EN 62258-1:2005

Semiconductor die products - Part 1: Requirements for procurement and use

This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers - singulated bare die - die and wafers with attached connection structures - minimally or partially encapsulated die and wafers This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including product identity, product data, die mechanical information, test, quality, assembly and reliability information, handling, shipping and storage information.

Halbleiter-Chip-Erzeugnisse - Teil 1: Anforderungen für Beschaffung und Anwendung

Produits à puce de semi-conducteur - Partie 1: Exigences pour l'acquisition et l'utilisation

This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers - singulated bare die - die and wafers with attached connection structures - minimally or partially encapsulated die and wafers This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including product identity, product data, die mechanical information, test, quality, assembly and reliability information, handling, shipping and storage information.

Izdelki iz polprevodniških čipov - 1. del: Zahteve za oskrbo in uporabo (IEC 62258-1:2005)

General Information

• Status: Withdrawn
• Publication Date: 20-Nov-2005
• Withdrawal Date: 30-Sep-2008
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 01-Oct-2013
• Completion Date: 01-Oct-2013
• Ref Project: SIST EN 62258-1:2007 - Semiconductor die products -- Part 1: Requirements for procurement and use

Relations

• Replaced By: EN 62258-1:2010 - Semiconductor die products - Part 1: Procurement and use
• Effective Date: 28-Jan-2023

Standards Content (Sample)

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EUROPEAN STANDARD EN 62258-1
NORME EUROPÉENNE
EUROPÄISCHE NORM November 2005

ICS 31.080.99 Supersedes ES 59008-1:1999 & ES 59008-2:1999 & ES 59008-3:1999

English version
Semiconductor die products
Part 1: Requirements for procurement and use
(IEC 62258-1:2005)
Produits de matrice de semi-conducteur Halbleiter-Chip-Erzeugnisse
Partie 1: Exigences pour l'acquisition Teil 1: Anforderungen für Beschaffung
et l'utilisation und Anwendung
(CEI 62258-1:2005) (IEC 62258-1:2005)

This European Standard was approved by CENELEC on 2005-10-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 62258-1:2005 E
Foreword
The text of document 47/1820/FDIS, future edition 1 of IEC 62258-1, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62258-1 on 2005-10-01.
This European Standard supersedes ES 59008-1:1999, ES 59008-2:1999 and ES 59008-3:1999.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2006-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-10-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62258-1:2005 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2 NOTE Harmonized in EN 60068-2 series (not modified).
ISO 9000 NOTE Harmonized as EN ISO 9000:2000 (not modified).
ISO 10303 NOTE Harmonized in ENV ISO 10303 series (not modified).
IEC 61540 NOTE Harmonized as HD 639 S1:2002 (modified).
ISO 8879 NOTE Harmonized as EN 28879:1990 (not modified).
IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1:2001 (not modified).
IEC 61340-5-2 NOTE Harmonized as EN 61340-5-2:2001 (not modified).
__________
- 3 - EN 62258-1:2005
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60191-4 1999 Mechanical standardization of EN 60191-4 1999
A1 2001 semiconductor devices A1 2002
A2 2002 Part 4: Coding system and classification A2 2002
into forms of package outlines for
semiconductor device packages
IEC 61360-1 2002 Standard data element types with EN 61360-1 2002
associated classification scheme for
electric components
Part 1: Definitions - Principles and
methods
IEC 62258-2 2005 Semiconductor die products EN 62258-2 2005
Part 2: Exchange data formats
ISO 14644-1 1999 Cleanrooms and associated controlled EN ISO 14644-1 1999
environments
Part 1: Classification of air cleanliness

INTERNATIONAL IEC
STANDARD 62258-1
First edition
2005-08
Semiconductor die products –
Part 1:
Requirements for procurement and use

 IEC 2005  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale W
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 62258-1  IEC:2005(E)
CONTENTS
FOREWORD.5
INTRODUCTION .7

1 Scope .8
2 Normative references.8
3 Terms and definitions.9
3.1 Basic definitions .9
3.2 General terminology.9
3.3 Semiconductor manufacturing and interconnection terminology .11
4 General requirements .12
4.1 General .12
4.2 Identity .13
4.3 Source.13
4.4 Function .13
4.5 Electrical and physical characteristics .13
4.6 Geometry.13
4.7 Connectivity.13
4.8 Documentation .13
4.9 Test and quality .13
4.10 Handling .13
4.11 Assembly.13
4.12 Thermal data .13
4.13 Models .14
5 Data exchange.14
6 Requirements for bare die with and without connection structures .14
6.1 Form of supply.14
6.2 Die name.14
6.3 Die version .14
6.4 Manufacturer .14
6.5 Type number .14
6.6 Function .14
6.7 Information source.14
6.8 Data version .14
6.9 Units of measurement.14
6.10 Geometric view.14
6.11 Die size .15
6.12 Die thickness .15
6.13 Geometric origin .15
6.14 Dimension tolerances .15
6.15 Pad count .15
6.16 Pad information .15
6.17 Signal type.15
6.18 Technology.15
6.19 Semiconductor material .15
6.20 Substrate material .15
6.21 Substrate connection .16

62258-1 IEC:2005(E) – 3 –
6.22 Passivation material.16
6.23 Pad metallization .16
6.24 Backside finish .16
6.25 Wafer size .16
6.26 Wafer thickness.16
6.27 Wafer map.16
6.28 Power dissipation.16
6.29 Operating temperature.16
6.30 Packing .16
6.31 Supplier.16
6.32 Bump material .16
6.33 Bump size.17
6.34 Bump height tolerance .17
6.35 Connection material.17
6.36 Die picture .17
6.37 Die fiducials.17
7 Minimally packaged devices .17
7.1 General .17
7.2 Terminal position .17
7.3 Terminal size .17
7.4 Number of terminals .18
7.5 Package size .18
7.6 Seated height .18
7.7 Encapsulation material.18
7.8 Terminal material.18
7.9 Package style code.
...