Semiconductor die products - Part 2: Exchange data formats

This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to - singulated bare die, - minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the EN 62258 series as well as definitions of all parameters used according to the principles and methods of EN 61360-1, EN 61360-2 and EN 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.

Halbleiter-Chip-Erzeugnisse - Teil 2: Datenaustausch-Formate

Produits de puces de semiconducteurs - Partie 2: Formats d'échange de données

This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to - singulated bare die, - minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the EN 62258 series as well as definitions of all parameters used according to the principles and methods of EN 61360-1, EN 61360-2 and EN 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.

Polprevodniški izdelki - 2. del: Izmenjava podatkovnih formatov

Ta del IEC 62258 določa podatkovne formate, ki se lahko uporabljajo pri izmenjavi podatkov, ki jo zajemajo drugi deli serije IEC 62258, in definicije vseh parametrov, ki se uporabljajo v skladu z načeli in metodami IEC 61360. Vpeljuje format izmenjave podatkov med napravami (DDX), katerega glavni namen je olajšati prenos ustreznih geometrijskih podatkov med proizvajalcem polprevodnikov in uporabnikom CAD/CAE, ter modele formalnih informacij, ki omogočajo izmenjavo podatkov v drugih formatih, kot je format fizične datoteke STEP, v skladu z ISO 10303-21, in XML. Podatkovni format je namenoma prožen, da omogoča uporabo zunaj tega začetnega obsega. Razvit je bil zato, da bi se olajšale proizvodnja, dobava in uporaba polprevodniških čipov, ki med drugim vključujejo: - ploščice, - posamične nepokrite čipe, - čipe in ploščice s pritrjenimi povezovalnimi strukturami, - minimalno ali delno inkapsulirane čipe in ploščice. Ta standard odraža podatkovni format DDX v različici 1.3.0.

General Information

Status
Published
Publication Date
07-Jul-2011
Withdrawal Date
28-Jun-2014
Drafting Committee
Parallel Committee
Current Stage
6060 - Document made available - Publishing
Start Date
08-Jul-2011
Completion Date
08-Jul-2011

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SLOVENSKI STANDARD
SIST EN 62258-2:2011
01-oktober-2011
Polprevodniški izdelki - 2. del: Izmenjava podatkovnih formatov
Semiconductor die products - Part 2: Exchange data formats
Halbleiter-Chip-Erzeugnisse - Teil 2: Datenaustausch-Formate
Produits à puce de semi-conducteur - Partie 2: Formats de données d'échange
Ta slovenski standard je istoveten z: EN 62258-2:2011
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN 62258-2:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62258-2:2011

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SIST EN 62258-2:2011

EUROPEAN STANDARD
EN 62258-2

NORME EUROPÉENNE
July 2011
EUROPÄISCHE NORM

ICS 31.080.99 Supersedes EN 62258-2:2005


English version


Semiconductor die products -
Part 2: Exchange data formats
(IEC 62258-2:2011)


Produits de puces de semiconducteurs -  Halbleiter-Chip-Erzeugnisse -
Partie 2: Formats d'échange de données Teil 2: Datenaustausch-Formate
(CEI 62258-2:2011) (IEC 62258-2:2011)





This European Standard was approved by CENELEC on 2011-06-29. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62258-2:2011 E

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SIST EN 62258-2:2011
EN 62258-2:2011 - 2 -
Foreword
The text of document 47/2085/FDIS, future edition 2 of IEC 62258-2, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62258-2 on 2011-06-29.
This European Standard supersedes EN 62258-2:2005.
With respect to EN 62258-2:2005, the following parameters have been updated for EN 62258-2:2011:

Subclause Parameter name

DEVICE_PICTURE_FILE
8.2.9
DEVICE_DATA_FILE
8.2.10
TERMINAL_GROUP
8.4.6
PERMUTABLE
8.4.7
TERMINAL_MATERIAL
8.5.1
(was DIE_TERMINAL_MATERIAL)
TERMINAL_MATERIAL_STRUCTURE
8.5.2
MAX_TEMP_TIME
8.6.2
SIMULATOR_simulator_TERM_GROUP
8.7.6
ASSEMBLY
8.8.3
WAFER_THICKNESS
8.9.2
WAFER_THICKNESS_TOLERANCE
8.9.3
WAFER_INK
8.9.9
BUMP_SHAPE
8.10.4
BUMP_SIZE
8.10.5
BUMP_SPECIFICATION_DRAWING
8.10.6
BUMP_ATTACHMENT_METHOD
8.10.7
MPD_MSL_LEVEL
8.11.4
MPD_PACKAGE_DRAWING
8.11.5
QUALITY
8.12.1
TEST
8.12.2
TEXT
8.13.1
PARSE
8.14.1

This standard shall be read in conjunction with EN 62258-1.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2012-03-29
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2014-06-29
Annex ZA has been added by CENELEC.
__________

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SIST EN 62258-2:2011
- 3 - EN 62258-2:2011
Endorsement notice
The text of the International Standard IEC 62258-2:2011 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 62258-2:2011
EN 62258-2:2011 - 4 -
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documen
...

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