EN 61188-5-4:2007
(Main)Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
Provides the component and land pattern dimensions for small outline integrated circuits with 'J' leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-4: Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Bauelemente mit J-förmigen Anschlüssen auf zwei Seiten
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-4 : Considérations sur les liaisons pistes- soudures - Composants à sorties en J sur deux côtés
La CEI 61188-5-4:2007 fournit les dimensions des composants et des plages d'accueil des circuits intégrés à faible encombrement ayant des soties en J sur les deux côtés (composants SOJ) utilisés dans le procédé de brasage par fusion. La construction de base des systèmes SOJ est également couverte. L'article 4 énumère les tolérances et les dimensions de référence des joints de brasure utilisés pour parvenir aux dimensions des plages d'accueil.
Tiskane plošče in sestavi tiskanih plošč - Načrtovanje in uporaba - 5-4. del: Zahteve za posamezne dele - Pregledovanje povezav (ploskev/stik) - Komponente z J-vodili na dveh straneh (IEC 61188-5-4:2007)
General Information
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Printed boards and printed board assemblies - Design and use - Part 5-4: Sectional requirements - Attachment (land/joint) consideration - Components with J leads on two sidesCartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-4: Considérations sur les liaisons pistes-soudures - Composants a sorties en J sur deux côtésLeiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-4: Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Bauelemente mit J-förmigen Anschlüssen auf zwei Seiten31.180SORãþHPrinted circuits and boardsICS:SIST EN 61188-5-4:2008en,deTa slovenski standard je istoveten z:EN 61188-5-4:200701-junij-2008SIST EN 61188-5-4:2008SLOVENSKI
STANDARD
EUROPEAN STANDARD EN 61188-5-4 NORME EUROPÉENNE
EUROPÄISCHE NORM November 2007
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2007 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61188-5-4:2007 E
ICS 31.180
English version
Printed boards and printed board assemblies -
Design and use -
Part 5-4: Attachment (land/joint) considerations -
Components with J leads on two sides (IEC 61188-5-4:2007)
Cartes imprimées et
cartes imprimées équipées -
Conception et utilisation -
Partie 5-4: Considérations
sur les liaisons pistes-soudures -
Composants à sorties en J
sur deux côtés (CEI 61188-5-4:2007)
Leiterplatten und Flachbaugruppen -
Konstruktion und Anwendung -
Teil 5-4: Betrachtungen zur Montage (Anschlussfläche/Verbindung) -
Bauelemente mit
J-förmigen Anschlüssen
auf zwei Seiten (IEC 61188-5-4:2007)
This European Standard was approved by CENELEC on 2007-11-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
- 2 -
Foreword The text of document 91/703/FDIS, future edition 1 of IEC 61188-5-4, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61188-5-4 on 2007-11-01. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2008-08-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2010-11-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 61188-5-4:2007 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 61188-5-1 NOTE
Harmonized as EN 61188-5-1:2002 (not modified). IEC 61191-1 NOTE
Harmonized as EN 61191-1:1998 (not modified). IEC 61191-2 NOTE
Harmonized as EN 61191-2:1998 (not modified). __________
- 3 - EN 61188-5-4:2007 Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60068-2-58 -1) Environmental testing -
Part 2-58: Tests - Test Td: Test methods
for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) EN 60068-2-58 + corr. December
20042) 2004
IEC 60286-3 -1) Packaging of components for automatic handling -
Part 3: Packaging of surface mount components on continuous tapes EN 60286-3 20072)
IEC 60286-4 -1) Packaging of components for automatic handling -
Part 4: Stick magazines for electronic components encapsulated in packages
of form E and G EN 60286-4 19982)
IEC 60286-5 -1) Packaging of components for automatic handling -
Part 5: Matrix trays EN 60286-5 20042)
IEC 61760-1 -1) Surface mounting technology -
Part 1: Standard method for the specification of surface mounting components (SMDs) EN 61760-1 20062)
1) Undated reference. 2) Valid edition at date of issue.
IEC 61188-5-4Edition 1.0 2007-10INTERNATIONAL STANDARD
Printed boards and printed board assemblies – Design and use –
Part 5-4: Attachment (land/joint) considerations – Components with J leads on two sides
INTERNATIONAL ELECTROTECHNICAL COMMISSION PICS 31.180 PRICE CODEISBN 2-8318-9341-0
– 2 – 61188-5-4 © IEC:2007(E) CONTENTS FOREWORD.3 INTRODUCTION.5
1 Scope.6 2 Normative references.6 3 General information.6 3.1 General component description.6 3.2 Marking.7 3.3 Packaging.7 3.4 Process considerations.7 4 Small outlined J packages (SOJ).7 4.1 Component description.7 4.2 Component dimensions.8 4.3 Solder joint fillet design.9 4.4 Land pattern dimensions.11
Bibliography.15
Figure 1 – SOJ construction.8 Figure 2 – SOJ component dimensions.9 Figure 3 – Solder joint fillet design.11 Figure 4 – SOJ land pattern dimensions.14
61188-5-4 © IEC:2007(E) – 3 – INTERNATIONAL ELECTROTECHNICAL COMMISSION ___________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-4: Attachment (land/joint) considerations – Components with J leads on two sides
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61188-5-4 has been prepared by IEC technical committee 91: Electronics assembly technology
The text of this standard is based on the following documents: FDIS Report on voting 91/703/FDIS 91/735/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 61188 series, under the general title Printed boards and printed board assemblies – Design and use, can be found on the IEC website.
– 4 – 61188-5-4 © IEC:2007(E) The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be
• reconfirmed; • withdrawn; • replaced by a revised edition, or • amended. A bilingual version of this standard may be issued at a later date.
61188-5-4 © IEC:2007(E) – 5 – INTRODUCTION This part of IEC 61188 covers land pattern for components with J leads on two sides. The proposed land pattern dimensions in this standard are based upon the fundamental tolerance calculation combined with the given land protrusions and courtyard excesses (see IEC 61188-5-1, Generic requirements). The courtyard includes all issues of the normal manufacturing necessities. The unaltered land pattern dimensions of this part are generally applicable for the solder paste application plus reflow soldering process. For application of the wave soldering process (though uncommon for SOJ components) the land pattern and courtyard dimensions may have to be modified. An orientation parallel to the wave direction is strongly recommended and suitably dimensioned solder thieves should be added. This standard offers a threefold land pattern dimensioning (levels 1, 2, 3) on the basis of a threefold set of land protrusions and courtyard excesses: maximum (max.); medium (mdn); and minimum (min.). Nevertheless the user may develop deviating land pattern dimensions based upon the methodology of IEC 61188-5-1, introducing his own special material and assembling process conditions C, F, P and perhaps his own special land protrusions and courtyard excesses dimensions, as required. If a user has good reasons to use a concept different from that of IEC 61188-5-1 or if the user prefers unusual land protrusions, this standard should be used for checking the resulting solder fillets. It is the responsibility of the user to verify his used SMD land patterns for achieving an undisturbed mounting process including testing and an ensured reliability for the product stress conditions in use.
– 6 – 61188-5-4 © IEC:2007(E) PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-4: Attachment (land/joint) considerations – Components with J leads on two sides
1 Scope This part of IEC 61188 provides the component and land pattern dimensions for small outline integrated circuits with “J“ leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For u
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