IEC 61189-6:2006

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

IEC 61189-6:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.

Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion et les ensembles - Partie 6: Méthodes d'essai des matériaux utilisés dans la fabrication des assemblages électroniques

La CEI 61189-6:2006 est un catalogue de méthodes d'essai représentant les méthodologies et modes opératoires applicables aux matériaux utilisés dans la fabrication des assemblages électroniques.

General Information

• Status: Withdrawn
• Publication Date: 23-Jul-2006
• Withdrawal Date: 28-Mar-2024
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 3 - TC 91/WG 3
• Current Stage: WPUB - Publication withdrawn
• Start Date: 29-Mar-2024
• Completion Date: 02-Apr-2024

Relations

• Replaced By: IEC 61189-5-501:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
• Effective Date: 05-Sep-2023
• Replaced By: IEC 61189-5-502:2021 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
• Effective Date: 05-Sep-2023

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD 61189-6
First edition
2006-07
Test methods for electrical materials,
interconnection structures and assemblies –
Part 6:
Test methods for materials used
in manufacturing electronic assemblies

Reference number
Publication numbering
As from 1 January 1997 all IEC publications are issued with a designation in the

60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.

Consolidated editions
The IEC is now publishing consolidated versions of its publications. For example,

edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the

base publication incorporating amendment 1 and the base publication incorporating

amendments 1 and 2.
Further information on IEC publications
The technical content of IEC publications is kept under constant review by the IEC,
thus ensuring that the content reflects current technology. Information relating to
this publication, including its validity, is available in the IEC Catalogue of
publications (see below) in addition to new editions, amendments and corrigenda.
Information on the subjects under consideration and work in progress undertaken
by the technical committee which has prepared this publication, as well as the list
of publications issued, is also available from the following:
• IEC Web Site (www.iec.ch)
• Catalogue of IEC publications
The on-line catalogue on the IEC web site (www.iec.ch/searchpub) enables you to
search by a variety of criteria including text searches, technical committees
and date of publication. On-line information is also available on recently issued
publications, withdrawn and replaced publications, as well as corrigenda.
• IEC Just Published
This summary of recently issued publications (www.iec.ch/online_news/ justpub)
is also available by email. Please contact the Customer Service Centre (see
below) for further information.
• Customer Service Centre
If you have any questions regarding this publication or need further assistance,
please contact the Customer Service Centre:

Email: [e-mail]
Tel: [phone]
Fax: [phone]
INTERNATIONAL IEC
STANDARD 61189-6
First edition
2006-07
Test methods for electrical materials,
interconnection structures and assemblies –
Part 6:
Test methods for materials used
in manufacturing electronic assemblies

 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale X
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 61189-6  IEC:2006(E)
CONTENTS
FOREWORD.4

INTRODUCTION.6

1 Scope.7

2 Normative references .7

3 Accuracy, precision and resolution .7

3.1 Accuracy .8

3.2 Precision .8
3.3 Resolution .9
3.4 Report .9
3.5 Student’s "t" distribution .9
3.6 Suggested uncertainty limits.10
4 Catalogue of approved test methods .11
5 P: Preparation/conditioning test methods.11
6 V: Visual test methods.11
7 D: Dimensional test methods .11
8 C: Chemical test methods.11
8.1 Test 6C01: Determination of acid value of liquid soldering flux 
potentiometric and visual titration methods.11
8.2 Test 6C02: Determination of halides in fluxes, silver chromate method.14
8.3 Test 6C03: Solids content, flux .16
8.4 Test 6C04: Quantitative determination of halide content in fluxes (chloride
and bromide) .17
8.5 Test 6C05: Qualitative analysis of fluorides and fluxes by spot test .22
8.6 Test 6C06: Quantitative determination of fluoride concentration in fluxes .23
8.7 Test 6C07: Acid number of rosin .26
8.8 Test 6C08: Specific gravity.26
8.9 Test 6C09: Determination of the percentage of flux on/in flux-coated and/or
flux-cored solder .27
8.10 Test 6C10: Flux induced corrosion (copper mirror method).28
9 M: Mechanical test methods .30
10 E: Electrical test methods .30

11 N: Environmental test methods.30
12 X: Miscellaneous test methods .31
12.1 Test 6X01: Determination of solder powder particle size distribution – Screen
method for types 1-4 .31
12.2 Test 6X02: Solder powder particle size distribution-measuring microscope
method.33
12.3 Test 6X03: Solder powder particle size distribution – Optical image analyser
method.34
12.4 Test 6X04: Solder powder particle size distribution – Measuring laser
diffraction method.36
12.5 Test 6X05: Determination of maximum solder powder particle size.38
12.6 Test 6X06: Solder paste metal content by weight .39

61189-6  IEC:2006(E) – 3 –
Figure 1 – Chlorides and/or bromides test results .16

Figure 2 – Test equipment of specific gravity (hydrometer reading).26

Figure 3 – Flux type classification by copper mirror test.30

Table 1 – Student’s "t" distribution .10

Table 2 – Relation between halide content and mass of specimen .20

Table 3 – Mixing ratio from specimen size to water quantity.23

Table 4 – Specimen size to chloroform mixture .24

Table 5 – Screen opening .32
Table 6 – Portions of particle sizes by weight % – nominal values .32
Table 7 – Powder particle size distribution record .32
Table 8 – Powder particle size distribution record .34
Table 9 – Powder particle size distribution record (optical analysis) .36
Table 10 – Powder particle size distribution record .37
Table 11 – Acceptance of powders by particle sizes .38
Table 12 – Test report on solder paste.39
Table 13 – Test report on solder paste.41

– 4 – 61189-6  IEC:2006(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION

___________
TEST METHODS FOR ELECTRICAL MATERIALS,

INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 6: Test methods for materials used

in manufacturing electronic assemblies

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 61189-6 has been prepared by IEC technical committee 91:
Electronic assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/593/FDIS 91/610/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

61189-6  IEC:2006(E) – 5 –
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

This standard should be used in conjunction with the following parts of IEC 61189, under the
main title Test methods for electrical materials, interconnection structures and assemblies:

Part 1: General test methods and methodology

Part 2: Test methods for materials for interconnection structures

Part 3: Test methods for interconnection structures (printed boards)

Part 4: Test methods for electronic components assembling characteristics

Part 5: Test methods for printed board assemblies,

and also the following standard:
IEC 60068: Environmental testing
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date
...

IEC 61189-6
Edition 1.0 2006-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, interconnection structures and
assemblies –
Part 6: Test methods for materials used in manufacturing electronic assemblies

Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion
et les ensembles –
Partie 6: Méthodes d'essai des matériaux utilisés dans la fabrication des
assemblages électroniques
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: [e-mail]
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
ƒ IEC Just Published: www.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
ƒ Electropedia: www.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
ƒ Customer Service Centre: www.iec.ch/webstore/custserv
If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service
Centre FAQ or contact us:
Email: [e-mail]
Tel.: [phone]
Fax: [phone]
A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.
ƒ Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm
Le Catalogue en-ligne de la CEI vous permet d’effectuer des recherches en utilisant différents critères (numéro de référence,
texte, comité d’études,…). Il donne aussi des informations sur les projets et les publications retirées ou remplacées.
ƒ Just Published CEI: www.iec.ch/online_news/justpub
Restez informé sur les nouvelles publications de la CEI. Just Published détaille deux fois par mois les nouvelles
publications parues. Disponible en-ligne et aussi par email.
ƒ Electropedia: www.electropedia.org
Le premier dictionnaire en ligne au monde de termes électroniques et électriques. Il contient plus de 20 000 termes et
définitions en anglais et en français, ainsi que les termes équivalents dans les langues additionnelles. Egalement appelé
Vocabulaire Electrotechnique International en ligne.
ƒ Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm
Si vous désirez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du
Service clients ou contactez-nous:
Email: [e-mail]
Tél.: [phone]
Fax: [phone]
IEC 61189-6
Edition 1.0 2006-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, interconnection structures and
assemblies –
Part 6: Test methods for materials used in manufacturing electronic assemblies

Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion
et les ensembles –
Partie 6: Méthodes d'essai des matériaux utilisés dans la fabrication des
assemblages électroniques
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
X
CODE PRIX
ICS 31.180 ISBN 2-8318-9716-5
– 2 – 61189-6 © IEC:2006
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope.7
2 Normative references .7
3 Accuracy, precision and resolution .7
3.1 Accuracy .8
3.2 Precision .8
3.3 Resolution .9
3.4 Report .9
3.5 Student’s "t" distribution .9
3.6 Suggested uncertainty limits.10
4 Catalogue of approved test methods .11
5 P: Preparation/conditioning test methods.11
6 V: Visual test methods.11
7 D: Dimensional test methods .11
8 C: Chemical test methods.11
8.1 Test 6C01: Determination of acid value of liquid soldering flux 
Potentiometric and visual titration methods .11
8.2 Test 6C02: Determination of halides in fluxes, silver chromate method.14
8.3 Test 6C03: Solids content, flux .16
8.4 Test 6C04: Quantitative determination of halide content in fluxes (chloride
and bromide) .17
8.5 Test 6C05: Qualitative analysis of fluorides and fluxes by spot test .22
8.6 Test 6C06: Quantitative determination of fluoride concentration in fluxes .23
8.7 Test 6C07: Acid number of rosin .26
8.8 Test 6C08: Specific gravity.26
8.9 Test 6C09: Determination of the percentage of flux on/in flux-coated and/or
flux-cored solder .27
8.10 Test 6C10: Flux induced corrosion (copper mirror method).28
9 M: Mechanical test methods .30
10 E: Electrical test methods .30
11 N: Environmental test methods.30
12 X: Miscellaneous test methods .31
12.1 Test 6X01: Determination of solder powder particle size distribution –
Screen method for types 1-4 .31
12.2 Test 6X02: Solder powder particle size distribution – Measuring microscope
method.33
12.3 Test 6X03: Solder powder particle size distribution – Optical image analyser
method.34
12.4 Test 6X04: Solder powder particle size distribution – Measuring laser
diffraction method.36
12.5 Test 6X05: Determination of maximum solder powder particle size.37
12.6 Test 6X06: Solder paste metal content by weight .39

61189-6 © IEC:2006 – 3 –
Figure 1 – Chlorides and/or bromides test results .16
Figure 2 – Test equipment of specific gravity (hydrometer reading).26
Figure 3 – Flux type classification by copper mirror test.30

Table 1 – Student’s "t" distribution .10
Table 2 – Relation between halide content and mass of specimen .20
Table 3 – Mixing ratio from specimen size to water quantity.23
Table 4 – Specimen size to chloroform mixture .24
Table 5 – Screen opening .32
Table 6 – Portions of particle sizes by weight % – nominal values .32
Table 7 – Powder particle size distribution record .32
Table 8 – Powder particle size distribution record .34
Table 9 – Powder particle size distribution record (optical analysis) .36
Table 10 – Powder particle size distribution record .37
Table 11 – Acceptance of powders by particle sizes .38
Table 12 – Test report on solder paste.39
Table 13 – Test report on solder paste.41

– 4 – 61189-6 © IEC:2006
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
TEST METHODS FOR ELECTRICAL MATERIALS,
INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 6: Test methods for materials used
in manufacturing electronic assemblies

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
...