EN 60191-6:2004

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Gives general rules for the preparation of outlines drawings of surface-mounted semiconductor devices. It supplements EN 60191-1 and 60191-3. It covers all surface-mounted discrete semiconductors devices as well as integrated circuits classified as form E.

Mechanische Normung von Halbleiterbauelementen - Teil 6: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface

Gives general rules for the preparation of outlines drawings of surface-mounted semiconductor devices. It supplements EN 60191-1 and 60191-3. It covers all surface-mounted discrete semiconductors devices as well as integrated circuits classified as form E.

Standardizacija mehanskih lastnosti polprevodniških elementov – 6. del: Splošna pravila za pripravo tehničnih risb okrovov površinsko nameščenih polprevodniških elementov (IEC 60191-6:2004)

General Information

• Status: Withdrawn
• Publication Date: 07-Dec-2004
• Withdrawal Date: 30-Sep-2007
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47D - Mechanical standardization of semiconductor devices
• Drafting Committee: IEC/SC 47D - IEC_SC_47D
• Parallel Committee: IEC/SC 47D - IEC_SC_47D
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Completion Date: 01-Dec-2012
• Ref Project: SIST EN 60191-6:2005 - Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Relations

• Replaced By: EN 60191-6:2009 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 60191-6:2005

STANDARD
december 2005
Standardizacija mehanskih lastnosti polprevodniških elementov – 6. del:
Splošna pravila za pripravo tehničnih risb okrovov površinsko nameščenih
polprevodniških elementov (IEC 60191-6:2004)
Mechanical standardization of semiconductor devices – Part 6: General rules for
the preparation of outline drawings of surface mounted semiconductor device
packages (IEC 60191-6:2004)
ICS 01.100.25; 31.080.01; 31.240 Referenčna številka
SIST EN 60191-6:2005(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60191-6
NORME EUROPÉENNE
EUROPÄISCHE NORM December 2004

ICS 31.080.01


English version


Mechanical standardization of semiconductor devices
Part 6: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages
(IEC 60191-6:2004)


Normalisation mécanique des dispositifs  Mechanische Normung von
à semiconducteurs Halbleiterbauelementen
Partie 6: Règles générales Teil 6: Allgemeine Regeln für
pour la préparation des dessins die Erstellung von Gehäusezeichnungen
d'encombrement des dispositifs von SMD-Halbleitergehäusen
à semiconducteurs à montage en surface (IEC 60191-6:2004)
(CEI 60191-6:2004)






This European Standard was approved by CENELEC on 2004-10-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60191-6:2004 E

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EN 60191-6:2004 - 2 -
Foreword
The text of document 47D/584/FDIS, future edition 2 of IEC 60191-6, prepared by SC 47D,
Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was
submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6 on
2004-10-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2007-10-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60191-6:2004 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 60191-6:2004
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60191-1 1966 Mechanical standardization of - -
semiconductor devices
Part 1: Preparation of drawings of
semiconductor devices

IEC 60191-3 1999 Part 3: General rules for the preparation EN 60191-3 1999
of outline drawings of integrated circuits

IEC 60191-4 1999 Part 4: Coding system and classification EN 60191-4 1999
into forms of package outlines for
semiconductor device packages

ISO 1101 1983 Technical drawings - Geometrical - -
tolerancing - Tolerancing of form,
orientation, location and run-out -
Generalities, definitions, symbols,
indications on drawings

...