ES 59008-6-2:2001
(Main)Data requirements for semiconductor die -- Part 6-2: Data dictionary
Data requirements for semiconductor die -- Part 6-2: Data dictionary
Superseded by EN 61360-4:2005
Zahtevani podatki za polprevodniška integrirana vezja - 6-2. del: Podatkovni slovar
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
SIST-TS ES 59008-6-2:2007
01-januar-2007
Zahtevani podatki za polprevodniška integrirana vezja - 6-2. del: Podatkovni slovar
Data requirements for semiconductor die -- Part 6-2: Data dictionary
Ta slovenski standard je istoveten z: ES 59008-6-2:2001
ICS:
31.080.01
SIST-TS ES 59008-6-2:2007 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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EUROPEAN SPECIFICATION ES 59008-6-2
SPÉCIFICATION EUROPÉENNE
EUROPÄISCHE SPEZIFIKATION March 2001
English version
Data requirements for semiconductor die
Part 6-2: Data dictionary
This European Specification was approved by CENELEC on 2000-11-06.
CENELEC members are required to announce the existence of this ES in the same way as for an EN and to
make the ES available promptly at national level in an appropriate form. It is permissible to keep conflicting
national standards in force.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway,
Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2001 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. ES 59008-6-2:2001 E
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ES 59008-6-2:2001 - 2 -
Foreword
This European Specification has been prepared by the CENELEC BTTF 97-1, Known Good Die.
It was submitted to the vote during the meeting of BTTF 97-1 and approved by CENELEC as ES 59008-6-2
on 2000-11-06.
The following date was fixed:
- latest date by which the existence of the ES
has to be announced at national level (doa) 2001-05-01
The structure of this European Specification is as follows:
ES 59008 Data requirements for semiconductor die
Part 1 General requirements
Part 2 Vocabulary
Part 3 Mechanical, material and connectivity requirements
Part 4 Specific requirements and recommendations
Part 4-1 Test and quality
Part 4-2 Handling and storage
Part 4-3 Thermal
Part 4-4 Electrical simulation
Part 5 Particular requirements and recommendations for die types
Part 5-1 Bare die
Part 5-2 Bare die with added connection structures
Part 5-3 Minimally packaged die
Part 6 Exchange data formats and data dictionary
Part 6-1 Data exchange - DDX
Part 6-2 Data dictionary
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- 3 - ES 59008-6-2:2001
Introduction
This European Specification has been developed so that the selection of unpackaged and minimally
packaged semiconductor die, with or without connection structures, can be carried out in a constructive
way so that the designer and procurer of the components can save both design and procurement time.
It is a data specification which defines the requirements for:
− product identity;
− product data;
− die mechanical information;
− test, quality and reliability information;
− handling, storage and mounting information;
− thermal data and electrical simulation data.
This document was prepared by CENELEC Task Force CLC/BTTF 97-1 Known Good Die. Other
organisations that helped prepare it were: the ESPRIT GOOD-DIE project, EECA, Sematech; DPC and
EIAJ.
th
The specification was derived from the work carried out in the ESPRIT 4 Framework project GOOD-DIE.
This project was set up to develop a database for the selection of unpackaged and minimally packaged
semiconductor die, with or without connection structures, and for the downloading of information to CAD
design stations to facilitate the layout and simulation of MCMs and hybrid circuits. During the early part of
this project the need became apparent for standard ways of presenting information for the selection and
procurement of these components.
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ES 59008-6-2:2001 - 4 -
1 Scope
This series of European Specifications specifies requirements for the exchange of data pertaining to bare
semiconductor die, with or without connection structures, and minimally packaged semiconductor die.
This Specification also gives recommendations for general industry good practice in the use of bare die,
with or without connection structures, and minimally packaged die.
Part 6-2 of ES 59008 specifies the dictionary for die data including definitions of all necessary die
properties according to the requirements of IEC 61360.
2 Normative references
The following normative documents contain provisions which, through reference in this text, constitute
provisions of this European Specification. At the time of publication, the editions indicated were valid. All
normative documents are subject to revision, and parties to agreements based on this European
Specification are encouraged to investigate the possibility of applying the most recent editions of the
normative documents indicated below.
ES 59008-1 Data requirements for semiconductor die -- Part 1: General
requirements
ES 59008-2 Part 2: Vocabulary
ES 59008-3 Part 3: Mechanical, material and connectivity requirements
ES 59008-4-X Part 4-X: Specific requirements and recommendations
ES 59008-5-X Part 5-X: Particular requirements and recommendations for die types
ES 59008-6-1 Part 6-1: Exchange data format and data dictionary - Data exchange - DDX
file format
EN 60191-4 1999 Mechanical standardization of semiconductor devices - Part 4: Coding
system and classification into forms of package outlines for semiconductor
devices (IEC 60191-4:1999)
EN 61360-1 1995 Standard data element types with associated classification scheme for
electric components -- Part 1: Definitions - Principles and methods
(IEC 61360-1:1995)
EN 61360-4 1995 Part 4: IEC reference collection of standard data element types, component
classes and terms (IEC 61360-4:1994)
ISO 13584-24 (DIS) Industrial automation systems and integration - Parts library -
Part 24: Logical resource: Logical model of supplier library
3 Definitions
For the purposes of this European Specification, the definitions as given in ES 59008-2: Vocabulary shall
apply.
4 Requirements
This Part of the specification should be read in conjunction with ES 59008-1: General Requirements,
ES 59008-3: Mechanical, material and connectivity requirements, ES 59008-4: Specific requirements and
recommendations, ES 59008-5: Particular requirements and recommendations for die types and
ES 59008-6-1: Data exchange - DDX.
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4.1 Formats for data element type definitions
This document presents definitions for properties of die as described in other parts of this
standard in a computer-sensible form in accordance with the requirements of EN 61360-1. The
definitions given in clause 5 are presented in a format which is consistent with the format of the
dictionary in annex A of EN 61360-4.
To assist in the understanding of the die property definitions given in clause 5, the Figures 1, 2
and 3 below indicate the various attributes that appear there whilst Table 1 that follows acts as a
key to the figures. For a detailed description of the various attributes of the data element type
definitions, see EN 61360-1.
15 6 12 13
| | | | |
AAF307-005 01 NR3 S.3.3ES2 E25
__________________________
K**-1 9
___________________________
Temp factor of permeability $a_F 4
__
2
_____________________________
Temp factor of reluctivity α 3
p
_____________________________________________________________________________________________________________________________________
14
The value as specified by level (minTypMax) of the negative of the change in the permeability
due to a change in temperature, divided by that change in temperature (in K**-1) of a soft
__
7 magnetic material at specified frequency
__
8 AAE029-005=frequency
11
−
__
μμ μμ−
10 θθref ref
α =− =
F
θθ− μμ()θ −θ
ref θ ref ref
__
11 IEC 60050 (221.02.49) (1990)
Figure 1 - Quantitative data element type specification attributes
15 6 12 13
| | | | |
AAE759-005 01 M.3 A57
2 coercivity class coercivity cl 4
7 Code of the coercivity class of a magnetic part or magnetic material
15 HRD = hard magnetic
SFT = soft magnetic
||
17 18
18 IEC 50(221),term 01.14
IEC 50(221),term 01.15
Figure 2 - Non-quantitative data element type specification attributes
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ES 59008-6-2:2001 - 6 -
15 6 12 13
| | | | |
XKE111-001 01 M.8 A53
2 supply packing code packing code 4
7 Code for the form of packing used for the supply of a die or wafer
NOTES
Where die may be supplied in more than one form of packing, all possibilities may be listed
15 BOX = supplied in wafer boxes
FILM = supplied on plastic film
GELPAK = supplied in GEL-PAK (TM)
GELSAW = supplied in GEL-PAK (TM) for sawn wafers
TAPE = supplied on tape or reel
WAFFLE = supplied in waffle pack or tray
||
17 18
19 data type : set of value codes
Figure 3 - Data element type specification attributes for complex data types
NOTE Where a data type is a simple type or a level type and the data type can be inferred from other attributes, an
explicit data type may not be shown.
Table 1 - Key to data element type attributes
1 Code 11 Source document of data element type definition
2 Preferred name / synonymous name 12 Value format for numeric or string data types or class
3 Preferred symbol / synonymous symbol identifier for class instance type
4 Short name 13 Data element type class
5 Version number 14 Level
6 Revision number 15 Value list
7 Definition 16 Value codes
8 Condition(s) 17 Value meanings
9 Unit of measure 18 Source document(s) of value(s)
10 Formula 19 Data type
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5 Data element type definitions
5.1 List of DET definitions
DET identifier Name Short name Units Format
XKE001-001 die identifier die ID M.17
XKE002-001 die name die name M.17
XKE003-001 die version die version M.17
XKE004-001 die type code die code M.4
XKE085-001 die type die type M.35
XKE086-001 die type description die desc M.175
XKE140-001 die manufacturer manufacturer M.35
XKE141-001 die supplier supplier M.35
XKE142-001 die data source data source M.35
XKE143-001 packaged part name packaged part M.35
XKE010-001 die description die desc M.70
XKE127-001 die picture die picture M.35
XKE115-001 geometric units geometric units M.8
XKE144-001 geometric view geometric view M.8
XKE070-001 die step dimension x D m NR2.3.3
XKE071-001 die step dimension y E m NR2.3.3
XKE072-001 die thickness A m NR2.3.3
XKE129-001 die centre x-position X_0 m NR2.3.3
XKE130-001 die centre y-position Y_0 m NR2.3.3
XKE018-001 number of bond sites n_bond 1 NR1.2
XKE145-001 terminal count n_term 1 NR1.4
XKE116-001 pad geometry count n_g 1 NR1.4
XKE117-001 die size tolerance S_tol m NR3.3.3ES2
XKE118-001 die thickness tolerance T_tol m NR3.3.3ES2
XKE122-001 bump size bump size M.70
XKE146-001 bump height h_b m NR3.3.3ES2
XKE147-001 bump height tolerance h_b_tol m NR3.3.3ES2
XKE123-001 bumped height A_1 m NR2.3.3
XKE011-001 wafer size wafer size m NR1.3
XKE005-001 substrate material substrate M.17
XKE148-001 bulk material bulk material M.17
XKE119-001 backside finish backside finish M.35
XKE149-001 maximum assembly temperature assembly temp Cel NR2 S.3.3
XKE006-001 connection requirement code conn req code M.4
XKE091-001 connection requirement conn req M.35
XKE093-001 substrate connection desc subst conn desc M.175
XKE007-001 substrate connection substr conn M.17
XKE078-001 passivation material passivation M.35
XKE120-001 pad metallisation pad metallisation M.35
XKE124-001 bump material bump material M.35
XKE125-001 lead-frame material lead material M.35
XKE126-001 Underfill underfill M.70
XKE150-001 encapsulation material encapsulation M.70
XKE151-001 power limit P_lim W NR3 S.3.3ES2
XKE012-001 termination number terminal ID 1 NR1.4
XKE013-001 manufacturer pad identifier manuf pad ID M.17
XKE018-001 number of bond sites bond sites 1 NR1.2
XKE014-001 pad geometry name pad geom name M.17
XKE015-001 pad x position pad x m NR2 S.3.3
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ES 59008-6-2:2001 - 8 -
XKE016-001 pad y position pad y m NR2 S.3.3
XKE017-001 pad orientation pad orientation M.4
XKE081-001 die surface die surface A1
XKE024-001 pad shape pad shape A4
XKE025-001 pad length b m NR2.3.3
XKE026-001 pad width c m NR2.3.3
XKE121-001 pad diameter $fb m NR2.3.3
XKE027-001 number of polygon vertices n_v 1 NR1.2
XKE028-001 vertex number v_p 1 NR1.2
XKE029-001 vertex x coordinate x_v m NR2 S.3.3
XKE030-001 vertex y coordinate y_v m NR2 S.3.3
XKE019-001 signal name signal name M.35
XKE020-001 signal type signal type M.8
XKE021-001 electrical reference elect ref M.17
XKE022-001 signal direction I/O direction A2
XKE023-001 swap codes swap codes M.17
XKE049-001 supply name supply name M.17
XKE032-001 supply voltage V_sup V NR2 S.3.3
XKE054-001 supply current I_sup A NR3 S.3.3ES2
XKE031-001 supply variability variability A3
XKE033-001 pad supply current I_pad A NR3.3.3ES2
XKE082-001 test name test name M.35
XKE008-001 die test level code test level M.17
XKE060-001 test procedure description test procedure M.2000
XKE009-001 die yield die yield % NR2.2.2
XKE131-001 defect rate DPM ppm NR2.2.2
XKE095-001 die yield code yield code M1
XKE132-001 test flow code test flow X1
XKE133-001 temperature specification code test temp X1
XKE134-001 test screening code screening X1
XKE153-001 test reliability code reliability X1
XKE154-001 test maturity code maturity X1
XKE137-001 conformity level code conformity X1
XKE056-001 delivery form code supply code M.8
XKE055-001 delivery packing code packing code M.8
XKE087-001 delivery form supply form M.35
XKE088-001 delivery form description supply form desc M.175
XKE089-001 delivery packing packing M.35
XKE090-001 delivery packing description packing desc M.175
XKE155-001 MPD delivery form MPD delivery M.35
XKE156-001 fiducial name fiducial name M.17
XKE157-001 fiducial file name fiducial file M.35
XKE158-001 fiducial width x_f NR2 S.3.3
XKE159-001 fiducial height y_f NR2 S.3.3
XKE160-001 fiducial x position fid x NR2 S.3.3
XKE161-001 fiducial y position fid y NR2 S.3.3
XKE162-001 fiducial orientation fid orient M.4
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5.2 Die identification and source
XKE001-001 01 M.17 A52 XKE085-001 01 M.35 A52
die identifier die ID die type die type
A code based on the code as defined in EN 60191-4 A short title for the physical form of a die or wafer
to identify the die
NOTES
NOTES This is a short title for the form described more fully in
The code has the form A-XBCC-Dnn/mmm, where XKE086-001. The value list consists of the value
A is a shape class code meanings from XKE004-001.
X is a code for the encapsulation material
B is a terminal position code XKE086-001 01 M.175 A52
CC is the body style code
D is the terminal shape code die type description die desc
nn is the number of terminations
mmm is a sequence number The description of the physical form of a die or wafer
IEC 60191-4 : 1999 XKE140-001 01 M.35 A21
XKE002-001 01 M.17 A52 die manufacturer manufacturer
die name die name The original manufacturer of the die device
The name or identifier given to the die by the XKE141-001 01 M.35 A21
manufacturer
die supplier supplier
XKE003-001 01 M.17 A52
The organisation that supplied the die device, where
die version die version different from the original manufacturer
The code given by the manufacturer to identify the XKE142-001 01 M.35 A21
version of the die die data source data source
XKE004-001 01 M.4 A52 The organisation that supplied the data on the die
device, where different from the original manufacturer
die type die type
XKE143-001 01 M.35 A51
Code of a geometry class containing geometric
properties of die devices packaged part name packaged part
BARE = bare die with pads on one side and without The manufacturer’s type number or part name for an
connection structure packaged part equivalent to the die device
BUMP = bare die with bumped pads
MPD = minimally packaged die device XKE010-001 01 M.70 A58
DUAL = bare die with pads on both surfaces
LEAD = bare die with attached lead frame die description die desc
REMARKS A description of the physical form of the die including
The code relates to the physical form in which the die information on interconnection structures and
or wafer is supplied packaging where applicable
If the die or wafer is in its original form, then the code
is BARE or DUAL. Die with codes BUMP or LEAD XKE127-001 01 M.35 A58
have been post-processed to add the solder bumps or
metal lead frame respectively. die picture die picture
Reference to a file or document containing a picture
of the die which shows the positions of all pads
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ES 59008-6-2:2001 - 10 -
5.3 Die dimensions
XKE115-001 01 M.8 A58 XKE129-001 01 NR2.3.3 T03
m
geometric units geometric units
die centre x-position X_0
The units in which die dimensions are given X0
NOTES The nominal distance (in m) measured in the x
To comply with IEC 61360, the units shall be given in direction of the geometric centre on the surface of a
metres (m) and these will be the default units die from the geometric origin
μm = micrometre (micron) XKE130-001 01 NR2.3.3 T03
m
m = metre
mil = mil (1.0E-3 inch)
die centre y-position Y_0
mm = millimetre
Y0
XKE144-001 01 M.8 A58
The nominal distance (in m) measured in the y
direction of the geometric centre on the surface of a
geometric view geometric view
die from the geometric origin
Specifies the geometric view that shall apply to all
XKE018-001 01 NR1.2 Q56
geometric shapes used in drawings of a die device
1
TOP = viewed from the top (active side)
number of bond sites bond sites
BOTTOM = viewed from the bottom (non-active
side) nbond
The number of separate sites on a pad to which
XKE070-001 01 NR2.3.3 T03
m bonds can and should be made
die step dimension x D
XKE145-001 01 NR1.2 Q56
die length D 1
The nominal value (in m) of the step interval of die
terminal count terminal count
patterns on a wafer measured in the direction of the x
axis of the coordinate system established for the nterm
wafer
The total number of terminals on a die device
REMARKS
XKE116-001 01 NR1.4 Q56
The length of the die will normally be closely related
1
to the step interval but the precise value depends on
width of saw cuts, tolerances etc.
pad geometry count n_g
ng
XKE071-001 01 NR2.3.3 T03
m
The number of different pad shapes on a die to which
different pad geometry names have been allocated
die step dimension y E
die width E
XKE117-001 01 NR3.3.3ES2 T03
m
The nominal value (in m) of the step interval of die
patterns on a wafer measured in the direction of the y
die size tolerance S_tol
axis of the coordinate system established for the
Stol
wafer
The tolerance (in m) on the length and width
REMARKS
dimensions of a die
The width of the die will normally be closely related to
the step interval but the precise value depends on
XKE118-001 01 NR3.3.3ES2 T03
width of saw cuts, tolerances etc.
m
XKE072-001 01 NR2.3.3 T03
die thickness tolerance T_tol
m
Ttol
die thickness A
The tolerance (in m) on the thickness of a die or wafer
wafer thickness A
thickness
The nominal value of the perpendicular distance (in
m) between the two plane faces of a die or wafer
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XKE122-001 01 M.70 A58
5.4 Materials and assembly
XKE0005-001 01 M.17 A57
bump size bump size
substrate material substrate
Description of the size and shape of the bumps on a
bumped die
The constitution of the bulk material which forms the
base of the die process technology
XKE146-001 01 NR3.3.3ES2 T03
m
REMARKS
In most cases the substrate is composed of a single
bump height h_b
material such as silicon
hb
XKE148-001 01 M.17 A57
The nominal height (in m) of the bumps on a bumped
bulk material bulk material
die measured as the perpendicular distance between
the die surface and the plane surface on which the die
The constitution of the bulk material which forms the
is mounted
base of the die process technology where this is
different from the substrate material on which the
XKE147-001 01 NR3.3.3ES2 T03
active die is formed.
m
XKE119-001 01 M.35 A55
bump height tolerance h_b_tol
hbtol
backside finish backside finish
The tolerance (in m) on the height of the bumps over
The finish applied to the surface of the substrate of a
the surface of a bumped die
die opposite to that to which the connections are
made
XKE123-001 01 NR2.3.3 T03
m
XKE149-001 01 NR2 S.3.3 H02
bumped height A_1
maximum assembly temp assembly temp
A1
The maximum temperature (in Cel) to which the
The nominal value of the perpendicular distance (in
backside surface of a die device may be raised during
m) as specified by level (miNoMax) between a plane
assembly
on which the bumps rest and the top surface of a
bumped die
XKE006-001 01 M.4 A56
REMARKS
connection requirement code conn req code
The mounted height of a bumped die will normally be
less than A_1
The mnemonic code used to identify the requirement
for electrical connection to the die substrate
XKE011-001 01 NR1.3 T03
m
CONN = must be connected
ISOL = must be isolated
wafer size wafer size
N/A = not applicable
Wsize
N/K = requirement not known
OPT = connection optional
The nominal diameter of the wafer (in m) on which the
die are fabricated
REMARKS
Where the value of the code is ISOL, no connection
NOTES
shall be made to the substrate.
Since this is only a nominal value for information
Where the value of the code is OPT connection to the
purposes, inch dimensions should be converted at the
substrate is optional but any connection made must
rate of 25 mm to one inch
be to the supply or signal as defined by substrate
connection XKE047
Where the value of the code is CONN, a connection is
required to be made to the supply or signal as defined
by substrate connection XKE047
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ES 59008-6-2:2001 - 12 -
XKE091-001 01 M.35 A56 XKE126-001 01 M.70 A55
connection requirement conn req underfill underfill
A short title for the requirement for electrical Details of any requirements or recommendations for
connection to the die substrate underfill between a bumped die or a minimally-
packaged device and its mounting surface
NOTES
This is a short title for the form described more fully in XKE150-001 01 M.70 A57
XKE093-001
encapsulation material encapsulation
XKE093-001 01 M.175 A56
The material used to form an external case or coating
substrate connection subst conn desc on an electric component to protect it from the
environment
Description of the requirement, if any, of a connection
to the substrate of a die XKE151-001 01 NR3 S.3.3ES2 E35
power limit P_lim
XKE007-001 01 M.17 A56 Plim
substrate connection substr conn The maximum power (in W) dissipated by a
semiconductor device under typical worst-case
The name of the supply connection to which a conditions
substrate connection, if required, must be made.
NOTES
A value is only required when the connection
requirement code in XKE006 is CONN or OPT
REMARKS
The value to be assigned is the name of a supply or
signal connection which is defined elsewhere within a
database
XKE078-001 01 M.35 A57
passivation material passivation
The material used to cover the surface of the die for
passivation
XKE120-001 01 M.70 A57
pad metallisation metallisation
The material used to form the pads on a die to which
connection is made
NOTES
The information given should include the materials
used and the thickness of all layers
XKE124-001 01 M.35 A57
bump material bump material
The material used to form the bumps on a bumped
die
XKE125-001 01 M.35 A57
lead-frame material lead material
The material used to form the leads on a die with
attached lead frame
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5.5 Pad and terminal data
XKE012-001 01 NR1.4 Q56 XKE015-001 01 NR2 S.3.3 T03
1 m
terminal number n_term pad x position pad x
terminal identifier nterm padx
A numeric value which identifies a terminal uniquely The nominal value (in m) of the x coordinate of the
for each device geometric centre of a pad referred to the geometric
origin of the die as origin
REMARKS
Where the manufacturer has allocated a unique NOTES
number to each terminal, that numbering identification For polygonal pads, the geometric centre of the pad is
should be used. taken as mid-way between the extremes of the x and
y dimensions
When that is not the case, for devices with terminals
around the periphery, numbers should be allocated in
XKE016-001 01 NR2 S.3.3 T03
an anticlockwise direction starting with terminal 1 in
m
the top left-hand corner or adjacent to the index mark.
If two or more rows of terminals exist around the
pad y position pad y
periphery then the outermost row should be assigned
pady
first and so on, with the innermost last.
The nominal value (in m) of the y coordinate of the
XKE013-001 01 M.17 A91
geometric centre of a pad referred to the geometric
origin of the die as origin
manufacturer pad identifier manuf pad ID
NOTES
The identification allocated to a pad by the
For polygonal pads, the geometric centre of the pad is
manufacturer in the relevant data sheet
taken as mid-way between the extremes of the x and
y dimensions
REMARKS
The manufacturer’s identification of a bond pad may
XKE017-001 01 M.4 A58
not be the same as the termination number and may
not be unique
pad orientation pad orientation
XKE018-001 01 NR1.2 Q56
The orientation code for a pad related to reference
axes
number of bond sites bond sites
nbond
NOTES
The pad orientation is given by the angle of clockwise
The number of separate sites on a pad to which
orientation, in degrees, followed optionally by letter
bonds can and should be made
codes to indicate mirroring. If the letters “MX” are
included the orientation of the pad is mirrored in the
XKE014-001 01 M.17 A91
X-axis, whilst if the letters “MY” are included the
orientation of the pad is mirrored in the Y-axis. “MX”
pad geometry namepad geom name
and “MY” may both be present.
The name given to identify a particular pad geometry
XKE081-001 01 A1 A58
REMARKS
die surface die surface
The name used is arbitrary and is only used as a link
between a pad geometry definition and a pad
A code identifying the surface of a die on which a pad
instance. The name must be unique within the list of
is situated when pads exist on both surfaces
names for any particular die
NOTES
The value may be blank when pads exist on only one
surface of the die
B = bottom surface
U = upper surface
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ES 59008-6-2:2001 - 14 -
XKE024-001 01 A4 A58 XKE030-001 01 NR2 S.3.3 T03
m
pad shape pad shape
pad vertex y coordinate y_v
The shape of a bonding pad on a die yv
The nominal value (in m) of the y coordinate of a
CIRC = circular vertex of a polygonal pad relative to the centre of the
ELL = elliptical pad
POLY = polygonal
RECT = rectangular XKE019-001 01 M.35 A91
XKE025-001 01 NR2.3.3 T03 signal name signal name
m
The name given to the signal appearing at the
pad length b terminal of a device
b
XKE020-001 01 M.8 A91
The nominal length (in m) of a rectangular or elliptical
pad measured in a direction parallel to the x-axis signal type signal type
I/O type
XKE026-001 01 NR2.3.3 T03
m The type of signal associated with a terminal
pad width c NOTES
c The value shows whether the signal is analogue or
digital, or whether connection to the terminal provides
The nominal width (in m) of a rectangular or elliptical a supply or non-logic function etc.
pad measured in a direction parallel to the y-axis
A = analogue signal
XKE121-001 01 NR2.3.3 T03 B = digital bidirectional
m G = ground
I = digital input
pad diameter $fb N = not connected
&phi:b O = digital output
T = test point
The nominal diameter (in m) of a circular pad U = unknown connection
V = supply voltage
XKE027-001 01 NR1.2 Q56 X = internally connected
1
XKE021-001 01 M.17 A91
number of polygon vertices n_v
nv electrical reference elect ref
The number of vertices of a polygonal pad A reference to a definition of a power supply or logic
signal connection
REMARKS
A polygonal pad must have at least three vertices NOTES
The value to be assigned must be a name which has
XKE028-001 01 NR1.2 Q56 been given to a signal definition in a power, digital or
1 analogue connection table
pad vertex number v_p XKE022-001 01 A2 A56
vp
signal direction I/O direction
The vertex number of a polygonal pad input/output direction
XKE029-001 01 NR2 S.3.3 T03 The direction of signal flow at a terminal
m
BI = bidirectional
pad vertex x coordinate x_v IP = input only
xv OP = output only
The nominal value (in m) of the x coordinate of a XKE023-001 01 M.17 A56
vertex of a polygonal pad relative to the centre o
...
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