EN 62258-5:2006
(Main)Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
Specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
Halbleiter-Chip-Erzeugnisse - Teil 5: Anforderungen für Angaben hinsichtlich der elektrischen Simulation
Produits à puce de semi-conducteur - Partie 5: Exigences pour l'information concernant la simulation électrique
La CEI 62258-5:2006 a été élaborée afin de faciliter la production, la fourniture et l'utilisation des produits de puce de semiconducteurs, comprenant: - les plaquettes; - la puce nue séparée; - les puces et les plaquettes avec des structures de connexion fixées; - les puces et les plaquettes à encapsulation minimale ou partielle. La présente partie de la CEI 62258 spécifie les informations requises pour faciliter l'utilisation des données et des modèles de simulation du comportement électrique et la vérification de la fonctionnalité correcte des systèmes électroniques qui comprennent les puces à semi-conducteurs nues, avec ou sans structures de connexion, et/ou les puces à semi-conducteurs à emballage minimal. Elle est destinée à venir en aide à toutes les personnes impliquées dans la chaîne d'approvisionnement des dispositifs de puce afin de se conformer aux exigences de la CEI 62258-1 et de la CEI 62258-2. Cette publication doit être lue conjointement avec la CEI 62258-1:2009 et la CEI 62258-2:2011.
Izdelki iz polprevodniških čipov - 5. del: Zahteve za informacije v zvezi z električno simulacijo (IEC 62258-5:2006)
General Information
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EUROPEAN STANDARD
EN 62258-5
NORME EUROPÉENNE
September 2006
EUROPÄISCHE NORM
ICS 31.080.99 Supersedes ES 59008-4-4:1999
English version
Semiconductor die products
Part 5: Requirements for information
concerning electrical simulation
(IEC 62258-5:2006)
Produits de matrice de semi-conducteur Halbleiter-Chip-Erzeugnisse
Partie 5: Exigences pour l'information Teil 5: Anforderungen für Angaben
concernant la simulation électrique hinsichtlich der elektrischen Simulation
(CEI 62258-5:2006) (IEC 62258-5:2006)
This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62258-5:2006 E
Foreword
The text of document 47/1869/FDIS, future edition 1 of IEC 62258-5, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62258-5 on 2006-09-01.
This standard is to be used in conjunction with EN 62258-1 and EN 62258-2.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-06-01
– latest date by which the national standards conflicting
(dow) 2009-09-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62258-5:2006 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 61691-2 NOTE Harmonized as EN 61691-2:2001 (not modified).
IEC 62014-1 NOTE Harmonized as EN 62014-1:2002 (not modified).
__________
- 3 - EN 62258-5:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
1) 2)
IEC 62258-1 - Semiconductor die products EN 62258-1 2005
Part 1: Requirements for procurement and
use
1) 2)
IEC 62258-2 - Semiconductor die products EN 62258-2 2005
Part 2: Exchange data formats
1)
Undated reference.
2)
Valid edition at date of issue.
INTERNATIONAL IEC
STANDARD 62258-5
First edition
2006-08
Semiconductor die products –
Part 5:
Requirements for information
concerning electrical simulation
IEC 2006 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale M
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
– 2 – 62258-5 IEC:2006(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5
1 Scope.6
2 Normative references.6
3 Terms and definitions.6
4 General .6
5 Requirements for information on electrical simulation models.7
5.1 Information on the electrical simulation model.7
5.2 Information on device connectivity .8
5.3 Information on the timing simulation model .8
5.4 Information on connection redistribution.8
5.5 Information on package terminals .9
Annex A (informative) Supporting information .10
Bibliography .12
62258-5 IEC:2006(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DIE PRODUCTS –
Part 5: Requirements for information
concerning electrical simulation
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62258-5 has been prepared by IEC technical committee 47:
Semiconductor devices.
This standard should be read in conjunction with IEC 62258-1 and IEC 62258-2.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1869/FDIS 47/1882/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
– 4 – 62258-5 IEC:2006(E)
The structure of IEC 62258, as currently conceived, consists of the following parts under the
general title Semiconductor die products:
Part 1: Requirements for procurement and use
Part 2: Exchange data formats
Part 3: Recommendations for good practice in handling, packing and storage (Technical
Report)
Part 4: Questionnaire for die users and suppliers (Technical Report) (in preparation)
Part 5: Requirements for information concerning electrical simulation
Part 6: Requirements for information concerning thermal simulation
Part 7: XML schema for data exchange (Technical Report) (in preparation)
Further parts may be added as required.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
62258-5 IEC:2006(E) – 5 –
INTRODUCTION
th
This standard is based on the work carried out in the ESPRIT 4 Framework project GOODDIE
which resulted in the publication of the ES 59008 series of European specifications.
Organisations that helped prepare this part of IEC 62258 includes the ESPRIT ENCAST
project, the Die Products Consortium, JEITA, JEDEC and ZVEI.
– 6 – 62258-5 IEC:2006(E)
SEMICONDUCTOR DIE PRODUCTS –
Part 5: Requirements for information
concerning electrical simulation
1 Scope
This part of IEC 62258 has been developed to facilitate the production, supply and use of
semiconductor die products, including:
– wafers;
– singulated bare die;
– die and wafers with attached connection structures;
– minimally or partially encapsulated die and wafers.
This part of IEC 62258 specifies the information required to facilitate the use of electrical data
and models for simulation of the electrical behaviour and verification of the correct functionality
of electronic systems that include bare semiconductor die, with or without connection
structures, and/or minimally packaged semiconductor die. It is intended to assist all those
involved in the supply chain for die devices to comply with the requirements of IEC 62258-1
and IEC 62258-2.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 62258-1, Semiconductor die products – Part 1: Requirements for procurement and use
IEC 62258-2, Semiconductor die products – Part 2: Exchange data formats
3 Terms and definitions
For the purposes of this document, the terms, definitions and acronyms as given in IEC 62258-1
apply.
4 General
To comply with IEC 62258-1, suppliers of die devices shall furnish information, which is
necessary and sufficient for users of the devices at all stages of design, procurement,
manufacture and test of products containing them.
Whilst it is expected that much of the information supplied will be in the public domain and
available from such sources as manufacturers’ data sheets, this standard does not place an
obligation on a supplier to make information public. Any information that a supplier considers to
be proprietary or commercially sensitive may be supplied under the terms of a non-disclosure
agreement.
...
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