EN 60512-12-7:2001

Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method

Defines a standard test method to assess the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.

Steckverbinder für elektronische Einrichtungen - Mess- und Prüfverfahren - Teil 12-7: Prüfungen der Lötbarkeit - Prüfung 12g: Lötbarkeit, Lötwaage-Verfahren

Connecteurs pour équipements électroniques - Essais et mesures - Partie 12-7: Essais de soudure - Essai 12g: Soudabilité, méthode de la balance de mouillage

Définit une méthode d'essai normalisée pour évaluer la soudabilité des sorties d'un composant conçu pour être utilisé avec des cartes imprimées ou pour d'autres applications faisant appel à des techniques de soudures similaires.

Connectors for electronic equipment - Tests and measurement - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method (IEC 60512-12-7:2001)

General Information

• Status: Published
• Publication Date: 04-Jul-2001
• Withdrawal Date: 30-Apr-2004
• ICS: 31.220 - Electromechanical components for electronic and telecommunications equipment
• Technical Committee: CLC/SR 48B - Connectors
• Drafting Committee: IEC/SC 48B - IEC_SC_48B
• Parallel Committee: IEC/SC 48B - IEC_SC_48B
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 05-Jul-2001
• Completion Date: 05-Jul-2001
• Ref Project: SIST EN 60512-12-7:2002 - Connectors for electronic equipment - Tests and measurements -- Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method

Overview

EN 60512-12-7:2001 is a crucial European standard developed by the CLC that specifies the solderability test method for connectors used in electronic equipment. Titled "Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method," this standard defines a reliable testing procedure to evaluate the solderability of component terminations intended for printed circuit boards (PCBs) or similar soldering processes. It ensures that connectors meet quality and performance requirements during soldering, which is essential for electronic assembly and manufacturing.

Key Topics

• Solderability Testing: The standard focuses on the solderability of component terminations using the wetting balance method, which gives quantitative data on solder wetting behavior.
• Wetting Balance Method: This technique measures the force exerted by molten solder on the component terminations, providing an objective assessment of solderability.
• Applicability: It is designed for connectors and related components to be soldered on PCBs or similar substrates, making it versatile for modern electronics.
• Standardized Procedure: EN 60512-12-7:2001 provides detailed test conditions, apparatus setup, and criteria for evaluating solderability to ensure repeatability and comparability of results.
• Quality Control: The standard is integral for manufacturers and quality engineers to verify that components will perform satisfactorily through soldering processes without defects such as poor wetting or cold joints.

Applications

• Electronics Manufacturing: Used by manufacturers to assess connector terminations before assembly, ensuring high reliability and solder joint integrity.
• Component Qualification: Enables suppliers and buyers to validate that electronic connectors comply with quality requirements for solderability.
• Process Development: Supports R&D and production teams in optimizing soldering parameters and selecting materials with adequate wetting characteristics.
• Failure Analysis: Helps in diagnosing soldering issues by comparing solderability performance data against the standard's criteria.
• Compliance Documentation: Provides a recognized method to demonstrate conformity with solderability requirements for regulatory and customer demands.

Related Standards

• EN 60512 Series: Covers a wide range of tests and measurements related to electronic connectors, including mechanical, electrical, and environmental performance.
• IEC 60512-12-7: The international version of this standard by the IEC, ensuring global harmonization of solderability testing methods.
• IPC Standards: While EN 60512-12-7 focuses on connectors, IPC standards address soldering processes and PCB assembly more broadly, complementing this standard.
• ISO/IEC 17025: Laboratory accreditation standards ensuring testing labs conducting EN 60512-12-7 comply with quality system requirements.

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By implementing EN 60512-12-7:2001 compliant solderability testing, electronic component manufacturers and assembly providers can ensure robust solder joints and increased reliability in electronic devices. This standard supports high-quality production practices essential for today's demanding electronics market.

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2002
Connectors for electronic equipment - Tests and measurement - Part 12-7:
Soldering tests - Test 12g: Solderability, wetting balance method (IEC 60512-12-
7:2001)
Connectors for electronic equipment - Tests and measurements -- Part 12-7: Soldering
tests - Test 12g: Solderability, wetting balance method
Steckverbinder für elektronische Einrichtungen - Mess- und Prüfverfahren -- Teil 12-7:
Prüfungen der Lötbarkeit - Prüfung 12g: Lötbarkeit, Lötwaage-Verfahren
Connecteurs pour équipements électroniques - Essais et mesures -- Partie 12-7: Essais
de soudure - Essai 12g: Soudabilité, méthode de la balance de mouillage
Ta slovenski standard je istoveten z: EN 60512-12-7:2001
ICS:
31.220.10 9WL
...