EN 60068-2-69:2017

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb). This edition includes the following significant technical changes with respect to the previous edition: - integration of IEC 60068-2-54; - inclusion of tests of printed boards; - inclusion of new component types, and updating test parameters for the whole component list; - inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.

Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung Te/TC: Prüfung der Lötbarkeit von Bauelementen der Elektronik und Leiterplatten mit der Benetzungswaage (Kraftmessung)

Essais d'environnement - Partie 2-69: Essais - Essai Te/Tc: Essai de brasabilité des composants électroniques et cartes imprimées par la méthode de la balance de mouillage (mesure de la force)

L'IEC 60068-2-69:2017 spécifie l'essai Te/Tc, la méthode de la balance de mouillage au bain de brasure et la méthode de la balance de mouillage à la goutte de brasure, pour déterminer quantitativement la brasabilité des sorties. Ces méthodes ne servent pas à fournir des données quantitatives absolues utilisées dans le cadre d'acception ou de rejet. Les modes opératoires décrivent la méthode de la balance de mouillage au bain de brasure ainsi que la méthode de la balance de mouillage à la goutte de brasure. Ces deux méthodes sont applicables aux composants et aux cartes imprimées munis de sorties métalliques et de plots de brasage métallisés. Le présent document fournit les modes opératoires de mesure pour les alliages de brasage avec et sans plomb (Pb). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - intégration de l'IEC 60068-2-54; - introduction d'essais de cartes imprimées; - intégration de nouveaux types de composants et actualisation des paramètres d'essai pour la liste complète des composants; - introduction d'un nouveau protocole d'essai R&R de jauge pour assurer que la balance de mouillage est correctement étalonnée.

Okoljski preskusi - 2-69. del: Preskusi - Preskus Te/Tc: Preskus spajkanja elektronskih komponent in plošč tiskanih vezij z metodo za določanje omočljivosti (merjenje sile)

Ta del standarda IEC 60068 opisuje preskus Te/Tc, preskus z metodo za določanje omočljivosti s spajkalno kopeljo in spajkalno kroglico za količinsko določanje spajkanja elektronskih komponent in plošč tiskanjih vezij. Podatki, pridobljeni s tema metodama, niso namenjeni za uporabo kot absolutni količinski podatki za določanje uspešno ali neuspešno opravljenega preskusa.
Postopka opisujeta metodo ravnotežja pri mokri kopeli in metodo določanja omočljivosti s spajkalno kopeljo in spajkalno kroglico. Uporabljata se za komponente in plošče tiskanjih vezij s kovinskimi zaključki in metaliziranimi spajkami.
Ta dokument določa merilne postopke za spajkalne zlitine s svincem (Pb) in brez njega.

General Information

• Status: Published
• Publication Date: 01-Jun-2017
• Withdrawal Date: 10-Apr-2020
• ICS: 19.040 - Environmental testing
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 02-Jun-2017
• Completion Date: 02-Jun-2017
• Ref Project: SIST EN 60068-2-69:2017 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Relations

• Replaces: EN 60068-2-54:2006 - Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
• Effective Date: 06-Jun-2017
• Replaces: EN 60068-2-69:2007 - Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
• Effective Date: 06-Jun-2017
• Amended By: EN 60068-2-69:2017/A1:2019 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
• Effective Date: 20-Mar-2018
• Corrected By: EN 60068-2-69:2017/AC:2018-03 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
• Effective Date: 06-Feb-2018

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2017
1DGRPHãþD
SIST EN 60068-2-54:2006
SIST EN 60068-2-69:2008
2NROMVNLSUHVNXVLGHO3UHVNXVL3UHVNXV7H7F3UHVNXVVSDMNDQMD
HOHNWURQVNLKNRPSRQHQWLQSORãþWLVNDQLKYH]LM]PHWRGR]DGRORþDQMHRPRþOMLYRVWL
PHUMHQMHVLOH
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic
components and printed boards by the wetting balance (force measurement) method
Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung Te: Prüfung der Lötbarkeit von
Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage
Essais d'environnement - Partie 2-69: Essais - Essai Te: Essai de brasabilité des
composants électroniques pour les composants montés en surface (CMS) par la
méthode de la balance de mouillage
Ta slovenski standard je istoveten z: EN 60068-2-69:2017
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 60068-2-69

NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2017
ICS 19.040; 31.190 Supersedes EN 60068-2-54:2006, EN 60068-2-69:2007
English Version
Environmental testing -
Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic
components and printed boards by the wetting balance (force
measurement) method
(IEC 60068-2-69:2017)
Essais d'environnement -  Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung
Partie 2-69: Essais - Essai Te/Tc: Essai de brasabilité des Te/TC: Prüfung der Lötbarkeit von Bauelementen der
composants électroniques et cartes imprimées par la Elektronik und Leiterplatten mit der Benetzungswaage
méthode de la balance de mouillage (mesure de la force) (Kraftmessung)
(IEC 60068-2-69:2017) (IEC 60068-2-69:2017)
This European Standard was approved by CENELEC on 2017-04-11. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 60068-2-69:2017 E
European foreword
The text of document 91/1405/FDIS, future edition 3 of IEC 60068-2-69, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 60068-2-69:2017.

The following dates are fixed:
(dop) 2018-01-11
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2020-04-11
standards conflicting with the
document have to be withdrawn
This document supersedes EN 60068-2-69:2007 and EN 60068-2-54:2006.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 60068-2-69:2017 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-3-13:2016 NOTE Harmonized as EN 60068-3-13:2016 (not modified).
IEC 61190-1-1:2002 NOTE Harmonized as EN 61190-1-1:2002 (not modified).
ISO 9453:2014 NOTE Harmonized as EN ISO 9453:2014 (not modified).
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu
Publication Year Title EN/HD Year

IEC 60068-1 -  Environmental testing - EN 60068-1 -
Part 1: General and guidance
IEC 60068-2-2 -  Environmental testing - EN 60068-2-2 -
Part 2-2: Tests - Test B: Dry heat
IEC 60068-2-20 2008 Environmental testing - EN 60068-2-20 2008
Part 2-20: Tests - Test T: Test methods
for solderability and resistance to soldering
heat of devices with leads
IEC 60068-2-66 -  Environmental testing - EN 60068-2-66 -
Part 2-66: Test methods - Test Cx: Damp
heat, steady state (unsaturated
pressurized vapour)
IEC 61190-1-3 2007 Attachment materials for electronic EN 61190-1-3 2007
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed
solid solders for electronic soldering
applications
+A1 2010  +A1 2010
1)
ISO 683 Series Heat treatable steels, alloy steels and EN ISO 683 Series
free-cutting steels
ISO 6362 Series Wrought aluminium and aluminium alloys - -
extruded rods/bars, tubes and profiles

1)
At draft stage.
IEC 60068-2-69 ®
Edition 3.0 2017-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components

and printed boards by the wetting balance (force measurement) method

Essais d'environnement –
Partie 2-69: Essais – Essai Te/Tc: Essai de brasabilité des composants

électroniques et cartes imprimées par la méthode de la balance de mouillage

(mesure de la force)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 19.040; 31.190 ISBN 978-2-8322-3994-0

– 2 – IEC 60068-2-69:2017 © IEC 2017

CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 General description of the method . 8
4.1 General . 8
4.2 Components . 8
4.3 Printed boards . 8
4.4 Measurement . 8
5 Description of the test apparatus . 8
6 Preparation of specimens . 10
6.1 Cleaning . 10
6.2 Preconditioning . 10
7 Materials . 11
7.1 Solder . 11
7.1.1 General . 11
7.1.2 Solder alloy containing lead . 11
7.1.3 Lead-free solder alloy . 11
7.1.4 Solder contamination control . 11
7.1.5 Solder mass for solder globule wetting balance method . 12
7.2 Flux . 13
7.2.1 Rosin based flux . 13
7.2.2 Flux maintenance . 13
7.2.3 Test flux selection criteria . 13
8 Procedure . 13
8.1 Test temperature . 13
8.1.1 Solder alloy containing lead . 13
8.1.2 Lead-free solder alloy . 13
8.2 Test procedure . 13
8.2.1 Applicable test procedure . 13
8.2.2 Solder bath wetting balance procedure . 14
8.2.3 Solder globule wetting balance procedure. 17
8.2.4 Procedure for testing printed board specimens . 20
9 Presentation of results . 21
9.1 Form of force versus time trace . 21
9.2 Test requirements . 22
10 Information to be given in the relevant specification . 23
Annex A (normative) Equipment specification . 24
A.1 Characteristics of the apparatus . 24
A.2 Solder bath . 24
A.3 Globule support blocks . 25
Annex B (informative) Use of the wetting balance for SMD solderability testing. 26
B.1 Definition of the measure of solderability . 26
B.2 Gauge R&R – Test protocol for wetting balance gauge repeatability and
reproducibility using copper foil coupons . 26

IEC 60068-2-69:2017 © IEC 2017 – 3 –
B.2.1 Test coupon . 26
B.2.2 Test parameters . 27
B.2.3 Known good coupon . 27
B.3 Solder globule mass and pin size . 28
B.4 Specimen orientation and immersion depth . 28
B.4.1 General . 28
B.4.2 Resistors and capacitors . 29
B.4.3 Small-leaded components . 29
B.4.4 Multi-leaded devices . 29
B.5 Test flux .
...