EN 62047-15:2015

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

IEC 62047-15:2015 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in case of systems having pneumatic microvalves, a relatively high level of bonding particularly between two replica moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding phenomena between interface of bonded areas, which causes unstability and shortage of lifetime for MEMS devices. This standard specifies general procedures on bonding test of PDMS and glass chip.

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 15: Prüfverfahren zur Bondqualität zwischen PDMS und Glas

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 15: Méthode d'essai de la résistance de collage entre PDMS et verre

L'IEC 62047-15:2015 décrit la méthode d'essai de la résistance de collage entre polydiméthylsiloxane (PDMS) et verre. Le caoutchouc de silicone, PDMS, est utilisé pour la réalisation de puces microfluidiques, fabriquées en utilisant des processus de lithographie et de moulage d'empreinte. Le problème de la résistance de collage se pose principalement pour les applications à haute pression, par exemple dans le cas de la conception de certaines pompes péristaltiques, lorsqu'une alimentation en air comprimé hors puce est utilisée pour entraîner les fluides dans des microcanaux créés par une double couche, l'une étant formée par collage entre verre et PDMS moulé d'empreinte et une autre entre PDMS et PDMS. D'autre part, dans le cas des systèmes comportant des microsoupapes pneumatiques, un niveau de collage relativement important entre deux couches moulées d'empreinte de PDMS devient relativement nécessaire. Il existe habituellement un phénomène de fuite et de décollement à l'interface des zones collées, produisant une instabilité et une diminution de la durée de vie des dispositifs MEMS. La présente norme définit les modes opératoires généraux de l'essai de collage de PDMS et puce de verre.

Polprevodniški elementi - Mikroelektromehanski elementi - 15. del: Metoda za preskušanje spojne trdnosti med PDMS in steklom

Ta del standarda IEC 62047 opisuje metodo za preskušanje spojne trdnosti med poli-dimetil-siloksanom (PDMS) in steklom. Guma na osnovi silikona, PDMS, se uporablja za izdelavo mikrotekočinskih naprav na čipih, ki so izdelane s procesi litografije in ulivanja replik. Težave spojne trdnosti se pojavijo predvsem pri rabi pod visokim pritiskom, kot na primer pri določenih peristaltičnih črpalkah, kjer se dovod stisnjenega zraka, ločen od čipa, uporablja za pogon tekočin v mikrokanalih, ki jih ustvari dvojni sloj, katerega en del se oblikuje med steklom z ulitim PDMS-jem, drugi del pa med PDMS-jem in PDMS-jem. Poleg tega postane visoka stopnja spojnosti dokaj nujna, predvsem med dvema slojema ulitega PDMS-ja, v primeru sistema s pnvematičnimi mikroventili. Navadno pride do puščanja in zmanjšanja spojnosti na stiku med spojenima območjema, kar povzroči nestabilnost in zmanjšanje življenjske dobe naprav MEMS. Ta standard določa splošne postopke preskusa spojnosti PDMS-ja in steklenega čipa.

General Information

• Status: Withdrawn
• Publication Date: 09-Jul-2015
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/SR 47F - CLC_SR_47F
• Drafting Committee: IEC/SC 47F - IEC_SC_47F
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Completion Date: 02-May-2018
• Ref Project: SIST EN 62047-15:2015 - Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Polprevodniški elementi - Mikroelektromehanski elementi - 15. del: Metoda za preskušanje spojne trdnosti med PDMS in steklomHalbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 15: Prüfverfahren zur Bondqualität zwischen PDMS und GlasDispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 15: Méthode d'essai de la résistance de collage entre PDMS et verreSemiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in generalICS:Ta slovenski standard je istoveten z:EN 62047-15:2015SIST EN 62047-15:2015en01-september-2015SIST EN 62047-15:2015SLOVENSKI
STANDARD



SIST EN 62047-15:2015



EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN 62047-15
July 2015 ICS 31.080.99
English Version
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass (IEC 62047-15:2015)
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 15: Méthode d'essai de la résistance de collage entre PDMS et verre (IEC 62047-15:2015)
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 15: Prüfverfahren zur Bondqualität zwischen PDMS und Glas (IEC 62047-15:2015) This European Standard was approved by CENELEC on 2015-04-09. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17,
B-1000 Brussels © 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62047-15:2015 E SIST EN 62047-15:2015



EN 62047-15:2015 2 European foreword The text of document 47F/208/FDIS, future edition 1 of IEC 62047-15, prepared by SC 47F “Microelectromechanical systems” of IEC/TC 47 “Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-15:2015.
The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2016-01-10 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2018-04-09
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights.
Endorsement notice The text of the International Standard IEC 62047-15:2015 was approved by CENELEC as a European Standard without any modification. SIST EN 62047-15:2015



EN 62047-15:2015 3
Annex ZA (normative)
Normative references to international publications with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu.
Publication Year Title EN/HD Year IEC 62047-9 -
Semiconductor devices - Micro-electromechanical devices -- Part 9: Wafer to wafer bonding strength measurement for MEMS EN 62047-9 -
SIST EN 62047-15:2015



SIST EN 62047-15:2015



IEC 62047-15 Edition 1.0 2015-03 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices – Micro-electromecha
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