Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung Te/Tc: Prüfung der Lötbarkeit von Bauelementen der Elektronik und Leiterplatten mit der Benetzungswaage (Kraftmessung)

Essais d'environnement - Partie 2-69: Essais - Essai Te/Tc: Essai de brasabilité des composants électroniques et cartes imprimées par la méthode de la balance de mouillage (mesure de la force)

Okoljski preskusi - 2-69. del: Preskusi - Preskus Te/Tc: Preskus spajkanja elektronskih komponent in plošč tiskanih vezij z metodo za določanje omočljivosti (merjenje sile)

General Information

Status
Published
Publication Date
22-Aug-2019
Current Stage
6060 - Document made available
Due Date
28-Dec-2020

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EN 60068-2-69:2017/A1:2021
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Standards Content (sample)

SLOVENSKI STANDARD
SIST EN 60068-2-69:2017/A1:2021
01-junij-2021
Okoljski preskusi - 2-69. del: Preskusi - Preskus Te/Tc: Preskus spajkanja

elektronskih komponent in plošč tiskanih vezij z metodo za določanje omočljivosti

(merjenje sile)

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic

components and printed boards by the wetting balance (force measurement) method

Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung Te/TC: Prüfung der Lötbarkeit von

Bauelementen der Elektronik und Leiterplatten mit der Benetzungswaage
(Kraftmessung)

Essais d'environnement - Partie 2-69: Essais - Essai Te/Tc: Essai de brasabilité des

composants électroniques et cartes imprimées par la méthode de la balance de
mouillage (mesure de la force)
Ta slovenski standard je istoveten z: EN 60068-2-69:2017/A1:2019
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 60068-2-69:2017/A1:2021 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN 60068-2-69:2017/A1:2021
---------------------- Page: 2 ----------------------
SIST EN 60068-2-69:2017/A1:2021
EUROPEAN STANDARD EN 60068-2-69:2017/A1
NORME EUROPÉENNE
EUROPÄISCHE NORM
August 2019
ICS 19.040; 31.190
English Version
Environmental testing - Part 2-69: Tests - Test Te/Tc:
Solderability testing of electronic components and printed boards
by the wetting balance (force measurement) method
(IEC 60068-2-69:2017/A1:2019)

Essais d'environnement - Partie 2-69: Essais - Essai Te/Tc: Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung

Essai de brasabilité des composants électroniques et cartes Te/TC: Prüfung der Lötbarkeit von Bauelementen der

imprimées par la méthode de la balance de mouillage Elektronik und Leiterplatten mit der Benetzungswaage

(mesure de la force) (Kraftmessung)
(IEC 60068-2-69:2017/A1:2019) (IEC 60068-2-69:2017/A1:2019)

This amendment A1 modifies the European Standard EN 60068-2-69:2017; it was approved by CENELEC on 2019-07-24. CENELEC

members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this amendment the

status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This amendment exists in three official versions (English, French, German). A version in any other language made by translation under the

responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as

the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN 60068-2-69:2017/A1:2019 E
---------------------- Page: 3 ----------------------
SIST EN 60068-2-69:2017/A1:2021
EN 60068-2-69:2017/A1:2019 (E)
European foreword

The text of document 91/1566/FDIS, future IEC 60068-2-69/A1, prepared by IEC/TC 91 "Electronics

assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC

as EN 60068-2-69:2017/A1:2019.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2020-04-24

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2022-07-24

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 60068-2-69:2017/A1:2019 was approved by CENELEC as

a European Standard without any modification.
---------------------- Page: 4 ----------------------
SIST EN 60068-2-69:2017/A1:2021
IEC 60068-2-69
Edition 3.0 2019-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
A MENDMENT 1
AM ENDEMENT 1
Environmental testing –
Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components
and printed boards by the wetting balance (force measurement) method
Essais d'environnement –
Partie 2-69: Essais – Essai Te/Tc: Essai de brasabilité des composants
électroniques et cartes imprimées par la méthode de la balance de mouillage
(mesure de la force)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 19.040; 31.190 ISBN 978-2-8322-0000-0

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 5 ----------------------
SIST EN 60068-2-69:2017/A1:2021
– 2 – IEC 60068-2-69:2017/AMD1:2019
 IEC 2019
FOREWORD

This amendment has been prepared by IEC technical committee 91: Electronics assembly

technology.
The text of this amendment is based on the following documents:
FDIS Report on voting
91/1566/FDIS 91/1580/RVD

Full information on the voting for the approval of this amendment can be found in the report

on voting indicated in the above table.

The committee has decided that the contents of this amendment and the base publication will

remain unchanged until the stability date indicated on the IEC website under

"http://webstore.iec.ch" in the data related to the specific publication. At this date, the

publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________

Figure 2 – Arrangement for the test apparatus (solder globule wetting balance method)

Replace key item 2 for with "G
...

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