EN IEC 61967-4:2021

Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method

IEC 61967-4:2021 is available as IEC 61967-4:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61967-4:2021 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods ensure a high degree of reproducibility and correlation of EME measurement results. This edition includes the following significant technical changes with respect to the previous edition: - frequency range of 150 kHz to 1 GHz has been deleted from the title; - recommended frequency range for 1 Ω method has been reduced to 30 MHz; - Annex G with recommendations and guidelines for frequency range extension beyond 1 GHz has been added.

Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen – Teil 4: Messung der leitungsgeführten Aussendungen - Messung mit direkter 1-Ohm-/150-Ohm-Kopplung

Circuits intégrés - Mesure des émissions électromagnétiques - Partie 4: Mesure des émissions conduites - Méthode par couplage direct 1 Ω/150 Ω

IEC 61967-4:2021 est disponible sous forme de IEC 61967-4:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L’IEC 61967-4:2021 spécifie une méthode de mesure de l’émission électromagnétique (EME) conduite des circuits intégrés par mesure directe des courants RF avec une sonde résistive de 1 Ω et mesure des tensions RF en utilisant un réseau de couplage de 150 Ω. Ces méthodes assurent un degré élevé de reproductibilité, ainsi que la corrélation des résultats des mesures EME. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - la gamme de fréquences de 150 kHz à 1 GHz a été supprimée du titre; - la gamme de fréquences recommandée pour la méthode à 1 Ω a été réduite à 30 MHz; - l’Annexe G avec les recommandations et les lignes directrices pour l’extension de gamme de fréquences au-dessus de 1 GHz a été ajoutée.

Integrirana vezja - Meritve elektromagnetnega sevanja - 4. del: Meritve prevajanega sevanja, metoda neposrednega sklopa 1 ohm/150 ohmov (IEC 61967-4:2021)

General Information

• Status: Published
• Publication Date: 29-Apr-2021
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/SC 47A - IEC_SC_47A
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 30-Apr-2021
• Due Date: 29-Oct-2021
• Completion Date: 30-Apr-2021
• Ref Project: SIST EN IEC 61967-4:2021 - Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method (IEC 61967-4:2021)

Relations

• Replaces: EN 61967-4:2002/A1:2006 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method
• Effective Date: 23-Jan-2023
• Replaces: EN 61967-4:2002 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method
• Effective Date: 04-May-2021
• Replaces: EN 61967-4:2002/AC:2017-07 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method
• Effective Date: 04-May-2021

Standards Content (Sample)

SLOVENSKI STANDARD
01-julij-2021
Nadomešča:
SIST EN 61967-4:2005
SIST EN 61967-4:2005/A1:2006
SIST EN 61967-4:2005/AC:2017
Integrirana vezja - Meritve elektromagnetnega sevanja - 4. del: Meritve prevajanega
sevanja, metoda neposrednega sklopa 1 ohm/150 ohmov (IEC 61967-4:2021)
Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement
of conducted emissions, 1 ohm/150 ohm direct coupling method (IEC 61967-4:2021)
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen – Teil 4:
Messung der leitungsgeführten Aussendungen - Messung mit direkter 1-Ohm-/150-Ohm-
Kopplung (IEC 61967-4:2021)
Circuits intégrés - Mesure des émissions électromagnétiques - Partie 4 : Mesure des
émissions conduites - Méthode par couplage direct 1 ohm/150 ohm (IEC 61967-4:2021)
Ta slovenski standard je istoveten z: EN IEC 61967-4:2021
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61967-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
April 2021
ICS 31.200 Supersedes EN 61967-4:2002 and all of its amendments
and corrigenda (if any)
English Version
Integrated circuits - Measurement of electromagnetic emissions
- Part 4: Measurement of conducted emissions - 1 Ω/150 Ω
direct coupling method
(IEC 61967-4:2021)
Circuits intégrés - Mesure des émissions Integrierte Schaltungen - Messung von
électromagnétiques - Partie 4: Mesure des émissions elektromagnetischen Aussendungen - Teil 4: Messung der
conduites - Méthode par couplage direct 1 Ω/150 Ω leitungsgeführten Aussendungen - Messung mit direkter 1-
(IEC 61967-4:2021) Ohm-/150-Ohm-Kopplung
(IEC 61967-4:2021)
This European Standard was approved by CENELEC on 2021-04-20. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61967-4:2021 E

European foreword
The text of document 47A/1101/CDV, future edition 2 of IEC 61967-4, prepared by SC 47A "Integrated
circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN IEC 61967-4:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-01-20
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-04-20
document have to be withdrawn
This document supersedes EN 61967-4:2002 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61967-4:2021 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
CISPR 16-1-2 NOTE Harmonized as EN 55016-1-2
CISPR 25 NOTE Harmonized as EN 55025
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61000-4-6 - Electromagnetic compatibility (EMC) - Part 4-6: EN 61000-4-6 -
Testing and measurement techniques -
Immunity to conducted disturbances, induced by
radio-frequency fields
IEC 61967-1 - Integrated circuits - Measurement of EN IEC 61967-1 -
electromagnetic emissions - Part 1: General
conditions and definitions
IEC 61967-4 ®
Edition 2.0 2021-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions –

Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling

method
Circuits intégrés – Mesure des émissions électromagnétiques –

Partie 4: Mesure des émissions conduites – Méthode par couplage direct

1 Ω/150 Ω
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-9568-7

– 2 – IEC 61967-4:2021 © IEC:2021
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 General . 7
4.1 Measurement basics . 7
4.2 RF current measurement . 9
4.3 RF voltage measurement at IC pins . 9
4.4 Assessment of the measurement technique . 9
5 Test conditions . 9
6 Test equipment . 10
6.1 RF measuring instrument . 10
6.2 RF current probe specification . 10
6.3 Test of the RF current probe capability . 11
6.4 Matching network specification . 11
7 Test setup . 12
7.1 General test configuration . 12
7.2 Printed circuit test board layout . 12
8 Test procedure . 13
9 Test report . 13
Annex A (informative)  Probe verification procedure . 14
Annex B (informative)  Classification of conducted emission levels . 18
B.1 Introductory remark . 18
B.2 General . 18
B.3 Definition of emission levels . 18
B.4 Presentation of results . 18
B.4.1 General . 18
B.4.2 Examples. 20
Annex C (informative)  Example of reference levels for automotive applications. 22
C.1 Introductory remark . 22
C.2 General . 22
C.3 Reference levels . 22
C.3.1 General . 22
C.3.2 Measurements of conducted emissions, 1 Ω method . 23
C.3.3 Measurements of conducted emissions, 150 Ω method . 23
Annex D (informative)  EMC requirements and how to use EMC IC measurement
techniques . 24
D.1 Introductory remark . 24
D.2 Using EMC measurement procedures . 24
D.3 Assessment of the IC influence to the EMC behaviour of the modules . 24
Annex E (informative)  Example of a test setup consisting of an EMC main test board
and an EME IC test board . 26
E.1 Introductory remark . 26
E.2 EMC main test board . 26
E.3 EME IC test board. 28

IEC 61967-4:2021 © IEC:2021 – 3 –
E.3.1 General explanation of the test board . 28
E.3.2 How to build the test system . 28
E.3.3 PCB layout and component positioning . 30
Annex F (informative)  150 Ω direct coupling networks for common mode emission
measurements of differential mode data transfer ICs and similar circuits . 32
F.1 Basic direct coupling network . 32
F.2 Example of a common-mode coupling network alternative for LVDS or
RS485 or similar systems . 33
F.3 Example of a common-mode coupling network alternative for differential IC
outputs to resistive loads (e.g. airbag ignition driver) . 34
F.4 Example of a common-mode coupling network for CAN systems . 34
Annex G (informative)  Measurement of conducted emissions in extended frequency
range . 35
G.1 General . 35
G.2 Guidelines . 35
G.2.1 Measurement network . 35
G.2.2 Network components . 36
G.2.3 Network layout . 38
G.2.4 Network verification . 38
G.2.5 Test board .
...