HD 323.2.54 S1:1987

Basic environmental testing procedures - Part 2: Tests - Test Ta: Soldering - Solderability testing by the wetting balance method

Determines the solderability of component terminations of any shape. Specially suitable for reference testing and components that cannot be quantitatively tested by other methods.

Grundlegende Umweltprüfverfahren - Teil 2: Prüfungen - Prufung Ta: Löten - Prüfung der lötbarkeit mit der Benetzungswaage

Essais fondamentaux climatiques et de robustesse mécanique - Partie 2: Essais - Essai Ta: Soudure - Essai de soudabilité par la méthode de la balance de mouillage

Détermine la soudabilité des sorties de composants de forme quelconque. Convient particulièrement pour les essais d'arbitrage et pour les composants qu'on ne peut pas essayer par d'autres méthodes donnant des résultats quantitatifs.

Basic environmental testing procedures - Part 2: Tests - Test TA: Soldering - Solderability testing by the wetting balance method

General Information

• Status: Withdrawn
• Publication Date: 22-Oct-1987
• Technical Committee: CLC/SR 104 - Environmental conditions, classification and methods of test
• Drafting Committee: IEC/TC 104 - IEC_TC_104
• Parallel Committee: IEC/TC 104 - IEC_TC_104
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 01-Jul-2009
• Completion Date: 01-Jul-2009
• Ref Project: SIST HD 323.2.54 S1:2003 - Basic environmental testing procedures -- Part 2: Tests - Test Ta: Soldering - Solderability testing by the wetting balance method

Relations

• Replaced By: EN 60068-2-54:2006 - Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST HD 323.2.54 S1:2003

STANDARD
julij 2003
Basic environmental testing procedures - Part 2: Tests - Test TA: Soldering -
Solderability testing by the wetting balance method
ICS 19.040 Referenčna številka
SIST H
...