WG 5 - TC 119/WG 5

IEC TR 62899-550-1:2022(E), which is a Technical Report, provides a framework for evaluating the mechanical and thermal durability of printed and/or flexible electronics components and products. This includes the bending test, torsion test, stretching test, steady heat test as well as the thermal cycle test. These are typical conditions that are easily encountered in daily life for printed and/or flexible electronics components and products.
This document gives guidance for use for technical committees in the preparation of consistent standards relating to the quality assessment of printed and/or flexible electronics components and products. Consistent standards for durability testing will help users, including businesses, developers, vendors, and end users to select suitable methods for durability testing and make consistent test procedures for printed electronics.

IEC 62899-503-3:2021(E) specifies a measuring method of contact resistance for printed thin film transistors (TFTs) by the transfer length method (TLM). The method requires the fabrication of a test element group (TEG) with varying channel length (L) between source and drain electrodes. The method is intended for quality assessment of TFT electrode contacts and is suited for determining whether the contact resistance lies within a desired range.

IEC 62899-505:2020(E) specifies mechanical and thermal test methods for the determination of the reliability characteristics of a printed flexible gas sensor, which is operated at relatively low temperature and is composed of a flexible substrate, electrode, and gas sensing layer. The examples of target gas include in-door air pollutants, combustion gas from a fire situation, and industrial flue gas.

IEC 62899-503-1:2020(E) specifies a test method for displacement current measurement (DCM) for printed thin film transistors (TFTs) or organic thin film transistors (OTFTs).

IEC 62899-502-2:2019(E) specifies the combined mechanical and environmental stress test methods for flexible OLED (organic light emitting diode) elements fabricated using the printing method. Mechanical stress tests include the static and cycling vending test, and the dynamic and static rolling test.

IEC 62899-501-1:2019(E) specifies failure modes and mechanical stress test methods for the determination of reliability characteristics of bendable or flexible printed primary cells and secondary cells and batteries as defined in IEC 60050-482:2004, 482-01-01, IEC 60050‑482:2004, 482-01-02, IEC 60050-482:2004, 482-01-03, IEC 60050-482:2004, 482‑01-04 and IEC 60050-482:2004, 482-01-05, respectively.
Important parameters and specifications for primary cells are mentioned in IEC 60086-1 and IEC 60086-2. IEC 61960-3, as well as IEC 61951-1 and IEC 61951-2 define performance tests, designations, markings, dimensions and other requirements for secondary single cells and batteries. IEC 62133-1 and IEC 62133-2 address general safety requirements of secondary cells and batteries.

IEC 62899-502-1:2017(E) specifies the quality assessment methods, especially the mechanical stress test methods, for reliability assessment.
This document is applicable to flexible OLED elements formed on flexible substrates by printed electronics technology excluding those OLED products, which are intended to be used for lighting purposes.