Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

IEC 60747-16-5:2013 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit oscillators. This standard is applicable to the fixed and voltage-controlled semiconductor microwave oscillator devices, except the oscillator modules such as synthesizers which require external controllers.

Halbleiterbauelemente - Teil 16-5: Integrierte Mikrowellenschaltkreise - Oszillatoren

Dispositifs à semiconducteurs - Partie 16-5: Circuits intégrés hyperfréquences - Oscillateurs

La CEI 60747-16-5:2013 spécifie la terminologie, les valeurs assignées et caractéristiques essentielles, et les méthodes de mesure des oscillateurs hyperfréquences à circuits intégrés. La présente norme s'applique aux dispositifs à oscillateurs hyperfréquences à semiconducteurs commandés par une tension, à l'exception des modules à oscillateurs tels que les synthétiseurs qui nécessitent des contrôleurs externes.

Polprevodniški elementi - 16-5. del: Mikrovalovna integrirana vezja - Oscilatorji (IEC 60747-16-5:2013)

Ta del standarda IEC 60747 določa terminologijo, bistvene vrednosti in lastnosti ter merilne metode za mikrovalovna integrirana vezja oscilatorjev. Ta standard se uporablja za fiksne napetostno krmiljene polprevodniške mikrovalovne oscilatorje, razen za module oscilatorjev, kot so sintetizatorji, ki zahtevajo zunanje krmilnike.

General Information

Status
Published
Publication Date
12-Sep-2013
Current Stage
6060 - Document made available
Due Date
13-Sep-2013
Completion Date
13-Sep-2013

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2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Polprevodniški elementi - 16-5. del: Mikrovalovna integrirana vezja - Oscilatorji (IEC 60747-16-5:2013)Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators31.200Integrirana vezja, mikroelektronikaIntegrated circuits. Microelectronics31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in generalICS:Ta slovenski standard je istoveten z:EN 60747-16-5:2013SIST EN 60747-16-5:2014en01-maj-2014SIST EN 60747-16-5:2014SLOVENSKI

STANDARD
SIST EN 60747-16-5:2014
EUROPEAN STANDARD EN 60747-16-5 NORME EUROPÉENNE
EUROPÄISCHE NORM September 2013

CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2013 CENELEC -

All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60747-16-5:2013 E
ICS 31.080.99
English version
Semiconductor devices -
Part 16-5: Microwave integrated circuits -
Oscillators (IEC 60747-16-5:2013)
Dispositifs à semiconducteurs -
Partie 16-5: Circuits intégrés hyperfréquences -
Oscillateurs (CEI 60747-16-5:2013)
Halbleiterbauelemente -
Teil 16-5: Integrierte Mikrowellenschaltkreise -
Oszillatoren (IEC 60747-16-5:2013)

This European Standard was approved by CENELEC on 2013-07-24. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

SIST EN 60747-16-5:2014
EN 60747-16-5:2013 - 2 -

Foreword The text of document 47E/452/FDIS, future edition 1 of IEC 60747-16-5, prepared by SC 47E, "Discrete semiconductor devices", of IEC TC 47, "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60747-16-5:2013. The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-04-24 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2016-07-24

Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60747-16-5:2013 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: IEC 60679-1:2007 NOTE

Harmonized as EN 60679-1:2007 (not modified).
SIST EN 60747-16-5:2014
- 3 - EN 60747-16-5:2013
Annex ZA
(normative)

Normative references to international publications with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.

NOTE

When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.

Publication Year Title EN/HD Year
IEC 60617 Data base Graphical symbols for diagrams - -
IEC 60747-1 + corr. August
+ A1 2006 2008 2010 Semiconductor devices -
Part 1: General - -
IEC 60747-4 2007 Semiconductor devices - Discrete devices -
Part 4: Microwave diodes and transistors - -
IEC 60747-16-3 + A1 2002 2009 Semiconductor devices -

Part 16-3: Microwave integrated circuits - Frequency converters EN 60747-16-3 + A1 2002 2009

IEC 61340-5-1 - Electrostatics -

Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements EN 61340-5-1 -

IEC/TR 61340-5-2 - Electrostatics -

Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide CLC/TR 61340-5-2 -

SIST EN 60747-16-5:2014
SIST EN 60747-16-5:2014

IEC 60747-16-5 Edition 1.0 2013-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices –

Part 16-5: Microwave integrated circuits – Oscillators
Dispositifs à semiconducteurs –
Partie 16-5: Circuits intégrés hyperfréquences – Oscillateurs

INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE X ICS 31.080.99 PRICE CODE CODE PRIX ISBN 978-2-83220-827-4

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale ®

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé. SIST EN 60747-16-5:2014

– 2 – 60747-16-5  IEC:2013 CONTENTS FOREWORD ........................................................................................................................... 6 1 Scope ............................................................................................................................... 8 2 Normative references ....................................................................................................... 8 3 Terms and definitions ....................................................................................................... 8 4 Essential ratings and characteristics ............................................................................... 11 4.1 General requirements ............................................................................................ 11 4.1.1 Circuit identification and types ................................................................... 11 4.1.2 General function description ...................................................................... 11 4.1.3 Manufacturing technology .......................................................................... 11 4.1.4 Package identification ................................................................................ 11 4.2 Application description .......................................................................................... 11 4.2.1 Conformance to system and/or interface information ................................. 11 4.2.2 Overall block diagram ................................................................................ 11 4.2.3 Reference data .......................................................................................... 11 4.2.4 Electrical compatibility ............................................................................... 12 4.2.5 Associated devices .................................................................................... 12 4.3 Specification of the function .................................................................................. 12 4.3.1 Detailed block diagram – Functional blocks ............................................... 12 4.3.2 Identification and function of terminals ....................................................... 12 4.3.3 Function description .................................................................................. 13 4.4 Limiting values (absolute maximum rating system) ................................................ 13 4.4.1 Requirements ............................................................................................ 13 4.4.2 Electrical limiting values ............................................................................ 14 4.4.3 Temperatures ............................................................................................ 14 4.5 Operating conditions (within the specified operating temperature range) ............... 15 4.6 Electrical characteristics ........................................................................................ 15 4.7 Mechanical and environmental ratings, characteristics and data ............................ 16 4.8 Additional information ............................................................................................ 16 5 Measuring methods ........................................................................................................ 16 5.1 General ................................................................................................................. 16 5.1.1 General precautions .................................................................................. 16 5.1.2 Characteristic impedance .......................................................................... 17 5.1.3 Handling precautions ................................................................................. 17 5.1.4 Types ........................................................................................................ 17 5.2 Oscillation frequency (fosc) ................................................................................... 17 5.2.1 Purpose ..................................................................................................... 17 5.2.2 Circuit diagram .......................................................................................... 17 5.2.3 Principle of measurement .......................................................................... 17 5.2.4 Circuit description and requirements .......................................................... 17 5.2.5 Precautions to be observed ....................................................................... 17 5.2.6 Measurement procedure ............................................................................ 18 5.2.7 Specified conditions .................................................................................. 18 5.3 Output power (Po,osc) ........................................................................................... 18 5.3.1 Purpose ..................................................................................................... 18 5.3.2 Circuit diagram .......................................................................................... 18 5.3.3 Principle of measurement .......................................................................... 18 SIST EN 60747-16-5:2014

60747-16-5  IEC:2013 – 3 – 5.3.4 Circuit description and requirements .......................................................... 18 5.3.5 Precautions to be observed ....................................................................... 18 5.3.6 Measurement procedure ............................................................................ 18 5.3.7 Specified conditions .................................................................................. 18 5.4 Phase noise (L (f)) ................................................................................................ 19 5.4.1 Purpose ..................................................................................................... 19 5.4.2 Measuring methods ................................................................................... 19 5.5 Tuning sensitivity (Sf,v) .......................................................................................... 24 5.5.1 Purpose ..................................................................................................... 24 5.5.2 Circuit diagram .......................................................................................... 24 5.5.3 Principle of measurement .......................................................................... 24 5.5.4 Circuit description and requirements .......................................................... 24 5.5.5 Precautions to be observed ....................................................................... 24 5.5.6 Measurement procedure ............................................................................ 24 5.5.7 Specified conditions .................................................................................. 24 5.6 Frequency pushing (fosc,push) .............................................................................. 24 5.6.1 Purpose ..................................................................................................... 24 5.6.2 Circuit diagram .......................................................................................... 25 5.6.3 Principle of measurement .......................................................................... 25 5.6.4 Circuit description and requirements .......................................................... 25 5.6.5 Precautions to be observed ....................................................................... 25 5.6.6 Measurement procedure ............................................................................ 25 5.6.7 Specified conditions .................................................................................. 25 5.7 Frequency pulling (fosc,pull) .................................................................................. 25 5.7.1 Purpose ..................................................................................................... 25 5.7.2 Circuit diagram .......................................................................................... 25 5.7.3 Principle of measurement .......................................................................... 26 5.7.4 Circuit description and requirements .......................................................... 26 5.7.5 Precautions to be observed ....................................................................... 26 5.7.6 Measurement procedure ............................................................................ 26 5.7.7 Specified conditions .................................................................................. 27 5.8 n-th order harmonic distortion ratio (Pnth/P1) ........................................................ 27 5.8.1 Purpose ..................................................................................................... 27 5.8.2 Circuit diagram .......................................................................................... 27 5.8.3 Principle of measurement .......................................................................... 27 5.8.4 Circuit description and requirements .......................................................... 27 5.8.5 Measurement procedure ............................................................................ 27 5.8.6 Specified conditions .................................................................................. 27 5.9 Output power flatness (∆Po,osc) ............................................................................ 28 5.9.1 Purpose ..................................................................................................... 28 5.9.2 Circuit diagram .......................................................................................... 28 5.9.3 Principle of measurement .......................................................................... 28 5.9.4 Circuit description and requirements .......................................................... 28 5.9.5 Precautions to be observed ....................................................................... 28 5.9.6 Measurement procedure ............................................................................ 28 5.9.7 Specified conditions .................................................................................. 28 5.10 Tuning linearity ...................................................................................................... 28 5.10.1 Purpose ..................................................................................................... 28 5.10.2 Circuit diagram .......................................................................................... 28 SIST EN 60747-16-5:2014

– 4 – 60747-16-5  IEC:2013 5.10.3 Principle of measurement .......................................................................... 29 5.10.4 Circuit description and requirements .......................................................... 29 5.10.5 Precautions to be observed ....................................................................... 29 5.10.6 Measurement procedure ............................................................................ 29 5.10.7 Specified conditions .................................................................................. 30 5.11 Frequency temperature coefficient (αf,temp) ......................................................... 30 5.11.1 Purpose ..................................................................................................... 30 5.11.2 Circuit diagram .......................................................................................... 30 5.11.3 Principle of measurement .......................................................................... 30 5.11.4 Circuit description and requirements .......................................................... 31 5.11.5 Precautions to be observed ....................................................................... 31 5.11.6 Measurement procedure ............................................................................ 31 5.11.7 Specified conditions .................................................................................. 31 5.12 Output power temperature coefficient (αP,temp).................................................... 31 5.12.1 Purpose ..................................................................................................... 31 5.12.2 Circuit diagram .......................................................................................... 31 5.12.3 Principle of measurement .......................................................................... 31 5.12.4 Circuit description and requirements .......................................................... 32 5.12.5 Precautions to be observed ....................................................................... 32 5.12.6 Measurement procedure ............................................................................ 32 5.12.7 Specified conditions .................................................................................. 32 5.13 Spurious distortion ratio (Ps/P1) ............................................................................ 32 5.13.1 Purpose ..................................................................................................... 32 5.13.2 Circuit diagram .......................................................................................... 32 5.13.3 Principle of measurement .......................................................................... 32 5.13.4 Circuit description and requirements .......................................................... 33 5.13.5 Measurement procedure ............................................................................ 33 5.13.6 Specified conditions .................................................................................. 33 5.14 Modulation bandwidth (Bmod)................................................................................ 33 5.14.1 Purpose ..................................................................................................... 33 5.14.2 Circuit diagram .......................................................................................... 33 5.14.3 Principle of measurement .......................................................................... 34 5.14.4 Circuit description and requirements .......................................................... 34 5.14.5 Precautions to be observed ....................................................................... 34 5.14.6 Measurement procedure ............................................................................ 34 5.14.7 Specified conditions .................................................................................. 35 5.15 Sensitivity flatness ................................................................................................ 35 5.15.1 Purpose ..................................................................................................... 35 5.15.2 Circuit diagram .......................................................................................... 35 5.15.3 Principle of measurement .......................................................................... 35 5.15.4 Circuit description and requirements .......................................................... 36 5.15.5 Precautions to be observed ....................................................................... 36 5.15.6 Measurement procedure ............................................................................ 36 5.15.7 Specified conditions .................................................................................. 36 6 Verifying methods ........................................................................................................... 36 6.1 Load mismatch tolerance (ΨL) ............................................................................... 36 6.1.1 Purpose ..................................................................................................... 36 6.1.2 Verifying method 1 (spurious intensity) ...................................................... 36 SIST EN 60747-16-5:2014

60747-16-5  IEC:2013 – 5 – 6.1.3 Verifying method 2 (no discontinuity of frequency tuning characteristics of VCO) .............................................................................. 37 6.2 Load mismatch ruggedness (ΨR) .......................................................................... 38 6.2.1 Purpose ..................................................................................................... 38 6.2.2 Circuit diagram .......................................................................................... 38 6.2.3 Circuit description and requirements .......................................................... 38 6.2.4 Precautions to be observed ....................................................................... 38 6.2.5 Test Procedure .......................................................................................... 38 6.2.6 Specified conditions .................................................................................. 39 Bibliography .......................................................................................................................... 40

Figure 1 – Circuit diagram for the measurement of the oscillation frequency fosc .................. 17 Figure 2 – Circuit diagram for the measurement of the phase noise L (f) (method 1) ............. 20 Figure 3 – Circuit diagram for the measurement of the phase noise L (f) (method 2) ............. 21 Figure 4 – Circuit diagram for the measurement of the phase noise L (f) (method 3) ............. 22 Figure 5 – Circuit diagram for the measurement of the frequency pulling fosc,pull ................ 26 Figure 6 – Tuning linearity .................................................................................................... 29 Figure 7 – Circuit diagram for the measurement of the oscillation frequency temperature coefficient αf,temp ............................................................................................ 30 Figure 8 – Circuit diagram for the measurement of the modulation bandwidth Bmod ............. 34 Figure 9 – Sensitivity flatness ............................................................................................... 36

Table 1 – Comparison of phase noise measuring methods .................................................... 19

SIST EN 60747-16-5:2014

– 6 – 60747-16-5  IEC:2013 INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________

SEMICONDUCTOR DEVICES –
Part 16-5: Microwave integrated circuits –
Oscillators

FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60747-16-5 has been prepared by subcommittee 47E: Discrete semiconductor devices, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47E/452/FDIS 47E/454/RVD

Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 60747 series, published under the general title Semiconductor devices, can be found on the IEC website. SIST EN 60747-16-5:2014

60747-16-5  IEC:2013 – 7 – The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be

• reconfirmed, • withdrawn, • replaced by a revised edition, or • amended.
SIST EN 60747-16-5:2014
– 8 – 60747-16-5  IEC:2013 SEMICONDUCTOR DEVICES –
Part 16-5: Microwave integrated circuits –
Oscillators

1 Scope This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit oscillators. This standard is applicable to the fixed and voltage-controlled semiconductor microwave oscillator devices, except the oscillator modules such as synthesizers which require external controllers. NOTE This document is not applicable to the quartz crystal controlled oscillators. They are specified by IEC 60679-1. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60617, Graphical symbols for diagrams (available from ) IEC 60747-1:2006, Semiconductor devices – Part

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