EN 60068-2-20:2008
(Main)Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-20:2008(E) outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following: - the solder globule test is deleted; - test conditions and requirements for lead-free solders are added.
Umgebungseinflüsse - Teil 2-20: Prüfungen - Prüfung T: Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit von Bauelementen mit herausgeführten Anschlüssen
Essais d'environnement - Partie 2-20: Essais - Essai T: Méthodes d'essai de la brasabilité et de la résistance à la chaleur de brasage des dispositifs à broches
La CEI 60068-2-20:2008 décrit l'essai T qui s'applique aux dispositifs à broches. Les essais de brasage des composants pour montage en surface (CMS) sont décrits dans la CEI 60068-2-58. La présente norme fournit des procédures pour déterminer la brasabilité et la résistance à la chaleur de brasage des dispositifs dans les applications utilisant des alliages de brasure, qui sont soit des brasures étain plomb (Pb) eutectique ou quasi eutectique, soit des alliages de brasure sans plomb. Les procédures de la présente norme incluent les méthodes dites de bain de brasage et de fer à braser. Le but de la présente norme est de s'assurer que les broches des composants ou la brasabilité de leurs extrémités est en mesure de satisfaire aux exigences applicables aux joints de brasures des CEI 61191-3 et 61191-4. De plus, des méthodes d'essai sont fournies pour s'assurer que le corps du composant peut résister à la charge calorifique à laquelle il est exposé pendant le brasage. Les principales modifications techniques par rapport à la quatrième édition sont les suivantes: - l'essai de gouttelette de brasure est supprimé; - des conditions et des exigences d'essai concernant les brasures sans plomb sont ajoutées.
Okoljski preskusi - 2-20. del: Preskusi - Preskus T: Preskusne metode za določanje spajkljivosti in odpornosti proti toploti spajkanja za komponente z izvodi (IEC 60068-2-20:2008)
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Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Umgebungseinflüsse -- Teil 2-20: Prüfungen - Prüfung T: Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit von Bauelementen mit herausgeführten AnschlüssenEssais d'environnement -- Partie 2-20: Essais - Essai T: Méthodes d'essai pour la brasabilité et la résistance à la chaleur de brasage des dispositifs plombésEnvironmental testing -- Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads19.040Preskušanje v zvezi z okoljemEnvironmental testingICS:Ta slovenski standard je istoveten z:EN 60068-2-20:2008SIST EN 60068-2-20:2009en,de01-januar-2009SIST EN 60068-2-20:2009SLOVENSKI
STANDARDSIST HD 323.2.20 S3:20031DGRPHãþD
EUROPEAN STANDARD EN 60068-2-20 NORME EUROPÉENNE
EUROPÄISCHE NORM September 2008
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2008 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60068-2-20:2008 E
ICS 19.040 Supersedes HD 323.2.20 S3:1988
English version
Environmental testing -
Part 2-20: Tests -
Test T: Test methods for solderability and resistance
to soldering heat of devices with leads (IEC 60068-2-20:2008)
Essais d'environnement -
Partie 2-20: Essais -
Essai T: Méthodes d'essai
pour la brasabilité et la résistance
à la chaleur de brasage
des dispositifs plombés (CEI 60068-2-20:2008)
Umgebungseinflüsse -
Teil 2-20: Prüfungen -
Prüfung T: Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit
von Bauelementen mit herausgeführten Anschlüssen (IEC 60068-2-20:2008)
This European Standard was approved by CENELEC on 2008-08-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop) 2009-05-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow) 2011-08-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60068-2-20:2008 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-54 NOTE
Harmonized as EN 60068-2-54:2006 (not modified). IEC 60068-2-58 NOTE
Harmonized as EN 60068-2-58:2004 (not modified). IEC 60068-2-69 NOTE
Harmonized as EN 60068-2-69:2007 (not modified). IEC 61190-1-3 NOTE
Harmonized as EN 61190-1-3:2007 (not modified). __________ SIST EN 60068-2-20:2009
– 3 – EN 60068-2-20:2008
Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60068-1 - 1) Environmental testing -
Part 1: General and guidance EN 60068-1 1994 2)
IEC 60068-2-2 - 1) Environmental testing -
Part 2-2: Tests - Test B: Dry heat EN 60068-2-2 2007 2)
IEC 60068-2-66 - 1) Environmental testing -
Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) EN 60068-2-66 1994 2)
IEC 60068-2-78 - 1) Environmental testing -
Part 2-78: Tests - Test Cab: Damp heat, steady state EN 60068-2-78 2001 2)
IEC 60194 - 1) Printed board design, manufacture and assembly - Terms and definitions EN 60194 2006 2)
IEC 61191-3 - 1) Printed board assemblies -
Part 3: Sectional specification -
Requirements for through-hole mount soldered assemblies EN 61191-3 1998 2)
IEC 61191-4 - 1) Printed board assemblies -
Part 4: Sectional specification -
Requirements for terminal soldered assemblies EN 61191-4 1998 2)
1) Undated reference.
2) Valid edition at date of issue.
IEC 60068-2-20Edition 5.0 2008-07INTERNATIONAL STANDARD
Environmental testing –
Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads
INTERNATIONAL ELECTROTECHNICAL COMMISSION RICS 19.040 PRICE CODEISBN 2-8318-9919-2
– 2 – 60068-2-20 © IEC:2008(E) CONTENTS FOREWORD.4 1 Scope and object.6 2 Normative references.6 3 Terms and definitions.7 4 Test Ta: Solderability of wire and tag terminations.8 4.1 Object and general description of the test.8 4.1.1 Test methods.8 4.1.2 Specimen preparation.8 4.1.3 Initial measurements.9 4.1.4 Accelerated ageing.9 4.2 Method 1: Solder bath.9 4.2.1 Description of the solder bath.9 4.2.2 Flux.10 4.2.3 Procedure.10 4.2.4 Test conditions.10 4.2.5 Final measurements and requirements.11 4.3 Method 2: Soldering iron at 350 °C.11 4.3.1 Description of soldering irons.11 4.3.2 Solder and flux.12 4.3.3 Procedure.12 4.3.4 Final measurements and requirements.13 4.4 Information to be given in the relevant specification.13 5 Test Tb: Resistance to soldering heat.13 5.1 Object and general description of the test.13 5.1.1 Test methods.13 5.1.2 Initial measurements.14 5.2 Method 1: Solder bath.14 5.2.1 Description of the solder bath.14 5.2.2 Flux.14 5.2.3 Procedure.14 5.2.4 Test conditions.14 5.2.5 De-wetting.15 5.3 Method 2: Soldering iron.15 5.3.1 Description of soldering iron.15 5.3.2 Solder and flux.15 5.3.3 Procedure.15 5.4 Recovery.16 5.5 Final measurements and requirements.16 5.6 De-wetting (if applicable).16 5.7 Information to be given in the relevant specification.17 Annex A (informative) Example of apparatus for accelerated steam ageing process.18 Annex B (normative) Specification for flux constituents.19 Bibliography.20
Figure 1 – Diagram of contact angle.7 SIST EN 60068-2-20:2009
60068-2-20 © IEC:2008(E) – 3 – Figure 2 – Position of soldering iron.12 Figure A.1 – Example of apparatus.18
Table 1 – Solderability, Solder bath method: Test severities (duration and temperature).11 Table 2 – Resistance to soldering heat, Solder bath method: Test severities (duration and temperature).15
– 4 – 60068-2-20 © IEC:2008(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
ENVIRONMENTAL TESTING –
Part 2-20: Tests –
Test T: Test methods for solderability and resistance to soldering heat of devices with leads
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cit
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