CLC/TR 62258-7:2007

Semiconductor die products - Part 7: XML schema for data exchange

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.

Halbleiter-Chip-Erzeugnisse - Teil 7: XML-Schema für den Datenaustausch

Produits à puce de semi-conducteur - Partie 7: Schéma d'échange de données en XML

Izdelki s polprevodniškimi čipi - 7. del: Shema XML za izmenjavo podatkov (IEC/TR 62258-7:2007)

General Information

• Status: Published
• Publication Date: 04-Oct-2007
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 05-Oct-2007
• Completion Date: 05-Oct-2007
• Ref Project: SIST-TP CLC/TR 62258-7:2008 - Semiconductor die products -- Part 7: XML schema for data exchange

Standards Content (Sample)

SLOVENSKI STANDARD
SIST-TP CLC/TR 62258-7:2008
01-januar-2008
,]GHONLVSROSUHYRGQLãNLPLþLSLGHO6KHPD;0/]DL]PHQMDYRSRGDWNRY,(&75

Semiconductor die products - Part 7: XML schema for data exchange (IEC/TR 62258-
7:2007)
Halbleiter-Chip-Erzeugnisse - Teil 7: XML-Schema für den Datenaustausch (IEC/TR
62258-7:2007)
Produits a puce de semi-conducteur - Partie 7: Schéma d'échange de données en XML
(IEC/TR 62258-7:2007)
Ta slovenski standard je istoveten z: CLC/TR 62258-7:2007
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST-TP CLC/TR 62258-7:2008 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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TECHNICAL REPORT
CLC/TR 62258-7

RAPPORT TECHNIQUE
October 2007
TECHNISCHER BERICHT

ICS 31.080.99


English version


Semiconductor die products -
Part 7: XML schema for data exchange
(IEC/TR 62258-7:2007)


Produits à puce de semi-conducteur -  Halbleiter-Chip-Erzeugnisse -
Partie 7: Schéma d'échange Teil 7: XML-Schema
de données en XML für den Datenaustausch
(CEI/TR 62258-7:2007) (IEC/TR 62258-7:2007)






This Technical Report was approved by CENELEC on 2007-09-01.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland and the United Kingdom.





CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. CLC/TR 62258-7:2007 E

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CLC/TR 62258-7:2007 - 2 -
Foreword
The text of document 47/1887/DTR, future edition 1 of IEC/TR 62258-7, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC Parallel Unique Acceptance Procedure and
was approved by CENELEC as CLC/TR 62258-7 on 2007-09-01.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the Technical Report IEC/TR 62258-7:2007 was approved by CENELEC as a Technical Report
without any modification.
__________

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- 3 - CLC/TR 62258-7:2007

Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year
IEC 60050 Series International Electrotechnical Vocabulary – –


1) 2)
IEC 62258-1 – Semiconductor die products - EN 62258-1 2005
Part 1: Requirements for procurement and
use


1) 2)
IEC 62258-2 – Semiconductor die products - EN 62258-2 2005
Part 2: Exchange data formats


1) 2)
IEC/TR 62258-4 – Semiconductor die products - CLC/TR 62258-4 2007
Part 4: Questionnaire for die users and
suppliers


1) 2)
IEC 62258-5 – Semiconductor die products - EN 62258-5 2006
Part 5: Requirements for information
concerning electrical simulation


1) 2)
IEC 62258-6 – Semiconductor die products - EN 62258-6 2006
Part 6: Requirements for information
concerning thermal simulation





1)
Undated reference.
2)
Valid edition at date of issue.

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IEC/TR 62258-7
Edition 1.0 2007-08
TECHNICAL
REPORT

Semiconductor die products –
Part 7: XML schema for data exchange


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
U
ICS 31.080.99 ISBN 2-8318-9289-9

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– 2 – TR 62258-7 © IEC:2007(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5

1 Scope.6
2 Normative references.
...