IEC 61760-2:2021
(Main)Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.
Technique du montage en surface - Partie 2: Conditions de transport et de stockage des composants pour montage en surface (CMS) - Guide d'application
L'IEC 61760-2:2021 spécifie les conditions de transport et de stockage qui sont prises en compte afin de permettre la mise en œuvre sans problème des composants pour montage en surface (CMS), tant actifs que passifs. (Les conditions pour les cartes à circuits imprimés ne sont pas prises en compte.) L’objet du présent document est de s’assurer que l’utilisateur de composants pour montage en surface reçoit et emmagasine des produits qui pourront être utilisés (par exemple placés, brasés) sans problème de qualité et de fiabilité. Des conditions de transport et de stockage impropres peuvent provoquer une détérioration des CMS et il en résulte des problèmes d’assemblage tels qu’une mauvaise brasabilité, la séparation des couches métallisées des terminaisons et l’effet "pop-corn". Les références croisées donnant les équivalences entre la présente édition 3 et l’édition 2 du présent document sont énumérées à l’Annexe X du présent document.
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IEC 61760-2 ®
Edition 3.0 2021-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Surface mounting technology –
Part 2: Transportation and storage conditions of surface mounting devices
(SMD) – Application guide
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
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IEC 61760-2 ®
Edition 3.0 2021-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Surface mounting technology –
Part 2: Transportation and storage conditions of surface mounting devices
(SMD) – Application guide
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.240 ISBN 978-2-8322-4950-5
– 2 – IEC 61760-2:2021 RLV © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope and object . 5
2 Normative references. 5
3 Terms and definitions . 6
4 General conditions . 5
5 Transportation conditions . 6
5.1 General transportation conditions . 6
5.2 Special transportation conditions . 7
5.2.1 General . 7
5.2.2 Category 1 (advised for all products) . 7
5.2.3 Category 2 . 7
6 Storage conditions . 7
7 Related issues . 8
Annex A (informative) Transportation climatic and storage conditions . 9
Annex X (informative) Cross-references for references to the previous edition of this
document . 17
Bibliography . 18
Figure A.1 – Consolidation of mechanical conditions . 15
Table A.1 – Transportation climatic conditions according to IEC 60721-3-2 .
Table A.2 – Transportation mechanical conditions according to IEC 60721-3-2 .
Table A.3 – Storage conditions according to IEC 60721-3-1 .
Table A.1 – Classification of climatic conditions according to IEC 60721-3-2:2018,
Table 1 . 13
Table A.2 – Classification of mechanical conditions according to IEC 60721-3-2:2018,
Table 5 . 14
Table A.3 – Storage conditions according to IEC 60721-3-1:2018, Table 1 . 16
Table X.1 – Cross-references . 17
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) –
Application guide
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes made to
the previous edition IEC 61760-2:2007. A vertical bar appears in the margin wherever a change
has been made. Additions are in green text, deletions are in strikethrough red text.
– 4 – IEC 61760-2:2021 RLV © IEC 2021
IEC 61760-2 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1666/CDV 91/1708/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
Cross-references for references from this edition 3 to the previous edition 2 of this document
are listed in Annex X of this document.
A list of all parts in the IEC 61760 series, published under the general title Surface mounting
technology, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.
SURFACE MOUNTING TECHNOLOGY –
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) –
Application guide
1 Scope and object
This International Standard describes specifies the transportation and storage conditions for
surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of
surface mounting devices, both active and passive. (Conditions for printed boards are not taken
into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that
can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability.
Improper transportation and storage of SMDs may can cause deterioration and result in
assembly problems such as poor solderability, delamination and "popcorning".
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60286-3, Packaging of components for automatic handling – Part 3: Packaging of surface
mount components on continuous tapes
IEC 60286-4, Packaging of components for automatic handling – Part 4: Stick magazines for
electronic components encapsulated in packages of form E and G
IEC 60286-5, Packaging of components for automatic handling – Part 5: Matrix trays
IEC 60286-6, Packaging of components for automatic handling – Part 6: Bulk case packaging
for surface mounting components
IEC 60721-3-1:2018, Classification of environmental conditions – Part 3-1: Classification of
groups of environmental parameters and their severities –: Storage
IEC 60721-3-2:2018, Classification of environmental conditions – Part 3-2: Classification of
groups of environmental parameters and their severities –: Transportation and handling
IEC 60749 (all parts), Semiconductor devices – Mechanical and climatic test methods
IEC/TS 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from electrostatic
phenomena – User guide
– 6 – IEC 61760-2:2021 RLV © IEC 2021
3 Terms and definitions
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
No terms and definitions are listed in this document.
4 General conditions
Surface mounting devices shal
...
IEC 61760-2 ®
Edition 3.0 2021-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface mounting technology –
Part 2: Transportation and storage conditions of surface mounting devices
(SMD) – Application guide
Technique du montage en surface –
Partie 2: Conditions de transport et de stockage des composants pour montage
en surface (CMS) – Guide d’application
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
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les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.
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3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform IEC online collection - oc.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always
committee, …). It also gives information on projects, replaced have access to up to date content tailored to your needs.
and withdrawn publications.
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IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 000 terminological entries in English
details all new publications released. Available online and
and French, with equivalent terms in 18 additional languages.
once a month by email.
Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc
If you wish to give us your feedback on this publication or
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
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IEC 61760-2 ®
Edition 3.0 2021-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface mounting technology –
Part 2: Transportation and storage conditions of surface mounting devices
(SMD) – Application guide
Technique du montage en surface –
Partie 2: Conditions de transport et de stockage des composants pour montage
en surface (CMS) – Guide d’application
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.240 ISBN 978-2-8322-1002-8
– 2 – IEC 61760-2:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references. 5
3 Terms and definitions . 5
4 General conditions . 5
5 Transportation conditions . 6
5.1 General transportation conditions . 6
5.2 Special transportation conditions . 6
5.2.1 General . 6
5.2.2 Category 1 (advised for all products) . 6
5.2.3 Category 2 . 7
6 Storage conditions . 7
7 Related issues . 8
Annex A (informative) Transportation and storage conditions . 9
Annex X (informative) Cross-references for references to the previous edition of this
document . 14
Bibliography . 15
Figure A.1 – Consolidation of mechanical conditions . 12
Table A.1 – Classification of climatic conditions according to IEC 60721-3-2:2018,
Table 1 . 10
Table A.2 – Classification of mechanical conditions according to IEC 60721-3-2:2018,
Table 5 . 11
Table A.3 – Storage conditions according to IEC 60721-3-1:2018, Table 1 . 13
Table X.1 – Cross-references . 14
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) –
Application guide
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61760-2 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1666/CDV 91/1708/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
– 4 – IEC 61760-2:2021 © IEC 2021
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
Cross-references for references from this edition 3 to the previous edition 2 of this document
are listed in Annex X of this document.
A list of all parts in the IEC 61760 series, published under the general title Surface mounting
technology, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.
SURFACE MOUNTING TECHNOLOGY –
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) –
Application guide
1 Scope
This International Standard specifies the transportation and storage conditions for surface
mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface
mounting devices, both active and passive. (Conditions for printed boards are not taken into
considerati
...
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