EN 60191-6-2:2002

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.

Mechanische Normung von Halbleiterbauelementen - Teil 6-2: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Gehäuse mit Kugel- und Säulenanschlüssen in einem Raster von 1,50 mm, 1,27 mm und 1,00 mm

Normalisation mécanique des dispositifs à semiconducteurs - Part 6-2: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers à broches en forme de billes et de colonnes, avec des pas de 1,50 mm, 1,27 mm et 1,00 mm

La CEI 60191-6-2:2001 couvre les exigences de préparation des dessins d'encombrement de circuits intégrés pour les divers boîtiers à bornes en forme de billes, par exemple boîtiers matriciels à billes en céramique (C-BGA), boîtiers matriciels à billes en plastique (P-BGA), boîtiers matriciels à billes sur bande (T-BGA) et autres, et aussi boîtiers à bornes en forme de colonnes, par exemple boîtiers matriciels à colonnes en céramique (C-CGA).

Standardizacija mehanskih lastnosti polprevodniških elementov – 6-2. del: Splošna pravila za pripravo tehničnih risb okrovov polprevodniških elementov za površinsko montažo - Vodilo za konstruiranje okrovov s krogličnimi in stebričnimi priključki v rastru 1,50 mm, 1,27 mm in 1,00 mm (IEC 60191-2-6:2001)

General Information

• Status: Published
• Publication Date: 14-Feb-2002
• Withdrawal Date: 31-Jan-2005
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47D - Mechanical standardization of semiconductor devices
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Parallel Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 15-Feb-2002
• Completion Date: 15-Feb-2002
• Ref Project: SIST EN 60191-6-2:2005 - Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Standards Content (Sample)

SLOVENSKI SIST EN 60191-6-2:2005

STANDARD
marec 2005
Standardizacija mehanskih lastnosti polprevodniških elementov – 6-2. del:
Splošna pravila za pripravo tehničnih risb okrovov polprevodniških elementov
za površinsko montažo - Vodilo za konstruiranje okrovov s krogličnimi in
stebričnimi priključki v rastru 1,50 mm, 1,27 mm in 1,00 mm (IEC 60191-2-
6:2001)
Mechanical standardization of semiconductor devices - Part 6-2: General rules for
the preparation of outline drawings of surface mounted semiconductor device
packages - Design guide for 1, 50 mm, 1, 27 mm and 1, 00 mm pitch ball and
column terminal packages (IEC 60191-2-6:2001)
ICS 31.080.01; 31.240 Referenčna številka
SIST EN 60191-6-2:2005(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60191-6-2
NORME EUROPÉENNE
EUROPÄISCHE NORM February 2002
ICS 31.080.01
English version
Mechanical standardization of semiconductor devices
Part 6-2: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages -
Design guide for 1,50 mm, 1,27 mm and 1,00 mm
pitch ball and column terminal packages
(IEC 60191-6-2:2001)
Normalisation mécanique des Mechanische Normung von
disposifs à semiconducteurs Halbleiterbauelementen
Part 6-2: Règles générales pour la Teil 6-2: Allgemeine Regeln für
préparation des dessins d'encombrement die Erstellung von Gehäusezeichnungen
des dispositifs à semiconducteurs pour von SMD-Halbleitergehäusen -
montage en surface - Konstruktionsleitfaden für Gehäuse
Guide de conception pour les boîtiers mit Kugel- und Säulenanschlüssen
à broches en forme de billes in einem Raster von
et de colonnes, avec des pas de 1,50 mm, 1,27 mm und 1,00 mm
1,50 mm, 1,27 mm et 1,00 mm (IEC 60191-6-2:2001)
(CEI 60191-6-2:2001)
This European Standard was approved by CENELEC on 2002-02-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands,
Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-6-2:2002 E

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EN 60191-6-2:2002 - 2 -
Foreword
The text of document 47D/460/FDIS, future edition 1 of IEC 60191-6-2, prepared by SC 47D,
Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was
submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-2 on
2002-02-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2002-11-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-02-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60191-6-2:2001 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 60191-6-2:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates, by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references, the latest edition of the publication referred to applies (including
amendments).
NOTE When an international
...