IEC TS 61000-5-9:2009

Electromagnetic compatibility (EMC) - Part 5-9: Installation and mitigation guidelines - System-level susceptibility assessments for HEMP and HPEM

IEC/TS 61000-5-9:2009(E) is to present a methodology to assess the impact of High-altitude Electromagnetic Pulse (HEMP) and High Power Electromagnetic (HPEM) environments on electronic systems. In this context a system refers to a collection of sub-systems, equipment and components brought together to perform a function. The techniques associated with this methodology and their advantages and disadvantages will be presented along with examples of how the techniques can be applied to evaluate the susceptibility of electronic systems such as those found in installations. This work is closely related to the evaluation of EMC system level susceptibility. The purpose of IEC/TS 61000-5-9:2009 is to provide information on available methods for the assessment of system-level susceptibility as a result of HEMP and HPEM environments. The advantages and disadvantages of the methods will be discussed along with examples of how the techniques should be employed. Typical systems have external connections, wired or wireless, and the assessment of these are included within this specification. IEC/TS 61000-5-9:2009 gives general guidance. It does not cover safety issues nor does it conflict with ITU-T efforts concerning the protection of telecommunications equipment. IEC/TS 61000-5-9:2009 has the status of a basic EMC publication in accordance with IEC Guide 107.

General Information

• Status: Published
• Publication Date: 07-Jul-2009
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 33.100.20 - Immunity
• Technical Committee: SC 77C - High power transient phenomena
• Current Stage: PPUB - Publication issued
• Start Date: 31-Oct-2009
• Completion Date: 08-Jul-2009

Standards Content (Sample)

IEC/TS 61000-5-9 ®
Edition 1.0 2009-07
TECHNICAL
SPECIFICATION
BASIC EMC PUBLICATION
Electromagnetic compatibility (EMC) –
Part 5-9: Installation and mitigation guidelines – System-level susceptibility
assessments for HEMP and HPEM
IEC/TS 61000-5-9:2009(E)
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IEC/TS 61000-5-9 ®
Edition 1.0 2009-07
TECHNICAL
SPECIFICATION
BASIC EMC PUBLICATION
Electromagnetic compatibility (EMC) –
Part 5-9: Installation and mitigation guidelines – System-level susceptibility
assessments for HEMP and HPEM
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
XB
ICS 33.100.20 ISBN 978-2-88910-396-6
– 2 – TS 61000-5-9 © IEC:2009(E)
CONTENTS
FOREWORD.5
INTRODUCTION.7
1 Scope.8
2 Normative references .8
3 Terms and definitions .9
4 General .11
4.1 Introduction .11
4.2 Systems and subsystems .12
5 Interaction mechanisms and protection methods .13
5.1 General .13
5.2 Front-door coupling .13
5.3 Back-door coupling.13
5.4 Protection methods .14
6 Description of overall assessment methodology .14
6.1 Methodology.14
6.2 Subsystems and equipment characterization phase.16
6.3 System analysis phase.17
6.4 System test phase.17
6.4.1 General .17
6.4.2 Low-level tests .18
6.4.3 High-level testing.18
6.5 Susceptibility assessment phase .20
6.6 The use of reverberation chambers to characterise immunity .20
Annex A (informative) Classification of effect .24
Annex B (informative) Good measurement practice.27
Annex C (informative) Computational electromagnetics .30
Annex D (informative) System level assessment – HEMP .33
Annex E (informative) System level assessment – HPEM .35
Annex F (informative) Limitations.39
Annex G (informative) Detailed description of low-level techniques.42
Annex H (informative) Detailed description of high-level test techniques .54
Annex I (informative) Data processing and analysis .61
Bibliography.66

Figure 1 – Example system architecture .
Figure 2 – Example of radiated HPEM at high frequencies [3].14
Figure 3 – Methodology flowchart .15
Figure 4 – Reverberation chamber results: all effects.21
Figure 5 – Reverberation chamber results: susceptibilities.22
Figure 6 – Frequency spectrum of several HPEM sources .23
Figure A.1 – Classification of effect.24
Figure B.1 – Effect of adding ferrites to connecting cable: swept frequency example .27

TS 61000-5-9 © IEC:2009(E) – 3 –
Figure B.2 – Effect of adding ferrite to connecting cable: reverberation chamber
example.28
Figure B.3 – Effect of adding ferrite to connecting cable: transient example (time
domain) .28
Figure B.4 – Effect of adding ferrite to connecting cable: transient example (frequency
domain) .29
Figure E.1 – Steps taken in the system assessment .36
Figure E.2 – Maximum free-space separation distances.38
Figure E.3 – Critical regions for permanent damage.38
Figure G.1 – Electromagnetic interaction sequence diagram for a facility illuminated by
an external antenna .43
Figure G.2 – Illustration of the difference of a directed, narrow-beam antenna exciting
the facility with a spot beam, along with a plane wave providing illumination to the
entire facility .45
Figure G.3 – Measurement equipment and configuration for measuring transient
responses in a buried facility, as reported by [G-6] .47
Figure G.4 – Example of a measured transient cable current (a) and the resulting
spectral magnitude, as computed by a Fourier transform (b) .48
Figure G.5 – Plots of the analytical pulser output open circuit voltage waveform (a)
and spectral magnitude (b), which are used as reference for computing the transfer
function T .48
sc
Figure G.6 – The radiated E-field from the IRA at a distance of 6 meters for the
analytical pulser excitation (a) and the resulting spectral magnitude (b).49
Figure G.7 – The spectral magnitude of the computed transfer function T (a) and the
sc
corresponding transient transfer function (b).49
Figure G.8 – The spectral magnitude of the computed transfer function T (a) and the
ec
corresponding transient transfer function (b).50
Figure G.9 – LLCW reference field measurement.51
Figure G.10 – LLCW induced current measurement .51
Figure G.11 – Typical magnitude-only transfer function.52
Figure H.1 – Microwave injection testing of a low noise amplifier, LNA [H-2]. LNA at
the tip of the arrow.54
Figure H.2 – Aircraft testing at the Swedish Microwave Test Facility, MTF [H-3] .55
Figure H.3 – Measured shielding effectiveness of an equipment compared to the MTF
test frequencies (dashed bars) [3].56
Figure H.4 – Reverberation chamber .58
Figure I.1 – Prediction of induced current using magnitude-only transfer functions [I-1] .61
Figure I.2 – IEC 61000-2-9 HEMP Waveform .62
Figure I.3 – Convolution process.62
Figure I.4 – Predicted induced current .63
Figure I.5 – Comparison of transfer function predictions with simulator measurements .64
Figure I.6 – Extrapolation of measured transients .65

– 4 – TS 61000-5-9 © IEC:2009(E)
Table A.1 – Categorisation of effect by criticality.25
Table A.2 – Categorisation of effect duration .26
Table A.3 – Combination of criticality level and duration category.26
Table I.1 – Comparison of transfer function predictions and simulator measured
currents .63

TS 61000-5-9 © IEC:2009(E) – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTROMAGNETIC COMPATIBILITY (EMC) –

Part 5-9: Installation and mitigation guidelines –
System-level susceptibility assessments for HEMP and HPEM

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