EN IEC 60747-16-6:2019

Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers

IEC 6074716-6:2019 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.

Halbleiterbauelemente - Teil 16-6: Integrierte Mikroschaltungen - Frequenzvervielfacher

Dispositifs à semiconducteurs - Partie 16-6: Circuits intégrés hyperfréquences - Multiplicateurs de fréquence

L’IEC 60747-16-6:2019 spécifie la terminologie, les valeurs assignées et caractéristiques essentielles, ainsi que les méthodes de mesure des multiplicateurs hyperfréquences à circuits intégrés.

Polprevodniški elementi - 16-6. del: Mikrovalovna integrirana vezja - Frekvenčni množitelji (IEC 60747-16-6:2019)

Ta standard določa terminologijo, bistvene vrednosti in lastnosti ter merilne metode za frekvenčne množitelje mikrovalovnih integriranih vezij.

General Information

• Status: Published
• Publication Date: 22-Aug-2019
• Withdrawal Date: 30-Jul-2022
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/TC 47X - Semiconductor devices and trusted chips
• Drafting Committee: IEC/SC 47E - IEC_SC_47E
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 23-Aug-2019
• Completion Date: 23-Aug-2019
• Ref Project: SIST EN IEC 60747-16-6:2019 - Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019)

Standards Content (Sample)

SLOVENSKI STANDARD
01-november-2019
Polprevodniški elementi - 16-6. del: Mikrovalovna integrirana vezja - Frekvenčni
množitelji (IEC 60747-16-6:2019)
Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers
(IEC 60747-16-6:2019)
Halbleiterbauelemente - Teil 16-6: Integrierte Mikrowellenschaltkreise -
Frequenzvervielfachung (IEC 60747-16-6:2019)
Dispositifs à semiconducteurs - Partie 16-6: Circuits intégrés hyperfréquences -
Multiplicateurs de fréquence (IEC 60747-16-6:2019)
Ta slovenski standard je istoveten z: EN IEC 60747-16-6:2019
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 60747-16-6

NORME EUROPÉENNE
EUROPÄISCHE NORM
August 2019
ICS 31.080.99
English Version
Semiconductor devices - Part 16-6: Microwave integrated
circuits - Frequency multipliers
(IEC 60747-16-6:2019)
Dispositifs à semiconducteurs - Partie 16-6: Circuits Halbleiterbauelemente - Teil 16-6: Integrierte
intégrés hyperfréquences - Multiplicateurs de fréquence Mikrowellenschaltkreise - Frequenzvervielfachung
(IEC 60747-16-6:2019) (IEC 60747-16-6:2019)
This European Standard was approved by CENELEC on 2019-07-31. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60747-16-6:2019 E

European foreword
The text of document 47E/602/CDV, future edition 1 of IEC 60747-16-6, prepared by SC 47E "Discrete
semiconductor devices" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 60747-16-6:2019.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2020-04-30
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2022-07-31
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 60747-16-6:2019 was approved by CENELEC as a
European Standard without any modification.

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60617 -  Graphical symbols for diagrams - -
IEC 60747-1 2006 Semiconductor devices - Part 1: General - -
+ A1 2010  - -
IEC 60747-4 -  Semiconductor devices - Discrete devices - - -
Part 4: Microwave diodes and transistors
IEC 60747-16-3 2002 Semiconductor devices - Part 16-3: EN 60747-16-3 2002
Microwave integrated circuits - Frequency
converters
+ A1 2009  + A1 2009
+ A2 2017  + A2 2017
IEC 61340-5-1 -  Electrostatics - Part 5-1: Protection of EN 61340-5-1 -
electronic devices from electrostatic
phenomena - General requirements
IEC/TR 61340-5-2 -  Electrostatics -- Part 5-2: Protection of CLC/TR 61340-5-2 -
electronic devices from electrostatic
phenomena - User guide
IEC 60747-16-6 ®
Edition 1.0 2019-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 16-6: Microwave integrated circuits – Frequency multipliers

Dispositifs à semiconducteurs –

Partie 16-6: Circuits intégrés hyperfréquences – Multiplicateurs de fréquence

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-7081-3

– 2 – IEC 60747-16-6:2019  IEC 2019
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Essential ratings and characteristics . 8
4.1 General requirements . 8
4.1.1 Circuit identification and types . 8
4.1.2 General function description . 8
4.1.3 Manufacturing technology . 8
4.1.4 Package identification . 8
4.2 Application description . 8
4.2.1 Conformance to system and/or interface information . 8
4.2.2 Overall block diagram . 8
4.2.3 Reference data . 8
4.2.4 Electrical compatibility . 8
4.2.5 Associated devices . 9
4.3 Specification of the function . 9
4.3.1 Detailed block diagram – Functional blocks . 9
4.3.2 Identification and function of terminals . 9
4.3.3 Function description . 10
4.4 Limiting values (absolute maximum rating system) . 10
4.4.1 Requirements . 10
4.4.2 Electrical limiting values . 10
4.4.3 Temperatures . 11
4.5 Operating conditions (within the specified operating temperature range) . 11
4.6 Electrical characteristics . 12
4.7 Mechanical and environmental ratings, characteristics and data . 12
4.8 Additional information . 12
5 Measuring methods . 13
5.1 General . 13
5.1.1 General precautions . 13
5.1.2 Characteristic impedance . 13
5.1.3 Handling precautions . 13
5.1.4 Types . 13
5.2 Output power (P ) . 13
o
5.2.1 Purpose . 13
5.2.2 Circuit diagram . 13
5.2.3 Principle of measurement . 13
5.2.4 Circuit description and requirements . 14
5.2.5 Precautions to be observed . 14
5.2.6 Measurement procedure . 14
5.2.7 Specified conditions . 14
5.3 Conversion gain (G ) . 14
c
5.3.1 Purpose . 14
5.3.2 Circuit diagram . 15
5.3.3 Principle of measurement . 15
5.3.4 Circuit description and requirements . 15

IEC 60747-16-6:2019  IEC 2019 – 3 –
5.3.5 Precautions to be observed . 15
5.3.6 Measurement procedure . 15
5.3.7 Specified conditions . 15
5.4 Input return loss (L ) . 15
ret(in)
5.4.1 Purpose . 15
5.4.2 Circuit diagram . 15
5.4.3 Principle of measurement . 16
5.4.4 Circuit description and requirements . 16
5.4.5 Precautions to be observed . 16
5.4.6 Measurement procedure . 16
5.4.7 Specified conditions . 17
5.5 Output return loss (L ) . 17
ret(out)
5.5.1 Purpose . 17
5.5.2 Circuit diagram . 17
5.5.3 Principle of measurement . 17
5.5.4 Circuit description and requirements . 18
5.5.5 Precautions to be observed . 18
5.5.6 Measurement procedure . 18
5.5.7 Specified conditions . 18
5.6 Fundamental isolation (P /P ) .
...