermal characteristics should be considered so as to minimize any device under test (DUT) self-heating implications. The prescribed test methods may be used for device characterization, production testing, reliability evaluations and application assessments of GaN power conversion devices. This document is not intended to cover the underlying mechanisms of dynamic ON-resistance and its symbolic representation for product specifications.

  • Standard
    16 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 63244-1:2021(Main)
Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
SIST EN IEC 63244-1:2021

IEC 63244-1:2021 provides general requirements and specifications of the semiconductor devices for the performance and reliability evaluations of wireless power transfer and charging systems. For the performance evaluations, this part covers various characterization parameters and symbols, general system diagrams, and test setups and test conditions. This document also describes classifications of the wireless power transfer technologies.

  • Standard
    37 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 62969-4:2018(Main)
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors
SIST EN IEC 62969-4:2018

IEC 62969-4:2018 specifies a method of directly fault injection test for automotive semiconductor sensor interface that can be used to support the conformance assurance in the vehicle communications interface.

  • Standard
    21 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 62969-3:2018(Main)
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
SIST EN IEC 62969-3:2018

IEC 62969-3:2018 describes terms, definitions, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of mechanical shock driven piezoelectric energy harvesting devices for automotive vehicle sensor applications. This document is also applicable to energy harvesting devices for motorbikes, automobiles, buses, trucks and their respective engineering subsystems applications without any limitations of device technology and size.

  • Standard
    27 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 62969-2:2018(Main)
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
SIST EN IEC 62969-2:2018

IEC 62969-2:2018 specifies procedures and definitions for measuring the efficiency of the wireless power transmission system for the automotive vehicles sensors. This document deals with the power range below 500 mW.

  • Standard
    13 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 62969-1:2018(Main)
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
SIST EN IEC 62969-1:2018

IEC 62969-1:2017(E) provides general requirements for performance evaluations and environmental conditions for the power interface of automotive vehicle sensors. For performance evaluations, various electrical performances such as voltage drop from power source to automotive sensors, AC noises and voltage level are included. For environmental conditions, various test conditions such as temperature, humidity and vibration are included. In addition, terms, definitions, symbols and configurations are covered in this part.

  • Standard
    20 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
CLC/TR 62258-4:2013(Main)
Semiconductor die products - Part 4: Questionnaire for die users and suppliers
SIST-TP CLC/TR 62258-4:2013

IEC/TR 62258-4:2012 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers; - singulated bare die; - die and wafers with attached connection structures; - minimally or partially encapsulated die and wafers. This technical report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1:2009 and IEC 62258-2:2011 standards. It should be recognized that the tables contained in this technical report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fields. Different markets may require different subsets of the information requested herein. This edition includes the following significant technical changes with respect to the previous edition: The document checklist was changed to mirror IEC 62258-1:2009 requirements exactly.

  • Technical report
    21 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN 62258-2:2011(Main)
Semiconductor die products - Part 2: Exchange data formats
SIST EN 62258-2:2011

This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to - singulated bare die, - minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the EN 62258 series as well as definitions of all parameters used according to the principles and methods of EN 61360-1, EN 61360-2 and EN 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.

  • Standard
    73 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN 62047-4:2010(Main)
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
SIST EN 62047-4:2010

IEC 62047-4:2008 describes the generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as sensors, RF MEMS, excluding optical MEMS, bio MEMS, micro TAS, and power MEMS. This standard specifies general procedures for quality assessment to be used in IECQ-CECC systems and establishes general principles for describing and testing of electrical, optical, mechanical and environmental characteristics. IEC 62047-4:2008 aids in the preparation of standards that define devices and systems made by micromachining technology, including but not limited to, material characterization and handling, assembly and testing, process control and measuring methods. MEMS described in this standard are basically made of semiconductor material. However, the statements made in this standard are also applicable to MEMS using materials other than semiconductor, for example, polymers, glass, metals and ceramic materials.

  • Standard
    22 pages
    English language
    sale 10% off
    e-Library read for
    1 day