Semiconductor die products - Part 7: XML schema for data exchange

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.

Halbleiter-Chip-Erzeugnisse - Teil 7: XML-Schema für den Datenaustausch

Produits à puce de semi-conducteur - Partie 7: Schéma d'échange de données en XML

Izdelki s polprevodniškimi čipi - 7. del: Shema XML za izmenjavo podatkov (IEC/TR 62258-7:2007)

General Information

Status
Published
Publication Date
04-Oct-2007
Drafting Committee
Parallel Committee
Current Stage
6060 - Document made available
Due Date
05-Oct-2007
Completion Date
05-Oct-2007

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Standards Content (sample)

SLOVENSKI STANDARD
SIST-TP CLC/TR 62258-7:2008
01-januar-2008

,]GHONLVSROSUHYRGQLãNLPLþLSLGHO6KHPD;0/]DL]PHQMDYRSRGDWNRY ,(&75


Semiconductor die products - Part 7: XML schema for data exchange (IEC/TR 62258-
7:2007)
Halbleiter-Chip-Erzeugnisse - Teil 7: XML-Schema für den Datenaustausch (IEC/TR
62258-7:2007)

Produits a puce de semi-conducteur - Partie 7: Schéma d'échange de données en XML

(IEC/TR 62258-7:2007)
Ta slovenski standard je istoveten z: CLC/TR 62258-7:2007
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST-TP CLC/TR 62258-7:2008 en,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
TECHNICAL REPORT
CLC/TR 62258-7
RAPPORT TECHNIQUE
October 2007
TECHNISCHER BERICHT
ICS 31.080.99
English version
Semiconductor die products -
Part 7: XML schema for data exchange
(IEC/TR 62258-7:2007)
Produits à puce de semi-conducteur - Halbleiter-Chip-Erzeugnisse -
Partie 7: Schéma d'échange Teil 7: XML-Schema
de données en XML für den Datenaustausch
(CEI/TR 62258-7:2007) (IEC/TR 62258-7:2007)
This Technical Report was approved by CENELEC on 2007-09-01.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the

Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,

Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia,

Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. CLC/TR 62258-7:2007 E
---------------------- Page: 2 ----------------------
CLC/TR 62258-7:2007 - 2 -
Foreword

The text of document 47/1887/DTR, future edition 1 of IEC/TR 62258-7, prepared by IEC TC 47,

Semiconductor devices, was submitted to the IEC-CENELEC Parallel Unique Acceptance Procedure and

was approved by CENELEC as CLC/TR 62258-7 on 2007-09-01.
Annex ZA has been added by CENELEC.
__________
Endorsement notice

The text of the Technical Report IEC/TR 62258-7:2007 was approved by CENELEC as a Technical Report

without any modification.
__________
---------------------- Page: 3 ----------------------
- 3 - CLC/TR 62258-7:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated

references, only the edition cited applies. For undated references, the latest edition of the referenced

document (including any amendments) applies.

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD

applies.
Publication Year Title EN/HD Year
IEC 60050 Series International Electrotechnical Vocabulary – –
1) 2)
IEC 62258-1 – Semiconductor die products - EN 62258-1 2005
Part 1: Requirements for procurement and
use
1) 2)
IEC 62258-2 – Semiconductor die products - EN 62258-2 2005
Part 2: Exchange data formats
1) 2)
IEC/TR 62258-4 – Semiconductor die products - CLC/TR 62258-4 2007
Part 4: Questionnaire for die users and
suppliers
1) 2)
IEC 62258-5 – Semiconductor die products - EN 62258-5 2006
Part 5: Requirements for information
concerning electrical simulation
1) 2)
IEC 62258-6 – Semiconductor die products - EN 62258-6 2006
Part 6: Requirements for information
concerning thermal simulation
Undated reference.
Valid edition at date of issue.
---------------------- Page: 4 ----------------------
IEC/TR 62258-7
Edition 1.0 2007-08
TECHNICAL
REPORT
Semiconductor die products –
Part 7: XML schema for data exchange
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
ICS 31.080.99 ISBN 2-8318-9289-9
---------------------- Page: 5 ----------------------
– 2 – TR 62258-7 © IEC:2007(E)
CONTENTS

FOREWORD...........................................................................................................................3

INTRODUCTION.....................................................................................................................5

1 Scope...............................................................................................................................6

2 Normative references........................................................................................................6

3 Definitions ........................................................................................................................6

4 General ............................................................................................................................7

5 Data exchange .................................................................................................................7

Annex A (normative) XML schema..........................................................................................8

Annex B (informative) XML example.....................................................................................19

Bibliography ..........................................................................................................................26

---------------------- Page: 6 ----------------------
TR 62258-7 © IEC:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DIE PRODUCTS –
Part 7: XML schema for data exchange
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any

equipment declared to be in conformity with an IEC Publication.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

The main task of IEC technical committees is to prepare International Standards. However, a

technical committee may propose the publication of a technical report when it has collected

data of a different kind from that which is normally published as an International Standard, for

example "state of the art".

IEC 62258-7, which is a technical report, has been prepared by IEC technical committee 47:

Semiconductor devices.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
47/1887/DTR 47/1897/RVC

Full information on the voting for the approval of this Technical Report can be found in the

report on voting indicated in the above table.
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– 4 – TR 62258-7 © IEC:2007(E)

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 62258 series, under the general title Semiconductor die products,

can be found on the IEC website. Further parts may be added as required.

The committee has decided that the contents of this publication will remain unchanged until the

maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
---------------------- Page: 8 ----------------------
TR 62258-7 © IEC:2007(E) – 5 –
INTRODUCTION

This technical report is based on the work carried out in the ESPRIT 4 Framework project

GOODDIE which resulted in the publication of the ES 59008 series of European specifications.

Organizations that helped prepare this report included the ESPRIT ENCAST and IST ENCASIT

projects, the Die Products Consortium, JEITA, JEDEC and ZVEI.
---------------------- Page: 9 ----------------------
– 6 – TR 62258-7 © IEC:2007(E)
SEMICONDUCTOR DIE PRODUCTS –
Part 7: XML schema for data exchange
1 Scope

IEC/TR 62258-7, which is a technical report, has been developed to facilitate the production,

supply and use of semiconductor die products, including:
• wafers;
• singulated bare die;
• die and wafers with attached connection structures;
• minimally or partially encapsulated die and wafers.

This report contains an XML schema that describes the elements needed for data exchange

and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and

IEC 62258-6, as well as providing an exchange structure that is complementary to those

defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in

IEC/TR 62258-4.
2 Normative references

The following referenced documents are indispensable for the application of this document. For

dated references, only the edition cited applies. For undated references, the latest edition of the

referenced document (including any amendments) applies.
IEC 60050 (all parts), International Electrotechnical Vocabulary

IEC 62258-1: Semiconductor die products – Part 1: Requirements for procurement and use

IEC 62258-2: Semiconductor die products – Part 2: Exchange data formats

IEC/TR 62258-4: Semiconductor die products – Part 4: Questionnaire for die users and

suppliers

IEC 62258-5: Semiconductor die products – Part 5 Requirements for information concerning

electrical simulation

IEC 62258-6: Semiconductor die products – Part 6 Requirements for information concerning

thermal simulation
3 Terms and definitions

For the purposes of this document, relevant terms, which are defined in IEC 60050, together

with additional terms and acronyms as given in IEC 62258-1, apply.
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TR 62258-7 © IEC:2007(E) – 7 –
4 General

The schema given in this technical report complies with Version 1.0 (Third edition) of the

Extensible Markup Language (XML) as defined by the World Wide Web Consortium (W3C).

Links to the XML standard are given in the bibliography.

To comply with IEC 62258-1, that standard requires that suppliers of die devices shall furnish

information that is necessary and sufficient for users of die devices at all stages of design,

procurement, manufacture and test of products containing them. The schema in Annex A

defines an exchange mechanism for structuring such information using an XML representation

and as such is intended as an aid to compliance with the standard.

Whilst it is expected that much of the information supplied will be in the public domain and

available from such sources as manufacturers’ data sheets, neither the standard nor the

schema places an obligation on a supplier to make information public. Any information that a

supplier considers to be proprietary or commercially sensitive may be supplied under the terms

of a non-disclosure agreement.
5 Data exchange

The schema in Annex A implements all the entities as defined by IEC 62258-2 for the DDX

format. In addition, it includes additional entities extending the range of that data as follows:

• expansion of data on organisations (manufacturer, supplier etc.) to include addresses and

contacts;
• sub-division of some entities to make their values clearer.

Annex B contains an example of an XML file based on the schema using a fictitious example

similar to that employed in IEC 62258-2, and extended to cover additional data requirements. It

is possible that software may be available for conversion of data produced using the

spreadsheet associated with IEC/TR 62258-4 into this format. In any case, a wide range of

tools is available commercially for handling and processing XML files.

The electronic form of the schema contained in this technical report may be downloaded from

the IEC website. The copyright conditions applying to the use of the electronic file are those

that apply to IEC database standards, which permit the use of such information in electronic

form for bona-fide e-commerce but do not permit its sale to third parties or other commercial

use.
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– 8 – TR 62258-7 © IEC:2007(E)
Annex A
(normative)
XML schema

In electronic form, for use by the example file shown in Annex B, the file containing this

schema is assumed to have the name DDXschema.xsd











































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TR 62258-7 © IEC:2007(E) – 9 –


























































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– 10 – TR 62258-7 © IEC:2007(E)


















































maxOccurs="unbounded"/>


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TR 62258-7 © IEC:2007(E) – 11 –
















minOccurs="0"/>
minOccurs="0"/>





minOccurs="0"/>














minOccurs="0"/>
type="DOCUMENT_OR_GRAPHICS_Type" minOccurs="0"
maxOccurs="unbounded"/>
minOccurs="0"/>


---------------------- Page: 15 ----------------------
– 12 – TR 62258-7 © IEC:2007(E)




type="MOISTURE_SENSITIVITY_LEVEL_Type" minOccurs="0"/>

minOccurs="0" maxOccurs="unbounded"/>

















minOccurs="0"/>






minOccurs="0"/>
minOccurs="0"/>

minOccurs="0"/>
minOccurs="0"/>









minOccurs="0"/>


---------------------- Page: 16 ----------------------
TR 62258-7 © IEC:2007(E) – 13 –











type="DOCUMENT_OR_GRAPHICS_Type" minOccurs="0"/>




























minOccurs="0"/>

minOccurs="0"/>
minOccurs="0"/>
minOccurs="0"/>
minOccurs="0"/>
minOccurs="0"/>


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– 14 – TR 62258-7 © IEC:2007(E)






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