EN 60747-16-3:2002

Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

Provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave frequency converters.

Halbleiterbauelemente - Teil 16-3: Integrierte Schaltungen zur Frequenzumsetzung von Mikrowellen

Dispositifs à semiconducteurs - Partie 16-3: Circuits intégrés hyperfréquences - Convertisseurs de fréquence

La CEI 60747-16-3:2002 spécifie de nouvelles méthodes de mesure, la terminologie et des symboles littéraux, ainsi que des valeurs limites et des caractéristiques essentielles pour les convertisseurs d'hyperfréquences à circuit intégré.

Polprevodniške naprave - 16-3. del: Mikrovalovna integrirana vezja - Frekvenčni pretvorniki (IEC 60747-16-3:2002)

General Information

• Status: Published
• Publication Date: 23-Jul-2002
• Withdrawal Date: 30-Jun-2005
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/SC 47E - IEC_SC_47E
• Parallel Committee: IEC/SC 47E - IEC_SC_47E
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 24-Jul-2002
• Completion Date: 24-Jul-2002
• Ref Project: SIST EN 60747-16-3:2004 - Semiconductor devices -- Part 16-3: Microwave integrated circuits - Frequency converters

Relations

• Amended By: EN 60747-16-3:2002/A1:2009 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
• Effective Date: 29-Jan-2023
• Amended By: EN 60747-16-3:2002/A2:2017 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
• Effective Date: 26-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-november-2004
3ROSUHYRGQLãNHQDSUDYHGHO0LNURYDORYQDLQWHJULUDQDYH]MD)UHNYHQþQL
SUHWYRUQLNL,(&
Semiconductor devices -- Part 16-3: Microwave integrated circuits - Frequency
converters
Halbleiterbauelemente -- Teil 16-3: Integrierte Schaltungen zur Frequenzumsetzung von
Mikrowellen
Dispositifs à semiconducteurs -- Parie 16-3: Circuits intégrés hyperfréquences -
Convertisseurs de fréquence
Ta slovenski standard je istoveten z: EN 60747-16-3:2002
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 60747-16-3
NORME EUROPÉENNE
EUROPÄISCHE NORM July 2002
ICS 31.080.99
English version
Semiconductor devices
Part 16-3: Microwave integrated circuits -
Frequency converters
(IEC 60747-16-3:2002)
Dispositifs à semiconducteurs Halbleiterbauelemente
Parie 16-3: Circuits intégrés Teil 16-3: Integrierte Schaltungen zur
hyperfréquences - Frequenzumsetzung von Mikrowellen
Convertisseurs de fréquence (IEC 60747-16-3:2002)
(CEI 60747-16-3:2002)
This European Standard was approved by CENELEC on 2002-07-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60747-16-3:2002 E
Foreword
The text of document 47E/212/FDIS, future edition 1 of IEC 60747-16-3, prepared by SC 47E, Discrete
semiconductor devices, of IEC TC 47, Semiconductor device, was submitted to the IEC-CENELEC
parallel vote and was approved by CENELEC as EN 60747-16-3 on 2002-07-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-04-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-07-01
Les annexes appelées "normatives" font partie du corps de la norme.
Dans la présente norme, l'annexe ZA est normative.
L'annexe ZA a été ajoutée par le CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60747-16-3:2002 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 60747-16-3:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60617-12 - Graphical symbols for diagrams EN 60617-12 1998
Part 12: Binary logic elements
1) 2)
IEC 60617-13 - Part 13: Analogue elements EN 60617-13 1993
IEC 60747-1 1983 Semiconductor devices - Discrete--
devices and integrated circuits
Part 1: General
IEC 60748-2 1997 Semiconductor devices - Integrated--
circuits
Part 2: Digital integrated circuits
1)
IEC 60748-3 - Part 3: Analogue integrated circuits - -
1)
IEC 60748-4 - Part 4: Interface integrated circuits - -

1)
Undated reference.
2)
Valid edition at date of issue.

INTERNATIONAL IEC
STANDARD
60747-16-3
First edition
2002-05
Semiconductor devices –
Part 16-3:
Microwave integrated circuits –
Frequency converters
Dispositifs à semiconducteurs –
Partie 16-3:
Circuits intégrés hyperfréquences –
Convertisseurs de fréquence
 IEC 2002  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale
W
International Electrotechnical Commission
Международная Электротехническая Комиссия
For price, see current catalogue

– 2 – 60747-16-3  IEC:2002(E)
CONTENTS
FOREWORD.3
1 Scope.4
2 Normative references .4
3 Terms and definitions .4
4 Abbreviated terms .6
5 Essential ratings and characteristics.6
5.1 General .6
5.2 Application description .7
5.3 Specification of the function .8
5.4 Limiting values (absolute maximum rating system) .9
5.5 Operating conditions (within the specified operating temperature range) .11
5.6 Electrical characteristics.11
5.7 Mechanical and environmental ratings, characteristics and data.12
5.8 Additional information.12
6 Measuring methods .13
6.1 General .13
6.2 Conversion gain (G ) .14
c
6.3 Conversion gain flatness (ΔG ).16
c
6.4 LO/IF isolation (P /P ) .18
LO LO(IF)
6.5 LO/RF isolation (P /P ) .19
LO LO(RF)
6.6 RF/IF isolation.20
6.7 Image rejection (P /P ) .24
o o(im)
6.8 Sideband suppression (P /P ).26
o o(U)
6.9 Output power (P ).28
o
6.10 Output power at 1-dB conversion compression (P ) .29
o(1dB)
6.11 Noise figure (F) .30
6.12 Intermodulation distortion (P /P ).32
n 1
6.13 Output power at the intercept point (for intermodulation products) (P ) .35
n(IP)
6.14 LO port return loss (L ) .36
ret(LO)
6.15 RF port return loss (L ) .37
ret(RF)
6.16 IF port return loss (L ).39
ret(IF)
Figure 1 – Electrical terminal symbols.9
Figure 2 – Circuit diagram for the measurement of conversion gain .14
Figure 3 – Circuit diagram for the measurement of the LO/IF isolation .18
Figure 4 – Circuit diagram for the measurement of the LO/RF isolation.19
Figure 5 – Circuit diagram for the measurement of the RF/IF isolation for type A .21
Figure 6 – Circuit diagram for the measurement of the RF/IF isolation for type B .23
Figure 7 – Circuit diagram for measurement of noise figure .30
Figure 8 – Circuit for the measurement of intermodulation distortion .33
Figure 9 – Circuit for the measurement of the LO port return loss .36
Figure 10 – Circuit for the measurement of the RF/IF port return loss .38
Table 1 – Function of terminal.8
Table 2 – Electrical limiting values .10
Table 3 – Electrical characteristics.12

60747-16-3  IEC:2002(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-3: Microwave integrated circuits –
Frequency converters
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-16-3 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/212/FDIS 47E/219/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
The committee has decided that the contents of this publication will remain unchanged until
2008. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
– 4 – 60747-16-3  IEC:2002(E)
SEMICONDUCTOR DEVICES –
Part 16-3: Microwave integrated circuits –
Frequency converters
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave frequency
converters.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated refer
...