EN IEC 61189-5-601:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts). The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-601: Allgemeine Prüfverfahren für Materialien und Baugruppen - Prüfverfahren für die Aufschmelz-Lötfähigkeit für Lötverbindungen und die Aufschmelz-Lötwärmebeständigkeit von Leiterplatten

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-601: Méthodes d’essai générales pour les matériaux et les assemblages - Essai d’aptitude au brasage par refusion pour un joint brasé, et essai de résistance à la chaleur de refusion pour les cartes imprimées

L'IEC 61189-5-601:2021 spécifie la méthode d’essai d’aptitude au brasage par refusion pour les composants montés sur les cartes imprimées rigides organiques, la méthode d’essai de résistance à la chaleur de refusion pour les cartes imprimées rigides organiques, et la méthode d’essai d’aptitude au brasage par refusion pour les pastilles de cartes imprimées rigides organiques dans les applications utilisant des alliages de brasure, qui sont des alliages étain-plomb (Pb) eutectiques ou quasi eutectiques, ou des alliages sans plomb. Les matériaux de ces cartes imprimées rigides organiques sont des feuilles stratifiées renforcées en tissu de verre de type E époxyde, spécifiées dans l'IEC 61249-2 (toutes les parties). Le but du présent document est de garantir l’aptitude au brasage du joint brasé et des pastilles des cartes imprimées. De plus, des méthodes d’essai sont présentées afin d’assurer que les cartes imprimées peuvent résister à la charge de chaleur à laquelle elles sont exposées durant le brasage.

Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne strukture in sestave - 5-601. del: Splošne preskusne metode za materiale in sestave - Preskus zmožnosti valovnega spajkanja za spajkane spoje in preskus toplotne odpornosti za tiskana vezja

General Information

• Status: Published
• Publication Date: 11-Mar-2021
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 12-Mar-2021
• Completion Date: 12-Mar-2021
• Ref Project: SIST EN IEC 61189-5-601:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Standards Content (Sample)

SLOVENSKI STANDARD
01-maj-2021
Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne
strukture in sestave - 5-601. del: Splošne preskusne metode za materiale in
sestave - Preskus zmožnosti valovnega spajkanja za spajkane spoje in preskus
toplotne odpornosti za tiskana vezja
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 5-601: General test methods for materials and assemblies -
Reflow soldering ability test for solder joint, and reflow heat resistance test for printed
boards
Ta slovenski standard je istoveten z: EN IEC 61189-5-601:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61189-5-601

NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2021
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 5-601: General
test methods for materials and assemblies - Reflow soldering
ability test for solder joint, and reflow heat resistance test for
printed boards
(IEC 61189-5-601:2021)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen – Teil 5-
ensembles - Partie 5-601: Méthodes d'essai générales pour 601: Allgemeine Prüfverfahren für Materialien und
les matériaux et les assemblages - Essai d'aptitude au Baugruppen – Prüfverfahren für die Aufschmelz-Lötfähigkeit
brasage par refusion pour un joint brasé, et essai de für Lötverbindungen und die Aufschmelz-
résistance à la chaleur de refusion pour les cartes Lötwärmebeständigkeit von Leiterplatten
imprimées (IEC 61189-5-601:2021)
(IEC 61189-5-601:2021)
This European Standard was approved by CENELEC on 2021-03-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-5-601:2021 E

European foreword
The text of document 91/1601/CDV, future edition 1 of IEC 61189-5-601, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-5-601:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-10
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61189-5-601:2021 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58
IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78
IEC 61188-5-8 NOTE Harmonized as EN 61188-5-8
IEC 61189-5-3 NOTE Harmonized as EN 61189-5-3
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2
IEC 61249 (series) NOTE Harmonized as EN 61249 (series)
IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7
IEC 61249-2-8 NOTE Harmonized as EN 61249-2-8
IEC 61760-1:2006 NOTE Harmonized as EN 61760-1:2006 (not modified)
IEC 62137-1-1 NOTE Harmonized as EN 62137-1-1
IEC 62137-4:2014 NOTE Harmonized as EN 62137-4:2014 (not modified)
Annex ZA
(normative)
Normative references to international publications with their
corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2 series Environmental testing EN 60068-2 series
IEC 60068-2-14 - Environmental testing - Part 2-14: Tests - EN 60068-2-14 -
Test N: Change of temperature
IEC 60191-6-2 - Mechanical standardization of EN 60191-6-2 -
semiconductor devices - Part 6-2: General
rules for the preparation of outline drawings
of surface mounted semiconductor devices
packages - Design guide for 1,50 mm, 1,27
mm and 1,00 mm pitch ball and column
terminal packages
IEC 60191-6-5 - Mechanical standardization of - -
semiconductor devices - Part 6-5: General
rules for the preparation of outline drawings
of surface mounted semiconductor device
packages - Design guide for fine-pitch ball
grid array (FBGA)
IEC 60191-6-19 - Mechanical standardization of EN 60191-6-19 -
semiconductor devices - Part 6-19:
Measurement methods of the package
warpage at elevated temperature and the
maximum permissible warpage
IEC 60194-1 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies
Under preparation. Stage at the time of publication: IEC/FDIS 60194-1:2020.
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61190-1-3 - Attachment materials for electronic EN IEC 61190-1-3 -
assembly - Part 1-3: Requirements for
electronic grade solder alloys and fluxed
and non-fluxed solid solder for electronic
soldering applications
IEC 62137-3 - Electronics assembly technology - Part 3: EN 62137-3 -
Selection guidance of environmental and
endurance test methods for solder joints

IEC 61189-5-601 ®
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 5-601: General test methods for materials and assemblies – Reflow

soldering ability test for solder joint, and reflow heat resistance test for printed

boards
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres

structures d’interconnexion et ensembles –

Partie 5-601: Méthodes d’essai générales pour les matériaux et

les assemblages – Essai d’aptitude au brasage par refusion pour un joint brasé,

et essai de résistance à la chaleur de refusion pour les cartes imprimées

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-9293-8

– 2 – IEC 61189-5-601:2021 © IEC 2021
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 9
4 Grouping of soldering processes and related test severities . 10
5 Specimens . 11
5.1 Devices . 11
5.2 Test substrate . 13
5.3 Solder paste . 13
5.4 Solder ball . 14
6 Apparatus and equipment . 14
6.1 Constant temperature and humidity testing equipment . 14
6.2 Device-mounting equipment . 15
6.3 X-ray transmission equipment . 15
6.4 Electrical resistance recorder . 15
6.5 Warpage measurement equipment . 15
6.6 Temperature cycling chamber . 16
6.7 Pull strength test equipment . 16
7 Tg Solder joint initial quality after reflow . 16
7.1 General . 16
7.2 Specimen preparation . 16
7.3 Pre-process . 16
7.3.1 Pre-conditioning . 16
7.3.2 Initial measurement . 16
7.3.3 Moistening process (1) . 17
7.3.4 Baking and warp correction . 17
7.3.5 Pre-reflow heating . 17
7.3.6 Moistening process (2) . 17
7.4 Assembly process . 17
7.4.1 Solder paste printing . 17
7.4.2 Device mounting . 18
7.4.3 Reflow heating . 21
7.5 Recovery . 22
7.6 Final measurement . 22
8 Tg warpage of component and printed boards in reflow process . 22
8.1 General . 22
8.2 Specimen preparation . 22
8.3 Assembly process . 23
8.3.1 Initial measurement . 23
8.3.2 Baking and warp correction . 23
8.3.3 Pre-reflow heating . 23
8.4 Final measurement .
...