Printed electronics - Part 503-1: Quality assessment - Test method of displacement current measurement for printed thin-film transistor

IEC 62899-503-1:2020(E) specifies a test method for displacement current measurement (DCM) for printed thin film transistors (TFTs) or organic thin film transistors (OTFTs).

General Information

Status
Published
Publication Date
26-May-2020
Technical Committee
Current Stage
PPUB - Publication issued
Completion Date
27-May-2020
Ref Project

Buy Standard

Standard
IEC 62899-503-1:2020 - Printed electronics - Part 503-1: Quality assessment - Test method of displacement current measurement for printed thin-film transistor
English language
15 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (sample)

IEC 62899-503-1
Edition 1.0 2020-05
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 503-1: Quality assessment – Test method of displacement current
measurement for printed thin-film transistor
IEC 62899-503-1:2020-05(en)
---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2020 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from

either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC

copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or

your local IEC member National Committee for further information.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC

The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes

International Standards for all electrical, electronic and related technologies.
About IEC publications

The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the

latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org

The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,

variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English

committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.

and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary

details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and

once a month by email. French extracted from the Terms and Definitions clause of

IEC publications issued since 2002. Some entries have been

IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and

If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
---------------------- Page: 2 ----------------------
IEC 62899-503-1
Edition 1.0 2020-05
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 503-1: Quality assessment – Test method of displacement current
measurement for printed thin-film transistor
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.045; 31.080.30 ISBN 978-2-8322-8378-3

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC 62899-503-1:2020 © IEC 2020
CONTENTS

FOREWORD ........................................................................................................................... 3

INTRODUCTION ..................................................................................................................... 5

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms and definitions ...................................................................................................... 6

4 Abbreviated terms ........................................................................................................... 7

5 Symbols and units ........................................................................................................... 7

6 Measuring method of DCM .............................................................................................. 8

6.1 Guidelines on measurements of printed TFT channel properties ............................. 8

6.2 Procedure for DCM ................................................................................................. 8

6.2.1 Measuring apparatus ....................................................................................... 8

6.2.2 Measuring procedure ....................................................................................... 8

7 Report ........................................................................................................................... 10

7.1 Experimental conditions ........................................................................................ 10

7.2 Appropriate data format ........................................................................................ 10

Annex A (informative) Experimental results .......................................................................... 12

A.1 Charge trapping measurement method ................................................................. 12

A.2 Channel capacitance measurement method .......................................................... 13

Bibliography .......................................................................................................................... 15

Figure 1 – Example of structure (left) and schema (right) of a measuring device ..................... 8

Figure 2 – Plots of the printed TFT's U , I , I at U = −20V with respect to time ............... 9

GS s D DS

Figure 3 – Frequency dependence of DCM ........................................................................... 10

Figure A.1 – Plot of DCM at U = 0 V .................................................................................. 13

Figure A.2 – Division of regions according to carrier injection ............................................... 14

Table 1 – List of symbols ........................................................................................................ 7

Table 2 – Environmental factors ............................................................................................ 11

Table 3 – Measured properties of the TFT ............................................................................ 11

Table A.1 – Obtained trap charge from four cycles (accumulated) ......................................... 13

---------------------- Page: 4 ----------------------
IEC 62899-503-1:2020 © IEC 2020 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED ELECTRONICS –
Part 503-1: Quality assessment –
Test method of displacement current
measurement for printed thin-film transistor
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62899-503-1 has been prepared by IEC technical committee

119: Printed Electronics.
The text of this International Standard is based on the following documents:
FDIS Report on voting
119/303/FDIS 119/307/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 5 ----------------------
– 4 – IEC 62899-503-1:2020 © IEC 2020

A list of all parts in the IEC 62899 series, published under the general title Printed electronics,

can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct

understanding of its contents. Users should therefore print this document using a

colour printer.
---------------------- Page: 6 ----------------------
IEC 62899-503-1:2020 © IEC 2020 – 5 –
INTRODUCTION

There has been a need for a method to measure and evaluate performance and reliability that

is appropriate for printed thin-film transistors (TFTs). In the case of printed TFTs, there is

much larger parasitic capacitance than dielectric capacitance in the channel. Accordingly,

there has been a need for a method to measure and evaluate the properties for printed TFTs.

Carrier behavior is one such property, and mobility and threshold voltage (V ) for TFTs are

other properties. In the case of inorganic TFTs, for example complementary metal-oxide

semiconductor (CMOS) TFTs, carriers are induced by the strong inversion at the

semiconductor/dielectric interface. But in the case of organic or printed TFTs, carrier

generation takes place in the accumulation mode. The total number of carriers in the organic

semiconductor layer can often be insufficient to enrich the carrier concentration at the channel.

There exists a carrier injection. The carrier injection occurs at the interface of the organic

semiconductors' source/drain electrodes. There are three methods to investigate the carrier

injection property, that is, Kelvin probe microscopy, four-terminal measurement, and

displacement current measurement (DCM). Both Kelvin probe microscopy and four-terminal

measurement are indirect methods, but DCM is a direct method to detect charge motion in

semiconductors, molecular thin films, and nanoparticles. In this document, the DCM-based

channel charge trapping and channel capacitance measurement method is proposed as a

measuring method for the carrier properties of organic or printed TFTs.
---------------------- Page: 7 ----------------------
– 6 – IEC 62899-503-1:2020 © IEC 2020
PRINTED ELECTRONICS –
Part 503-1: Quality assessment –
Test method of displacement current
measurement for printed thin-film transistor
1 Scope

This part of IEC 62899 specifies a test method for displacement current measurement (DCM)

for printed thin-film transistors (TFTs) or organic thin-film transistors (OTFTs).

2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced docume

...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.