IEC 61760-1:2006
(Main)Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.
Technique du montage en surface - Partie 1: Méthode de normalisation pour la spécification des composants montés en surface (CMS)
IEC 61760-1:2006-04(en-fr) fournit un ensemble de références indiquant les conditions de processus ainsi que les conditions d'essai correspondantes à utiliser lors de l'élaboration de spécifications de composants électroniques destinés à être utilisés pour la technologie de montage en surface. Les modifications principales par rapport à l'édition précédente sont les suivantes:
- exigences relatives au brasage sans plomb;
- extension du domaine d'application destinée à inclure également les composants montés par collage;
- référence directe à la CEI 60068-2-58 pour les exigences relatives à la brasabilité et à la résistance à la chaleur de brasage;
- la classification en catégories basée sur la capacité des composants à supporter la résistance à la chaleur de brasage a été supprimée.
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INTERNATIONAL IEC
STANDARD 61760-1
Second edition
2006-04
Surface mounting technology –
Part 1:
Standard method for the specification
of surface mounting components (SMDs)
Reference number
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INTERNATIONAL IEC
STANDARD 61760-1
Second edition
2006-04
Surface mounting technology –
Part 1:
Standard method for the specification
of surface mounting components (SMDs)
IEC 2006 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
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International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
– 2 – 61760-1 IEC:2006(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope and object .7
1.1 Scope.7
1.2 Object .7
2 Normative references.7
3 Terms and definitions .8
4 Requirements for component design and component specifications.10
4.1 General requirement.10
4.2 Packaging .10
4.3 Labelling of product packaging.10
4.4 Component marking .11
4.5 Storage and transportation.12
4.6 Component outline and design.12
4.7 Mechanical stress.16
4.8 Component reliability assurance .16
4.9 Additional requirements for compatibility with lead-free soldering .16
5 Specification of assembly process conditions .16
5.1 General .16
5.2 Securing the component on the substrate prior to soldering.18
5.3 Mounting methods .19
5.4 Cleaning (where applicable).20
5.5 Removal and/or replacement of SMDs .21
6 Typical process conditions .22
6.1 Soldering processes, temperature/time profiles .22
6.2 Typical cleaning conditions for assemblies .26
7 Requirements for components and component specifications related to suitability
with various mounting processes.27
7.1 General .27
7.2 Wettability .27
7.3 Resistance to dissolution of metallization .27
7.4 Resistance to soldering heat.27
7.5 Resistance to cleaning solvent.28
7.6 Soldering profiles.28
7.7 Bonding strength test for the component glue interface test.28
Bibliography .30
Figure 1 – Example of a component with marked specific orientation put in tape and tray.11
Figure 2 – Vacuum pipette, pick-up area and component compartment:
Example for a component with a flat surface.13
Figure 3 – Coplanarity of terminals .13
Figure 4 – Stable seating of component.14
Figure 5 – Unstable seating of component.14
Figure 6 – Terminals arranged peripherally in two rows.14
61760-1 IEC:2006(E) – 3 –
Figure 7 – Good contrast to component body and surroundings .14
Figure 8 – Component weight/pipette suction strength .15
Figure 9 – Process steps for soldering.17
Figure 10 – Process steps for gluing.18
Figure 11 – SnPb Vapour phase soldering – Temperature/time profile
(terminal temperature).22
Figure 12 – Lead-free SnAgCu Vapour phase soldering – Temperature/time profile
(terminal temperature).23
Figure 13 – Infrared soldering, forced gas convection reflow soldering –
Temperature/time profile for SnPb solders.24
Figure 14 – Infrared soldering, forced gas convection reflow soldering –
Temperature/time profile for lead-free SnAgCu solders.25
Figure 15 – Double wave soldering for SnPb and lead-free SnAgCu solder –
Temperature/time profile (terminal temperature).26
Table 1 – Basic cleaning processes.26
– 4 – 61760-1 IEC:2006(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
SURFACE MOUNTING TECHNOLOGY –
Part 1: Standard method for the specification
of surface mounting components (SMDs)
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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International Standard IEC 61760-1 has been prepared by IEC technical committee 91: Surface
mounting technology.
This second edition cancels and replaces the first edition, published in 1998, and constitutes a
technical revision.
The main changes with regard to the previous edition concern:
− requirements related to leadfree soldering;
− extension of the scope to include also components mounted by gluing;
− direct reference to IEC 60068-2-58 for requirements on solderability and resistance to
soldering heat;
− classification into categories based on the component's ability to withstand resistance to
soldering heat has been deleted.
61760-1 IEC:2006(E) – 5 –
The text of this standard is based on the following documents:
FDIS Report on voting
91/577/FDIS 91/588/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
– 6 – 61760-1 IEC:2006(E)
INTRODUCTION
Specifications for electr
...
IEC 61760-1 ®
Edition 2.0 2006-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology –
Part 1: Standard method for the specification of surface mounting components
(SMDs)
Technique du montage en surface –
Partie 1: Méthode de normalisation pour la spécification des composants
montés en surface (CMS)
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IEC 61760-1 ®
Edition 2.0 2006-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology –
Part 1: Standard method for the specification of surface mounting components
(SMDs)
Technique du montage en surface –
Partie 1: Méthode de normalisation pour la spécification des composants
montés en surface (CMS)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX U
ICS 31.240 ISBN 978-2-8322-1344-5
– 2 – 61760-1 IEC:2006
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope and object . 7
1.1 Scope . 7
1.2 Object . 7
2 Normative references. 7
3 Terms and definitions . 8
4 Requirements for component design and component specifications . 10
4.1 General requirement . 10
4.2 Packaging . 10
4.3 Labelling of product packaging . 10
4.4 Component marking . 11
4.5 Storage and transportation . 12
4.6 Component outline and design . 12
4.7 Mechanical stress . 16
4.8 Component reliability assurance . 16
4.9 Additional requirements for compatibility with lead-free soldering . 16
5 Specification of assembly process conditions . 16
5.1 General . 16
5.2 Securing the component on the substrate prior to soldering . 18
5.3 Mounting methods . 19
5.4 Cleaning (where applicable) . 20
5.5 Removal and/or replacement of SMDs . 21
6 Typical process conditions . 22
6.1 Soldering processes, temperature/time profiles . 22
6.2 Typical cleaning conditions for assemblies . 26
7 Requirements for components and component specifications related to suitability
with various mounting processes . 27
7.1 General . 27
7.2 Wettability . 27
7.3 Resistance to dissolution of metallization . 27
7.4 Resistance to soldering heat . 27
7.5 Resistance to cleaning solvent . 28
7.6 Soldering profiles . 28
7.7 Bonding strength test for the component glue interface test . 28
Bibliography . 30
Figure 1 – Example of a component with marked specific orientation put in tape and tray . 11
Figure 2 – Vacuum pipette, pick-up area and component compartment:
Example for a component with a flat surface . 13
Figure 3 – Coplanarity of terminals . 13
Figure 4 – Stable seating of component . 14
Figure 5 – Unstable seating of component . 14
Figure 6 – Terminals arranged peripherally in two rows . 14
61760-1 IEC:2006 – 3 –
Figure 7 – Good contrast to component body and surroundings . 14
Figure 8 – Component weight/pipette suction strength . 15
Figure 9 – Process steps for soldering . 17
Figure 10 – Process steps for gluing. 18
Figure 11 – SnPb Vapour phase soldering – Temperature/time profile
(terminal temperature) . 22
Figure 12 – Lead-free SnAgCu Vapour phase soldering – Temperature/time profile
(terminal temperature) . 23
Figure 13 – Infrared soldering, forced gas convection reflow soldering –
Temperature/time profile for SnPb solders . 24
Figure 14 – Infrared soldering, forced gas convection reflow soldering –
Temperature/time profile for lead-free SnAgCu solders . 25
Figure 15 – Double wave soldering for SnPb and lead-free SnAgCu solder –
Temperature/time profile (terminal temperature) . 26
Table 1 – Basic cleaning processes . 26
– 4 – 61760-1 IEC:2006
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
SURFACE MOUNTING TECHNOLOGY –
Part 1: Standard method for the specification
of surface mounting components (SMDs)
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardizati
...
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