IEC/SC 47E - IEC_SC_47E
To prepare international standards for environmentally sound practice in the design, manufacture, use and reuse of discrete semiconductor devices. This includes terms and definitions, letter symbols, essential ratings and characteristics, measuring methods, and specifications.
IEC_SC_47E
To prepare international standards for environmentally sound practice in the design, manufacture, use and reuse of discrete semiconductor devices. This includes terms and definitions, letter symbols, essential ratings and characteristics, measuring methods, and specifications.
General Information
IEC 60747-15:2024 gives the requirements for isolated power semiconductor devices. These requirements are additional to those given in other parts of IEC 60747 for the corresponding non-isolated power devices and parts of IEC 60748 for ICs. This third edition includes the following significant technical changes with respect to the previous edition: a) The intelligent power semiconductor modules (IPM), which was previously excluded from the first and second edition, is now included in this document (Annex C); b) The thermal resistance is described for each switch (6.2.4); c) Added isolation test between temperature sensor and terminals, in case there is an agreement with the user (6.1.2).
- Standard61 pagesEnglish languagesale 10% offe-Library read for1 day
This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit limiters.
- Standard39 pagesEnglish languagesale 10% offe-Library read for1 day
This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit attenuators.
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IEC 6074716-6:2019 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.
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IEC 60747-17:2020(E) specifies the terminology, essential ratings, characteristics, safety test and the measuring methods of magnetic coupler and capacitive coupler. It specifies the principles and requirements of insulation and isolation characteristics for magnetic and capacitive couplers for basic insulation and reinforced insulation. This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to IEC PAS 60747-17:2011: a) introduced lifetime safety factors for improved life time consideration, to comply with widely recognized aging mechanisms of silicone dioxide (TDDB) and thin film polymer isolation layers; b) significantly improved "end of life testing" paragraph and statistical life time consideration by adding detailed description on process, safety factors, methods of generating data points and respective lifetime interpolations as well as being specific on minimum amount of samples required; c) introduced concept of certification by similarity, including Annex A, giving guidance on qualification considerations and required certification process; d) alternative pulse shape allowed for surge pulse testing, to avoid issues due to surge tester availability; e) various improvements throughout the standard: definitions, for example type of coupler have been improved, introduction of surge impulse VIMP rating, usage of glass transition temperature, pre-conditioning have been redefined for improved usability and better compatibility with today’s design and functionality of couplers, available mold compounds, etc.
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The contents of the corrigendum of September 2020 have been included in this copy.
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IEC 60747-5-5:2020(E) specifies the terminology, essential ratings, characteristics, safety tests, as well as the measuring methods for photocouplers. Note: The term "optocoupler" can also be used instead of "photocoupler". This edition includes the following significant technical changes with respect to the previous edition: a) optional data sheet basic insulation rating in accordance with IEC 60664-1:2007, 6.1.3.5; b) editorial corrections on the use of VIORM; c) editorial corrections on Figure 2: Time intervals for method b); d) addition of an alternative surge pulse VIOSM test method.
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IEC 60747-16-5:2013 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit oscillators. This standard is applicable to the fixed and voltage-controlled semiconductor microwave oscillator devices, except the oscillator modules such as synthesizers which require external controllers.
- Standard43 pagesEnglish languagesale 10% offe-Library read for1 day
IEC 60747-15:2010 gives the requirements for isolated power semiconductor devices excluding devices with incorporated control circuits. These requirements are additional to those given in other parts of IEC 60747 for the corresponding non-isolated power devices. The main changes with respect to previous edition are listed below.
a) Clause 3, 4 and 5 were re-edited and some of them were combined to other sub clauses.
b) Clause 6, 7 were re-edited as a part of 'Measuring methods' with amendment of suitable addition and deletion.
c) Clause 8 was amended by suitable addition and deletion.
d) Annex C, D and Bibliography were deleted.
This publication is to be read in conjunction with IEC 60747-1:2006.
- Standard29 pagesEnglish languagesale 10% offe-Library read for1 day
Provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave switches. Switches in this standard are based on SPDT single pole double throw. However, this standard is applicable to the other types of switches.
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Provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave switches. Switches in this standard are based on SPDT (single pole double throw). However, this standard is applicable to the other types of switches.
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Specifies the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, manufacture and supply of monolithic microwave integrated circuits in compliance with the general requirements of the IECQ-CECC System for electronic components of assessed quality.
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Provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave frequency converters.
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Provides the terminology, the essential ratings and characteristics, as well as the measuring methods, for integrated circuit microwave power amplifiers.
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This part of IEC 60747 gives the terminology, essential ratings, characteristics, safety test as well as the measuring method for photocouplers (or optocouplers). NOTE The word 'optocoupler' can also be used instead of 'photocoupler'. This standard replaces the clauses for photocouplers (or optocouplers) described in IEC 60747-5-1, IEC 60747-5-2 and IEC 60747-5-3, including their amendments. The contents for phototransistors and photothyristors in IEC 60747-5-1, IEC 60747-5-2 and IEC 60747-5-3, including their amendments, will be considered obsolete as of the effective date of publication of this standard. NOTE Photocouplers that are certified to the previous version of the photocoupler standard, namely IEC 60747-5-1/2/3, are to be considered in compliance with the requirements and provisions of IEC 60747-5-5.
- Standard56 pagesEnglish languagesale 10% offe-Library read for1 day
Gives the product specific standards, requirements and test methods for isolated power semiconductor devices. These requirements are added to those given in other parts of EN 60747, EN 60748 and EN 60749 for the corresponding non-isolated power devices.
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EN following parallel vote
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Deals with the terminology relating to the semiconductor optoelectronic devices.
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This document applies to discrete pressure contact power semiconductor devices namely rectifier diodes, transistors, thyristors and their derivatives. The requirements also cover encapsulated assemblies. The document does not apply to stacks or assemblies made with these encapsulated components.
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