EN 60068-2-20:2008
(Main)Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-20:2008(E) outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following: - the solder globule test is deleted; - test conditions and requirements for lead-free solders are added.
Umgebungseinflüsse - Teil 2-20: Prüfungen - Prüfung T: Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit von Bauelementen mit herausgeführten Anschlüssen
Essais d'environnement - Partie 2-20: Essais - Essai T: Méthodes d'essai de la brasabilité et de la résistance à la chaleur de brasage des dispositifs à broches
La CEI 60068-2-20:2008 décrit l'essai T qui s'applique aux dispositifs à broches. Les essais de brasage des composants pour montage en surface (CMS) sont décrits dans la CEI 60068-2-58. La présente norme fournit des procédures pour déterminer la brasabilité et la résistance à la chaleur de brasage des dispositifs dans les applications utilisant des alliages de brasure, qui sont soit des brasures étain plomb (Pb) eutectique ou quasi eutectique, soit des alliages de brasure sans plomb. Les procédures de la présente norme incluent les méthodes dites de bain de brasage et de fer à braser. Le but de la présente norme est de s'assurer que les broches des composants ou la brasabilité de leurs extrémités est en mesure de satisfaire aux exigences applicables aux joints de brasures des CEI 61191-3 et 61191-4. De plus, des méthodes d'essai sont fournies pour s'assurer que le corps du composant peut résister à la charge calorifique à laquelle il est exposé pendant le brasage. Les principales modifications techniques par rapport à la quatrième édition sont les suivantes: - l'essai de gouttelette de brasure est supprimé; - des conditions et des exigences d'essai concernant les brasures sans plomb sont ajoutées.
Okoljski preskusi - 2-20. del: Preskusi - Preskus T: Preskusne metode za določanje spajkljivosti in odpornosti proti toploti spajkanja za komponente z izvodi (IEC 60068-2-20:2008)
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Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Umgebungseinflüsse -- Teil 2-20: Prüfungen - Prüfung T: Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit von Bauelementen mit herausgeführten AnschlüssenEssais d'environnement -- Partie 2-20: Essais - Essai T: Méthodes d'essai pour la brasabilité et la résistance à la chaleur de brasage des dispositifs plombésEnvironmental testing -- Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads19.040Preskušanje v zvezi z okoljemEnvironmental testingICS:Ta slovenski standard je istoveten z:EN 60068-2-20:2008SIST EN 60068-2-20:2009en,de01-januar-2009SIST EN 60068-2-20:2009SLOVENSKI
STANDARDSIST HD 323.2.20 S3:20031DGRPHãþD
SIST EN 60068-2-20:2009
EUROPEAN STANDARD EN 60068-2-20 NORME EUROPÉENNE
EUROPÄISCHE NORM September 2008
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2008 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60068-2-20:2008 E
ICS 19.040 Supersedes HD 323.2.20 S3:1988
English version
Environmental testing -
Part 2-20: Tests -
Test T: Test methods for solderability and resistance
to soldering heat of devices with leads (IEC 60068-2-20:2008)
Essais d'environnement -
Partie 2-20: Essais -
Essai T: Méthodes d'essai
pour la brasabilité et la résistance
à la chaleur de brasage
des dispositifs plombés (CEI 60068-2-20:2008)
Umgebungseinflüsse -
Teil 2-20: Prüfungen -
Prüfung T: Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit
von Bauelementen mit herausgeführten Anschlüssen (IEC 60068-2-20:2008)
This European Standard was approved by CENELEC on 2008-08-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
SIST EN 60068-2-20:2009
EN 60068-2-20:2008 – 2 – Foreword The text of document 91/764/FDIS, future edition 5 of IEC 60068-2-20, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60068-2-20 on 2008-08-01. This European Standard supersedes HD 323.2.20 S3:1988. The major technical changes with regard to HD 323.2.20 S3:1988 are the following: – the solder globule test is deleted; – test conditions and requirements for lead-free solders are added.
The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop) 2009-05-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow) 2011-08-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60068-2-20:2008 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-54 NOTE
Harmonized as EN 60068-2-54:2006 (not modified). IEC 60068-2-58 NOTE
Harmonized as EN 60068-2-58:2004 (not modified). IEC 60068-2-69 NOTE
Harmonized as EN 60068-2-69:2007 (not modified). IEC 61190-1-3 NOTE
Harmonized as EN 61190-1-3:2007 (not modified). __________ SIST EN 60068-2-20:2009
– 3 – EN 60068-2-20:2008
Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60068-1 - 1) Environmental testing -
Part 1:
...
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