Semiconductor die products - Part 2: Exchange data formats

This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to - singulated bare die, - minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the EN 62258 series as well as definitions of all parameters used according to the principles and methods of EN 61360-1, EN 61360-2 and EN 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.

Halbleiter-Chip-Erzeugnisse - Teil 2: Datenaustausch-Formate

Produits de puces de semiconducteurs - Partie 2: Formats d'échange de données

This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to - singulated bare die, - minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the EN 62258 series as well as definitions of all parameters used according to the principles and methods of EN 61360-1, EN 61360-2 and EN 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.

Polprevodniški izdelki - 2. del: Izmenjava podatkovnih formatov

Ta del IEC 62258 določa podatkovne formate, ki se lahko uporabljajo pri izmenjavi podatkov, ki jo zajemajo drugi deli serije IEC 62258, in definicije vseh parametrov, ki se uporabljajo v skladu z načeli in metodami IEC 61360. Vpeljuje format izmenjave podatkov med napravami (DDX), katerega glavni namen je olajšati prenos ustreznih geometrijskih podatkov med proizvajalcem polprevodnikov in uporabnikom CAD/CAE, ter modele formalnih informacij, ki omogočajo izmenjavo podatkov v drugih formatih, kot je format fizične datoteke STEP, v skladu z ISO 10303-21, in XML. Podatkovni format je namenoma prožen, da omogoča uporabo zunaj tega začetnega obsega. Razvit je bil zato, da bi se olajšale proizvodnja, dobava in uporaba polprevodniških čipov, ki med drugim vključujejo: - ploščice, - posamične nepokrite čipe, - čipe in ploščice s pritrjenimi povezovalnimi strukturami, - minimalno ali delno inkapsulirane čipe in ploščice. Ta standard odraža podatkovni format DDX v različici 1.3.0.

General Information

Status
Published
Publication Date
07-Jul-2011
Drafting Committee
Parallel Committee
Current Stage
6060 - Document made available
Due Date
08-Jul-2011
Completion Date
08-Jul-2011

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SLOVENSKI STANDARD
SIST EN 62258-2:2011
01-oktober-2011
Polprevodniški izdelki - 2. del: Izmenjava podatkovnih formatov
Semiconductor die products - Part 2: Exchange data formats
Halbleiter-Chip-Erzeugnisse - Teil 2: Datenaustausch-Formate
Produits à puce de semi-conducteur - Partie 2: Formats de données d'échange
Ta slovenski standard je istoveten z: EN 62258-2:2011
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN 62258-2:2011 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN 62258-2:2011
---------------------- Page: 2 ----------------------
SIST EN 62258-2:2011
EUROPEAN STANDARD
EN 62258-2
NORME EUROPÉENNE
July 2011
EUROPÄISCHE NORM
ICS 31.080.99 Supersedes EN 62258-2:2005
English version
Semiconductor die products -
Part 2: Exchange data formats
(IEC 62258-2:2011)
Produits de puces de semiconducteurs - Halbleiter-Chip-Erzeugnisse -
Partie 2: Formats d'échange de données Teil 2: Datenaustausch-Formate
(CEI 62258-2:2011) (IEC 62258-2:2011)

This European Standard was approved by CENELEC on 2011-06-29. CENELEC members are bound to comply

with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard

the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and notified

to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,

the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,

Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,

Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 62258-2:2011 E
---------------------- Page: 3 ----------------------
SIST EN 62258-2:2011
EN 62258-2:2011 - 2 -
Foreword

The text of document 47/2085/FDIS, future edition 2 of IEC 62258-2, prepared by IEC TC 47,

Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by

CENELEC as EN 62258-2 on 2011-06-29.
This European Standard supersedes EN 62258-2:2005.

With respect to EN 62258-2:2005, the following parameters have been updated for EN 62258-2:2011:

Subclause Parameter name
DEVICE_PICTURE_FILE
8.2.9
DEVICE_DATA_FILE
8.2.10
TERMINAL_GROUP
8.4.6
PERMUTABLE
8.4.7
TERMINAL_MATERIAL
8.5.1
(was DIE_TERMINAL_MATERIAL)
TERMINAL_MATERIAL_STRUCTURE
8.5.2
MAX_TEMP_TIME
8.6.2
SIMULATOR_simulator_TERM_GROUP
8.7.6
ASSEMBLY
8.8.3
WAFER_THICKNESS
8.9.2
WAFER_THICKNESS_TOLERANCE
8.9.3
WAFER_INK
8.9.9
BUMP_SHAPE
8.10.4
BUMP_SIZE
8.10.5
BUMP_SPECIFICATION_DRAWING
8.10.6
BUMP_ATTACHMENT_METHOD
8.10.7
MPD_MSL_LEVEL
8.11.4
MPD_PACKAGE_DRAWING
8.11.5
QUALITY
8.12.1
TEST
8.12.2
TEXT
8.13.1
PARSE
8.14.1
This standard shall be read in conjunction with EN 62258-1.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent

rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2012-03-29
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2014-06-29
Annex ZA has been added by CENELEC.
__________
---------------------- Page: 4 ----------------------
SIST EN 62258-2:2011
- 3 - EN 62258-2:2011
Endorsement notice

The text of the International Standard IEC 62258-2:2011 was approved by CENELEC as a European

Standard without any modification.
__________
---------------------- Page: 5 ----------------------
SIST EN 62258-2:2011
EN 62258-2:2011 - 4 -
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated

references, only the edition cited applies. For undated references, the latest edition of the referenced

document (including any amendments) applies.

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD

applies.
Publication Year Title EN/HD Year
IEC 61360-4 2005 Standard data element types with associated EN 61360-4 2005
classification scheme for electric components - + corr. December 2005
Part 4: IEC reference collection of standard
data element types and component classes
IEC 62258-1 - Semiconductor die products - EN 62258-1 -
Part 1: Procurement and use
ISO 6093 1985 Information processing - Representation of - -
numerical values in character strings for
information interchange
ISO 8601 2004 Data elements and interchange formats - - -
Information interchange - Representation of
dates and times
ISO 10303-21 2002 Industrial automation systems and integration - -
- Product data representation and exchange -
Part 21: Implementation methods: Clear text
encoding of the exchange structure
IPC/JEDEC 2007 Handling, Packing, Shipping and Use of - -
J-STD-033B Moisture/Reflow Sensitive Surface Mount
Devices
---------------------- Page: 6 ----------------------
SIST EN 62258-2:2011
IEC 62258-2
Edition 2.0 2011-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor die products –
Part 2: Exchange data formats
Produits de puces de semiconducteurs –
Partie 2: Formats d'échange de données
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX XB
ICS 31.080.99 ISBN 978-2-88912-496-1
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN 62258-2:2011
– 2 – 62258-2 © IEC:2011
CONTENTS

FOREWORD ........................................................................................................................... 5

INTRODUCTION ..................................................................................................................... 7

1 Scope and object .............................................................................................................. 8

2 Normative references........................................................................................................ 8

3 Terms and definitions ....................................................................................................... 9

4 Requirements ................................................................................................................... 9

5 Device Data eXchange format (DDX) file goals and usage................................................. 9

6 DDX file format and file format rules ................................................................................. 9

6.1 Data validity ........................................................................................................... 10

6.2 Character set ......................................................................................................... 10

6.3 SYNTAX RULES .................................................................................................... 10

7 DDX file content.............................................................................................................. 11

7.1 DDX file content rules ............................................................................................ 11

7.1.1 Block structure ........................................................................................... 11

7.1.2 Parameter types ........................................................................................ 11

7.1.3 Data types ................................................................................................. 11

7.1.4 Forward references .................................................................................... 12

7.1.5 Units .......................................................................................................... 12

7.1.6 Co-ordinate data ........................................................................................ 12

7.1.7 Reserved words ......................................................................................... 12

7.2 DDX DEVICE block syntax ..................................................................................... 13

7.3 DDX data syntax .................................................................................................... 14

8 Definitions of DEVICE block parameters ......................................................................... 14

8.1 BLOCK DATA ........................................................................................................ 15

8.1.1 DEVICE_NAME Parameter ........................................................................ 15

8.1.2 DEVICE_FORM Parameter ........................................................................ 16

8.1.3 BLOCK_VERSION Parameter .................................................................... 16

8.1.4 BLOCK_CREATION_DATE Parameter ....................................................... 16

8.1.5 VERSION Parameter ................................................................................. 16

8.2 DEVICE DATA ....................................................................................................... 16

8.2.1 DIE_NAME Parameter ............................................................................... 16

8.2.2 DIE_PACKAGED_PART_NAME Parameter ................................................ 16

8.2.3 DIE_MASK_REVISION Parameter ............................................................. 17

8.2.4 MANUFACTURER Parameter .................................................................... 17

8.2.5 DATA_SOURCE Parameter ....................................................................... 17

8.2.6 DATA_VERSION Parameter ...................................................................... 17

8.2.7 FUNCTION Parameter ............................................................................... 17

8.2.8 IC_TECHNOLOGY Parameter .................................................................... 18

8.2.9 DEVICE_PICTURE_FILE Parameter .......................................................... 18

8.2.10 DEVICE_DATA_FILE Parameter ................................................................ 18

8.3 GEOMETRIC DATA ............................................................................................... 19

8.3.1 GEOMETRIC_UNITS Parameter ................................................................ 19

8.3.2 GEOMETRIC_VIEW Parameter ................................................................. 19

8.3.3 GEOMETRIC_ORIGIN Parameter .............................................................. 19

8.3.4 SIZE Parameter ......................................................................................... 20

8.3.5 SIZE_TOLERANCE Parameter................................................................... 20

---------------------- Page: 8 ----------------------
SIST EN 62258-2:2011
62258-2 © IEC:2011 – 3 –

8.3.6 THICKNESS Parameter ............................................................................. 21

8.3.7 THICKNESS_TOLERANCE Parameter ....................................................... 21

8.3.8 FIDUCIAL_TYPE Parameter ...................................................................... 21

8.3.9 FIDUCIAL Parameter ................................................................................. 23

8.4 TERMINAL DATA .................................................................................................. 24

8.4.1 TERMINAL_COUNT Parameter .................................................................. 24

8.4.2 TERMINAL_TYPE_COUNT Parameter ....................................................... 24

8.4.3 CONNECTION_COUNT Parameter ............................................................ 24

8.4.4 TERMINAL_TYPE Parameter ..................................................................... 25

8.4.5 TERMINAL Parameter ............................................................................... 26

8.4.6 TERMINAL_GROUP Parameter ................................................................. 29

8.4.7 PERMUTABLE Parameter .......................................................................... 31

8.5 MATERIAL DATA .................................................................................................. 32

8.5.1 TERMINAL_MATERIAL Parameter ............................................................. 32

8.5.2 TERMINAL_MATERIAL_STRUCTURE Parameter ...................................... 32

8.5.3 DIE_SEMICONDUCTOR_MATERIAL Parameter ........................................ 32

8.5.4 DIE_SUBSTRATE_MATERIAL Parameter .................................................. 33

8.5.5 DIE_SUBSTRATE_CONNECTION Parameter ............................................ 33

8.5.6 DIE_PASSIVATION_MATERIAL Parameter ................................................ 33

8.5.7 DIE_BACK_DETAIL Parameter .................................................................. 34

8.6 ELECTRICAL AND THERMAL RATING DATA........................................................ 34

8.6.1 MAX_TEMP Parameter .............................................................................. 34

8.6.2 MAX_TEMP_TIME Parameter .................................................................... 34

8.6.3 POWER_RANGE Parameter ...................................................................... 34

8.6.4 TEMPERATURE_RANGE Parameter ......................................................... 34

8.7 SIMULATION DATA ............................................................................................... 35

8.7.1 Simulator MODEL FILE Parameter ............................................................. 35

8.7.2 Simulator MODEL FILE DATE Parameter ................................................... 35

8.7.3 Simulator NAME Parameter ....................................................................... 35

8.7.4 Simulator VERSION Parameter .................................................................. 35

8.7.5 Simulator COMPLIANCE Parameter ........................................................... 36

8.7.6 Simulator TERM_GROUP Parameter ......................................................... 36

8.8 HANDLING, PACKING, STORAGE and ASSEMBLY DATA ..................................... 36

8.8.1 DELIVERY_FORM Parameter .................................................................... 36

8.8.2 PACKING_CODE Parameter ...................................................................... 36

8.8.3 ASSEMBLY Parameters ............................................................................. 36

8.9 WAFER SPECIFIC DATA ...................................................................................... 37

8.9.1 WAFER_SIZE Parameter ........................................................................... 37

8.9.2 WAFER_THICKNESS Parameter ............................................................... 37

8.9.3 WAFER_THICKNESS_TOLERANCE Parameter ......................................... 37

8.9.4 WAFER_DIE_STEP_SIZE Parameter ......................................................... 38

8.9.5 WAFER_GROSS_DIE_COUNT Parameter ................................................. 38

8.9.6 WAFER_INDEX Parameter ........................................................................ 38

8.9.7 WAFER_RETICULE_STEP_SIZE Parameter.............................................. 38

8.9.8 WAFER_RETICULE_GROSS_DIE_COUNT Parameter .............................. 39

8.9.9 WAFER_INK Parameters ........................................................................... 39

8.10 BUMP TERMINATION SPECIFIC DATA ................................................................. 39

8.10.1 BUMP_MATERIAL Parameter .................................................................... 39

---------------------- Page: 9 ----------------------
SIST EN 62258-2:2011
– 4 – 62258-2 © IEC:2011

8.10.2 BUMP_HEIGHT Parameter ........................................................................ 40

8.10.3 BUMP_HEIGHT_TOLERANCE Parameter .................................................. 40

8.10.4 BUMP_SHAPE Parameter .......................................................................... 40

8.10.5 BUMP_SIZE Parameter ............................................................................. 40

8.10.6 BUMP_SPECIFICATION_DRAWING Parameter ......................................... 41

8.10.7 BUMP_ATTACHMENT_METHOD Parameter ............................................. 41

8.11 MINIMALLY PACKAGED DEVICE (MPD) SPECIFIC DATA ..................................... 41

8.11.1 MPD_PACKAGE_MATERIAL Parameter .................................................... 41

8.11.2 MPD_PACKAGE_STYLE Parameter .......................................................... 41

8.11.3 MPD_CONNECTION_TYPE Parameter ...................................................... 42

8.11.4 MPD_MSL_LEVEL Parameter .................................................................... 42

8.11.5 MPD_PACKAGE_DRAWING Parameter ..................................................... 42

8.12 QUALITY, RELIABILITY and TEST DATA .............................................................. 42

8.12.1 QUALITY Parameters ................................................................................ 42

8.12.2 TEST Parameters ...................................................................................... 43

8.13 OTHER DATA........................................................................................................ 43

8.13.1 TEXT Parameters ...................................................................................... 43

8.14 CONTROL DATA ................................................................................................... 43

8.14.1 PARSE Parameters ................................................................................... 43

Annex A (informative) An example of a DDX DEVICE block .................................................. 47

Annex B (informative) Groups and Permutation .................................................................... 49

Annex C (informative) A Typical CAD view from the DDX file block example given in

Annex A ................................................................................................................................ 52

Annex D (informative) Properties for Simulation .................................................................... 53

Annex E (informative) TERMINAL and TERMINAL_TYPE graphical usage for CAD/CAM

systems ................................................................................................................................ 55

Annex F (informative) Cross-reference with IEC 61360-4 ...................................................... 58

Annex G (informative) Notes on VERSION and NAME parameters ........................................ 61

Annex H (informative) Notes on WAFER parameters ............................................................ 62

Annex I (informative) Additional notes .................................................................................. 64

Annex J (informative) DDX Version history ........................................................................... 65

Annex K (informative) Parse Control ..................................................................................... 68

Figure 1 – Relationship between geometric centre and geometric origin ................................. 20

Figure C.1 – CAD representation of DDX example from Annex A ........................................... 52

Figure E.1 – Highlighting the MX and MY orientation properties ............................................. 56

Figure E.2 – Highlighting the angular rotational orientation properties .................................... 57

Figure H.1 – Illustrating the WAFER parameters .................................................................... 63

Table 1 – Terminal shape types ............................................................................................. 25

Table 2 – Terminal shape co-ordinates .................................................................................. 26

Table 3 – Terminal IO types .................................................................................................. 28

Table 4 – Substrate Connection Parameters .......................................................................... 33

Table F.1 – Parameter List .................................................................................................... 58

Table J.1 – Parameter Change History List ............................................................................ 65

---------------------- Page: 10 ----------------------
SIST EN 62258-2:2011
62258-2 © IEC:2011 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DIE PRODUCTS –
Part 2: Exchange data formats
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

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in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62258-2 has been prepared by IEC technical committee 47:

Semiconductor devices.
This standard shall be read in conjunction with IEC 62258-1.

This second edition cancels and replaces the first edition published in 2005, and constitutes a

technical revision.
---------------------- Page: 11 ----------------------
SIST EN 62258-2:2011
– 6 – 62258-2 © IEC:2011

With respect to the first edition, the following parameters have been updated for this edition:

Subclause Parameter name
DEVICE_PICTURE_FILE
8.2.9
DEVICE_DATA_FILE
8.2.10
TERMINAL_GROUP
8.4.6
PERMUTABLE
8.4.7
TERMINAL_MATERIAL
8.5.1
(was DIE_TERMINAL_MATERIAL)
TERMINAL_MATERIAL_STRUCTURE
8.5.2
MAX_TEMP_TIME
8.6.2
8.7.6 SIMULATOR_simulator_TERM_GROUP
ASSEMBLY
8.8.3
WAFER_THICKNESS
8.9.2
WAFER_THICKNESS_TOLERANCE
8.9.3
WAFER_INK
8.9.9
BUMP_SHAPE
8.10.4
BUMP_SIZE
8.10.5
BUMP_SPECIFICATION_DRAWING
8.10.6
BUMP_ATTACHMENT_METHOD
8.10.7
MPD_MSL_LEVEL
8.11.4
MPD_PACKAGE_DRAWING
8.11.5
QUALITY
8.12.1
TEST
8.12.2
TEXT
8.13.1
PARSE
8.14.1
The text of this standard is based on the following documents:
FDIS Report on voting
47/2085/FDIS 47/2095/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

The committee has decided that the contents of this publication will remain unchanged until the

stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to

the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 12 ----------------------
SIST EN 62258-2:2011
62258-2 © IEC:2011 – 7 –
INTRODUCTION

This International Standard is based on the work carried out in the ESPRIT 4 Framework

project GOODDIE which resulted in publication of the ES 59008 series of European

specifications. Organisations that helped prepare this document include the ESPRIT ENCAST

and ENCASIT projects, the Die Products Consortium, JEITA, JEDEC and ZVEI.

The structure of this International Standard as currently conceived is as follows:

Under main title: IEC 62258: Semiconductor die products
Part 1: Procurement and use
Part 2: Exchange data formats
Part 3: Recommendations for good practice in handling, packing and storage
(Technical report)
Part 4: Questionnaire for die users and suppliers (Technical report)
Part 5: Requirements for information concerning electrical simulation
Part 6: Requirements for information concerning thermal simulation
Part 7: XML schema for data exchange (Technical report)
Part 8: EXPRESS model schema for data exchange (Technical report)
Further parts may be added as required.
---------------------- Page: 13 ----------------------
SIST EN 62258-2:2011
– 8 – 62258-2 © IEC:2011
SEMICONDUCTOR DIE PRODUCTS –
Part 2: Exchange data formats
1 Scope and object

This Part of IEC 62258 specifies the data formats that may be used for the exchange of data

which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters

used according to the principles and methods of IEC 61360. It introduces a Device Data

Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric

data between die manufacturer and CAD/CAE user and formal information models that allow

data exchange in other formats such as STEP physical file format, in accordance with

ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage

beyond this initial scope.

It has been developed to facilitate the production, supply and use of semiconductor die

products, including but not limited to:
• wafers,
• singulated bare die,
• die and wafers with attached connection structures,
• minimally or partially encapsulated die and wafers.
This standard reflects the DDX data format at version 1.3.0
2 Normative references

The following referenced documents are indispensable for the application of this document. For

dated references, only the edition cited applies. For undated references, the latest

...

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