Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb). This edition includes the following significant technical changes with respect to the previous edition: - integration of IEC 60068-2-54; - inclusion of tests of printed boards; - inclusion of new component types, and updating test parameters for the whole component list; - inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.

Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung Te/TC: Prüfung der Lötbarkeit von Bauelementen der Elektronik und Leiterplatten mit der Benetzungswaage (Kraftmessung)

Essais d'environnement - Partie 2-69: Essais - Essai Te/Tc: Essai de brasabilité des composants électroniques et cartes imprimées par la méthode de la balance de mouillage (mesure de la force)

L'IEC 60068-2-69:2017 spécifie l'essai Te/Tc, la méthode de la balance de mouillage au bain de brasure et la méthode de la balance de mouillage à la goutte de brasure, pour déterminer quantitativement la brasabilité des sorties. Ces méthodes ne servent pas à fournir des données quantitatives absolues utilisées dans le cadre d'acception ou de rejet. Les modes opératoires décrivent la méthode de la balance de mouillage au bain de brasure ainsi que la méthode de la balance de mouillage à la goutte de brasure. Ces deux méthodes sont applicables aux composants et aux cartes imprimées munis de sorties métalliques et de plots de brasage métallisés. Le présent document fournit les modes opératoires de mesure pour les alliages de brasage avec et sans plomb (Pb). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: - intégration de l'IEC 60068-2-54; - introduction d'essais de cartes imprimées; - intégration de nouveaux types de composants et actualisation des paramètres d'essai pour la liste complète des composants; - introduction d'un nouveau protocole d'essai R&R de jauge pour assurer que la balance de mouillage est correctement étalonnée.

Okoljski preskusi - 2-69. del: Preskusi - Preskus Te/Tc: Preskus spajkanja elektronskih komponent in plošč tiskanih vezij z metodo za določanje omočljivosti (merjenje sile)

Ta del standarda IEC 60068 opisuje preskus Te/Tc, preskus z metodo za določanje omočljivosti s spajkalno kopeljo in spajkalno kroglico za količinsko določanje spajkanja elektronskih komponent in plošč tiskanjih vezij. Podatki, pridobljeni s tema metodama, niso namenjeni za uporabo kot absolutni količinski podatki za določanje uspešno ali neuspešno opravljenega preskusa.
Postopka opisujeta metodo ravnotežja pri mokri kopeli in metodo določanja omočljivosti s spajkalno kopeljo in spajkalno kroglico. Uporabljata se za komponente in plošče tiskanjih vezij s kovinskimi zaključki in metaliziranimi spajkami.
Ta dokument določa merilne postopke za spajkalne zlitine s svincem (Pb) in brez njega.

General Information

Status
Published
Publication Date
01-Jun-2017
Current Stage
6060 - Document made available
Due Date
02-Jun-2017
Completion Date
02-Jun-2017

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SLOVENSKI STANDARD
SIST EN 60068-2-69:2017
01-september-2017
1DGRPHãþD
SIST EN 60068-2-54:2006
SIST EN 60068-2-69:2008
2NROMVNLSUHVNXVLGHO3UHVNXVL3UHVNXV7H7F3UHVNXVVSDMNDQMD

HOHNWURQVNLKNRPSRQHQWLQSORãþWLVNDQLKYH]LM]PHWRGR]DGRORþDQMHRPRþOMLYRVWL

PHUMHQMHVLOH

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic

components and printed boards by the wetting balance (force measurement) method

Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung Te: Prüfung der Lötbarkeit von

Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage

Essais d'environnement - Partie 2-69: Essais - Essai Te: Essai de brasabilité des

composants électroniques pour les composants montés en surface (CMS) par la
méthode de la balance de mouillage
Ta slovenski standard je istoveten z: EN 60068-2-69:2017
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 60068-2-69:2017 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN 60068-2-69:2017
---------------------- Page: 2 ----------------------
SIST EN 60068-2-69:2017
EUROPEAN STANDARD EN 60068-2-69
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2017
ICS 19.040; 31.190 Supersedes EN 60068-2-54:2006, EN 60068-2-69:2007
English Version
Environmental testing -
Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic
components and printed boards by the wetting balance (force
measurement) method
(IEC 60068-2-69:2017)
Essais d'environnement - Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung

Partie 2-69: Essais - Essai Te/Tc: Essai de brasabilité des Te/TC: Prüfung der Lötbarkeit von Bauelementen der

composants électroniques et cartes imprimées par la Elektronik und Leiterplatten mit der Benetzungswaage

méthode de la balance de mouillage (mesure de la force) (Kraftmessung)
(IEC 60068-2-69:2017) (IEC 60068-2-69:2017)

This European Standard was approved by CENELEC on 2017-04-11. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,

Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels

© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN 60068-2-69:2017 E
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SIST EN 60068-2-69:2017
EN 60068-2-69:2017
European foreword

The text of document 91/1405/FDIS, future edition 3 of IEC 60068-2-69, prepared by

IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and

approved by CENELEC as EN 60068-2-69:2017.
The following dates are fixed:
(dop) 2018-01-11
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2020-04-11
standards conflicting with the
document have to be withdrawn
This document supersedes EN 60068-2-69:2007 and EN 60068-2-54:2006.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 60068-2-69:2017 was approved by CENELEC as a

European Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-3-13:2016 NOTE Harmonized as EN 60068-3-13:2016 (not modified).
IEC 61190-1-1:2002 NOTE Harmonized as EN 61190-1-1:2002 (not modified).
ISO 9453:2014 NOTE Harmonized as EN ISO 9453:2014 (not modified).
---------------------- Page: 4 ----------------------
SIST EN 60068-2-69:2017
EN 60068-2-69:2017
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are

indispensable for its application. For dated references, only the edition cited applies. For undated

references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:

www.cenelec.eu
Publication Year Title EN/HD Year
IEC 60068-1 - Environmental testing - EN 60068-1 -
Part 1: General and guidance
IEC 60068-2-2 - Environmental testing - EN 60068-2-2 -
Part 2-2: Tests - Test B: Dry heat
IEC 60068-2-20 2008 Environmental testing - EN 60068-2-20 2008
Part 2-20: Tests - Test T: Test methods
for solderability and resistance to soldering
heat of devices with leads
IEC 60068-2-66 - Environmental testing - EN 60068-2-66 -
Part 2-66: Test methods - Test Cx: Damp
heat, steady state (unsaturated
pressurized vapour)
IEC 61190-1-3 2007 Attachment materials for electronic EN 61190-1-3 2007
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed
solid solders for electronic soldering
applications
+A1 2010 +A1 2010
ISO 683 Series Heat treatable steels, alloy steels and EN ISO 683 Series
free-cutting steels
ISO 6362 Series Wrought aluminium and aluminium alloys - -
extruded rods/bars, tubes and profiles
At draft stage.
---------------------- Page: 5 ----------------------
SIST EN 60068-2-69:2017
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SIST EN 60068-2-69:2017
IEC 60068-2-69
Edition 3.0 2017-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components
and printed boards by the wetting balance (force measurement) method
Essais d'environnement –
Partie 2-69: Essais – Essai Te/Tc: Essai de brasabilité des composants
électroniques et cartes imprimées par la méthode de la balance de mouillage
(mesure de la force)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 19.040; 31.190 ISBN 978-2-8322-3994-0

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN 60068-2-69:2017
– 2 – IEC 60068-2-69:2017 © IEC 2017
CONTENTS

FOREWORD ........................................................................................................................... 5

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms and definitions ...................................................................................................... 7

4 General description of the method ................................................................................... 8

4.1 General ................................................................................................................... 8

4.2 Components ........................................................................................................... 8

4.3 Printed boards ........................................................................................................ 8

4.4 Measurement .......................................................................................................... 8

5 Description of the test apparatus ..................................................................................... 8

6 Preparation of specimens .............................................................................................. 10

6.1 Cleaning ............................................................................................................... 10

6.2 Preconditioning ..................................................................................................... 10

7 Materials ....................................................................................................................... 11

7.1 Solder ................................................................................................................... 11

7.1.1 General ......................................................................................................... 11

7.1.2 Solder alloy containing lead ........................................................................... 11

7.1.3 Lead-free solder alloy .................................................................................... 11

7.1.4 Solder contamination control ......................................................................... 11

7.1.5 Solder mass for solder globule wetting balance method ................................. 12

7.2 Flux ...................................................................................................................... 13

7.2.1 Rosin based flux ............................................................................................ 13

7.2.2 Flux maintenance .......................................................................................... 13

7.2.3 Test flux selection criteria .............................................................................. 13

8 Procedure ...................................................................................................................... 13

8.1 Test temperature .................................................................................................. 13

8.1.1 Solder alloy containing lead ........................................................................... 13

8.1.2 Lead-free solder alloy .................................................................................... 13

8.2 Test procedure ...................................................................................................... 13

8.2.1 Applicable test procedure .............................................................................. 13

8.2.2 Solder bath wetting balance procedure .......................................................... 14

8.2.3 Solder globule wetting balance procedure...................................................... 17

8.2.4 Procedure for testing printed board specimens .............................................. 20

9 Presentation of results ................................................................................................... 21

9.1 Form of force versus time trace ............................................................................. 21

9.2 Test requirements ................................................................................................. 22

10 Information to be given in the relevant specification ....................................................... 23

Annex A (normative) Equipment specification ...................................................................... 24

A.1 Characteristics of the apparatus ............................................................................ 24

A.2 Solder bath ........................................................................................................... 24

A.3 Globule support blocks ......................................................................................... 25

Annex B (informative) Use of the wetting balance for SMD solderability testing.................... 26

B.1 Definition of the measure of solderability .............................................................. 26

B.2 Gauge R&R – Test protocol for wetting balance gauge repeatability and

reproducibility using copper foil coupons ............................................................... 26

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SIST EN 60068-2-69:2017
IEC 60068-2-69:2017 © IEC 2017 – 3 –

B.2.1 Test coupon ................................................................................................... 26

B.2.2 Test parameters ............................................................................................ 27

B.2.3 Known good coupon ...................................................................................... 27

B.3 Solder globule mass and pin size .......................................................................... 28

B.4 Specimen orientation and immersion depth ........................................................... 28

B.4.1 General ......................................................................................................... 28

B.4.2 Resistors and capacitors ............................................................................... 29

B.4.3 Small-leaded components .............................................................................. 29

B.4.4 Multi-leaded devices ...................................................................................... 29

B.5 Test flux ................................................................................................................ 30

B.6 Test temperature .................................................................................................. 30

B.6.1 Solder alloy containing lead ........................................................................... 30

B.6.2 Solder alloy without lead ................................................................................ 31

B.7 Characteristics of the test apparatus ..................................................................... 31

B.7.1 Recording device ........................................................................................... 31

B.7.2 Balance system ............................................................................................. 32

B.7.3 Lifting mechanism and controls ...................................................................... 32

B.7.4 Parameters to be measured from the force-time trace .................................... 37

B.7.5 Reference wetting force ................................................................................. 37

B.7.6 Equipment location ........................................................................................ 38

B.7.7 Globule pins .................................................................................................. 38

B.7.8 Globule modules ............................................................................................ 38

B.8 Test flux – IPC-J-STD-002/J-STD-003 activated solderability test flux

rationale committee letter ...................................................................................... 38

B.8.1 General ......................................................................................................... 38

B.8.2 Proactive solderability testing approach to the implementation of non-tin

finishes .......................................................................................................... 39

B.8.3 Reduced solderability test variability .............................................................. 39

B.8.4 Standardization of solderability test flux composition on a global scale .......... 39

Annex C (normative) Test methods for SMD components sizes 0603M (0201) or

smaller .................................................................................................................................. 40

C.1 General ................................................................................................................. 40

C.2 General description of the test method .................................................................. 40

C.3 Preconditioning ..................................................................................................... 40

C.3.1 Preparation of the specimens ........................................................................ 40

C.3.2 Ageing ........................................................................................................... 40

C.4 Materials ............................................................................................................... 40

C.4.1 Solder ............................................................................................................ 40

C.4.2 Flux ............................................................................................................... 41

C.5 Method 1............................................................................................................... 41

C.5.1 Description of the test apparatus ................................................................... 41

C.5.2 Procedures .................................................................................................... 41

C.5.3 Presentation of results ................................................................................... 44

C.5.4 Information to be given in the relevant specification ....................................... 45

C.6 Method 2............................................................................................................... 46

C.6.1 Test apparatus .............................................................................................. 46

C.6.2 Observation equipment .................................................................................. 46

C.6.3 Test method 2 ............................................................................................... 46

C.6.4 Presentation of results ................................................................................... 47

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SIST EN 60068-2-69:2017
– 4 – IEC 60068-2-69:2017 © IEC 2017

Annex D (informative) Evaluation criteria – Guidance .......................................................... 48

D.1 General considerations ......................................................................................... 48

D.2 Evaluation criteria for components ........................................................................ 48

D.3 Evaluation criteria for printed boards..................................................................... 49

Annex E (informative) Method of calculating the maximum theoretical force and

integrated value of the area of the wetting curve for leaded non-SMD ................................... 50

E.1 Method of calculating the maximum theoretical force ............................................ 50

E.2 Method of calculating the integrated value of the area of the wetting curve ........... 50

Bibliography .......................................................................................................................... 52

Figure 1 – Arrangement for the test apparatus (solder bath wetting balance method) .............. 9

Figure 2 – Arrangement for the test apparatus (solder globule wetting balance method) ......... 9

Figure 3 – Immersion conditions for solder bath method ....................................................... 16

Figure 4 – Immersion conditions for solder globule method ................................................... 19

Figure 5 – Suggested wetting balance test specimens and soldering immersion ................... 20

Figure 6 – Printed board immersion ...................................................................................... 21

Figure 7 – Typical wetting balance trace ............................................................................... 22

Figure B.1 – Understanding wetting curves ........................................................................... 35

Figure B.2 – Typical wetting curve ........................................................................................ 35

Figure B.3 – Representative force-time curves ...................................................................... 36

Figure C.1 – Cross-section of aluminium body ...................................................................... 41

Figure C.2 – Dipping position and relative position ................................................................ 42

Figure C.3 – Time and test sequence .................................................................................... 44

Figure C.4 – Typical wetting balance trace ............................................................................ 45

Figure D.1 – Set A wetting curve ........................................................................................... 49

Figure D.2 – Set B wetting curve ........................................................................................... 49

Table 1 – Preconditioning ..................................................................................................... 10

Table 2 – Maximum limits of solder bath contaminants .......................................................... 12

Table 3 – Globule and pellet sizes ........................................................................................ 12

Table 4 – Rosin based flux compositions .............................................................................. 13

Table 5 – Recommended solder bath wetting balance test conditions ................................... 15

Table 6 – Time sequence of the test (solder bath)................................................................. 17

Table 7 – Recommended solder globule wetting balance test conditions ............................... 18

Table 8 – Time sequence of the test (solder globule) ............................................................ 20

Table B.1 – Carboxylic acid based flux (water solution) ........................................................ 30

Table B.2 – Carboxylic acid based flux (alcohol solution) ...................................................... 30

Table C.1 – Time sequence of the test procedure ................................................................. 43

Table D.1 – Wetting balance parameter and suggested evaluation criteria ............................ 48

Table D.2 – Printed board test parameter and suggested criteria .......................................... 49

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SIST EN 60068-2-69:2017
IEC 60068-2-69:2017 © IEC 2017 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL TESTING –
Part 2-69: Tests – Test Te/Tc: Solderability testing of
electronic components and printed boards
by the wetting balance (force measurement) method
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60068-2-69 has been prepared by IEC technical committee 91:

Electronics assembly technology.

This third edition cancels and replaces the second edition published in 2007 as well as the

second edition of IEC 60068-2-54 published in 2006 and constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
• integration of IEC 60068-2-54;
• inclusion of tests of printed boards;

• inclusion of new component types, and updating test parameters for the whole component

list;
---------------------- Page: 11 ----------------------
SIST EN 60068-2-69:2017
– 6 – IEC 60068-2-69:2017 © IEC 2017

• inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance

equipment is correctly calibrated.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1405/FDIS 91/1426/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 60068 series, under the general title Environmental testing, can be

found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 12 ----------------------
SIST EN 60068-2-69:2017
IEC 60068-2-69:2017 © IEC 2017 – 7 –
ENVIRONMENTAL TESTING –
Part 2-69: Tests – Test Te/Tc: Solderability testing of
electronic components and printed boards
by the wetting balance (force measurement) method
1 Scope

This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the

solder globule wetting balance method to determine, quantitatively, the solderability of the

terminations. Data obtained by these methods are not intended to be used as absolute

quantitative data for pass–fail purposes.
The procedures desc
...

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