IEC 60286-3:2013

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition:
a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes);
b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).

Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues

La CEI 60286-3:2013 est applicable à la mise en bande des composants électroniques sans fils de sortie ou avec tronçons de sortie destinés à être connectés à des circuits électroniques. Elle fournit uniquement les dimensions essentielles pour la mise sur bande de composants destinés aux opérations mentionnées ci-dessus. La présente norme inclut également des exigences relatives à l'emballage de produits à puce isolée incluant puces nues et puces à contact (puces retournées). Cette cinquième édition annule et remplace la quatrième édition parue en 2007, la CEI 60286 3-1, parue en 2009 et la CEI 60286 3-2, parue en 2009. Elle constitue une révision complète de la topologie. En outre, cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) intégration de la CEI 60286-3-1:2009 comme type 1b (Emballage de composants pour montage en surface sur des bandes d'entraînement continues formées à la presse;
b) intégration de la CEI 60286-3-2:2009 comme type 2b (Emballage de composants pour montage en surface sur des bandes d'entraînement gaufrées de 4 mm de large).

General Information

• Status: Published
• Publication Date: 16-May-2013
• ICS: 31.020 - Electronic components in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: TC 40 - Capacitors and resistors for electronic equipment
• Drafting Committee: MT 60286-3 - TC 40/MT 60286-3
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 16-Jan-2019

Relations

• Replaces: IEC 60286-3-1:2009 - Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes
• Effective Date: 05-Sep-2023
• Replaces: IEC 60286-3-2:2009 - Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width
• Effective Date: 05-Sep-2023
• Revised: IEC 60286-3:2019 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
• Effective Date: 05-Sep-2023
• Revises: IEC 60286-3:2007 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60286-3 ®
Edition 5.0 2013-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes

Emballage de composants pour opérations automatisées –
Partie 3: Emballage des composants pour montage en surface en bandes
continues
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IEC 60286-3 ®
Edition 5.0 2013-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Packaging of components for automatic handling –

Part 3: Packaging of surface mount components on continuous tapes

Emballage de composants pour opérations automatisées –

Partie 3: Emballage des composants pour montage en surface en bandes

continues
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX W
ICS 31.020; 31.240 ISBN 978-2-83220-819-9

– 2 – 60286-3 © IEC:2013
CONTENTS
FOREWORD . 5

INTRODUCTION . 7

1 General . 8

1.1 Scope . 8

1.2 Normative references . 8

2 Terms and definitions . 8

3 Structure of the specification . 10

4 Dimensional requirements for taping. 10
4.1 Component cavity positioning requirements . 10
4.1.1 Requirements for types 1a, 1b, 2a, 2b and 3. 10
4.1.2 Requirements for types 4 . 10
4.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) . 11
4.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm) . 12
4.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 14
4.5 Type2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 16
4.6 Type 2b – Blister carrier tape, with single round sprocket holes and with

1mm tape pitch (tape widths: 4 mm) . 18
4.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm) . 20
4.8 Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare
die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 22
5 Polarity and orientation requirements of components in the tape . 25
5.1 Requirements for all tape types . 25
5.2 Specific requirements for type 1a . 25
5.3 Specific requirements for type 4 . 25
6 Carrier tape requirements . 25
6.1 Taping materials . 25
6.2 Minimum bending radius (for all types) . 26
6.3 Camber . 26
7 Cover tape requirements (for type 1a, 1b, 2a, 2b and 3) . 27
8 Component taping and additional tape requirements . 28

8.1 All types . 28
8.2 Specific requirements for type 1b . 28
8.3 Specific tape requirements for type 2b. 28
8.4 Specific requirement for type 4 . 28
8.4.1 General . 28
8.4.2 Coordinate system . 29
8.4.3 Component positioning and lateral displacement (see Figures 19 and 23) . 30
8.5 Specific requirements for tapes containing die products . 31
8.5.1 General . 31
8.5.2 Tape design for tapes containing die products . 31
8.5.3 Cleanliness . 31
8.5.4 Die lateral movement (Types 1a, 2a and 2b) . 32
9 Reel requirements . 32
9.1.1 General . 32

60286-3 © IEC:2013 – 3 –
9.1.2 Reel dimensions related to tape (see Figure 24 and Table 23) . 32

9.1.3 Reel hole dimensions (see Figure 25 and Table 24) . 34

9.2 Marking . 34

10 Tape reeling requirements . 35

10.1 All types . 35

10.2 Specific requirements for type 1a . 35

10.3 Specific requirements for type 4 . 35

10.4 Leader and trailer tape (see Figure 27) . 36

10.4.1 Leader . 36

10.4.2 Trailer . 36
10.5 Recycling . 36
10.6 Missing components . 36
Annex A (normative) Recommended measuring methods for type 1b . 37
Bibliography . 39

Figure 1 – Sectional view of component cavity (type 1b) . 9
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 12
Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 12
Figure 4 – Maximum component tilt, rotation and lateral movement . 12
Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) . 14
0 1 0 1
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 14
Figure 7 – Maximum component tilt, rotation and lateral movement . 14
Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) . 16
Figure 9 – Illustration of 2 mm cavity pitch and pocket offset . 16
Figure 10 – Maximum component tilt, rotation and lateral movement . 16
Figure 11 – Type 2b carrier tape . 18
Figure 12 – Maximum pocket offset . 18
Figure 13 – Maximum component tilt, rotation and lateral movement . 18
Figure 14 – Blister carrier tape . 20
Figure 15 – Elongated sprocket hole skew . 20
Figure 16 – Maximum component tilt, rotation and lateral movement . 20
Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment
pitch) . 23
Figure 18 – Illustration of 2 mm compartment pitch . 23
Figure 19 – Maximum
...