EN IEC 61189-5-601:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts). The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-601: Allgemeine Prüfverfahren für Materialien und Baugruppen - Prüfverfahren für die Aufschmelz-Lötfähigkeit für Lötverbindungen und die Aufschmelz-Lötwärmebeständigkeit von Leiterplatten

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-601: Méthodes d’essai générales pour les matériaux et les assemblages - Essai d’aptitude au brasage par refusion pour un joint brasé, et essai de résistance à la chaleur de refusion pour les cartes imprimées

L'IEC 61189-5-601:2021 spécifie la méthode d’essai d’aptitude au brasage par refusion pour les composants montés sur les cartes imprimées rigides organiques, la méthode d’essai de résistance à la chaleur de refusion pour les cartes imprimées rigides organiques, et la méthode d’essai d’aptitude au brasage par refusion pour les pastilles de cartes imprimées rigides organiques dans les applications utilisant des alliages de brasure, qui sont des alliages étain-plomb (Pb) eutectiques ou quasi eutectiques, ou des alliages sans plomb. Les matériaux de ces cartes imprimées rigides organiques sont des feuilles stratifiées renforcées en tissu de verre de type E époxyde, spécifiées dans l'IEC 61249-2 (toutes les parties). Le but du présent document est de garantir l’aptitude au brasage du joint brasé et des pastilles des cartes imprimées. De plus, des méthodes d’essai sont présentées afin d’assurer que les cartes imprimées peuvent résister à la charge de chaleur à laquelle elles sont exposées durant le brasage.

Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne strukture in sestave - 5-601. del: Splošne preskusne metode za materiale in sestave - Preskus zmožnosti valovnega spajkanja za spajkane spoje in preskus toplotne odpornosti za tiskana vezja

General Information

• Status: Published
• Publication Date: 11-Mar-2021
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 12-Mar-2021
• Completion Date: 12-Mar-2021
• Ref Project: SIST EN IEC 61189-5-601:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 61189-5-601:2021
01-maj-2021
Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne
strukture in sestave - 5-601. del: Splošne preskusne metode za materiale in
sestave - Preskus zmožnosti valovnega spajkanja za spajkane spoje in preskus
toplotne odpornosti za tiskana vezja
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 5-601: General test methods for materials and assemblies -
Reflow soldering ability test for solder joint, and reflow heat resistance test for printed
boards
Ta slovenski standard je istoveten z: EN IEC 61189-5-601:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61189-5-601:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61189-5-601:2021

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SIST EN IEC 61189-5-601:2021


EUROPEAN STANDARD EN IEC 61189-5-601

NORME EUROPÉENNE

EUROPÄISCHE NORM
March 2021
ICS 31.180

English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 5-601: General
test methods for materials and assemblies - Reflow soldering
ability test for solder joint, and reflow heat resistance test for
printed boards
(IEC 61189-5-601:2021)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen – Teil 5-
ensembles - Partie 5-601: Méthodes d'essai générales pour 601: Allgemeine Prüfverfahren für Materialien und
les matériaux et les assemblages - Essai d'aptitude au Baugruppen – Prüfverfahren für die Aufschmelz-Lötfähigkeit
brasage par refusion pour un joint brasé, et essai de für Lötverbindungen und die Aufschmelz-
résistance à la chaleur de refusion pour les cartes Lötwärmebeständigkeit von Leiterplatten
imprimées (IEC 61189-5-601:2021)
(IEC 61189-5-601:2021)
This European Standard was approved by CENELEC on 2021-03-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61189-5-601:2021 E

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SIST EN IEC 61189-5-601:2021
EN IEC 61189-5-601:2021 (E)
European foreword
The text of document 91/1601/CDV, future edition 1 of IEC 61189-5-601, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-5-601:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-10
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61189-5-601:2021 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-58 NOTE Harmonized as EN 60
...