SIST EN 61190-1-2:2003

Attachment materials for electronic assembly -- Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Verbindungsmaterialien für Baugruppen der Elektronik -- Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage

Matériaux de fixation pour les assemblages électroniques -- Partie 1-2: Exigences relatives aux crèmes de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques

Spécifie les exigences d'ordre général relatives à la caractérisation et au contrôle des crèmes à braser utilisées pour obtenir des interconnexions de haute qualité dans l'assemblage de composants électroniques. Prescrit un document de contrôle de la qualité (qui n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication).

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

General Information

• Status: Withdrawn
• Publication Date: 31-Mar-2003
• Withdrawal Date: 15-Aug-2021
• ICS: 25.160.50 - Brazing and soldering
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 9990 - Retro Withdrawal (Adopted Project)
• Start Date: 28-Jul-2021
• Due Date: 20-Aug-2021
• Completion Date: 16-Aug-2021
• Ref Project: EN 61190-1-2:2002 - Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

Relations

• Replaced By: SIST EN 61190-1-2:2007 - Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
• Effective Date: 29-Jan-2023
• Replaced By: SIST EN 61190-1-2:2007 - Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
• Effective Date: 06-May-2014
• Replaced By: SIST EN 61190-1-2:2007 - Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
• Effective Date: 01-May-2010

Standards Content (Sample)

SLOVENSKI SIST EN 61190-1-2:2003

STANDARD
april 2003
Attachment materials for electronic assembly - Part 1-2: Requirements for solder
pastes for high-quality interconnections in electronics assembly
ICS 25.160.50; 31.190 Referenčna številka
SIST EN 61190-1-2:2003(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 61190-1-2
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2002
ICS 31.190
English version
Attachment materials for electronic assembly
Part 1-2: Requirements for solder pastes for high-quality
interconnections in electronics assembly
(IEC 61190-1-2:2002)
Matériaux de fixation pour Verbindungsmaterialien für
les assemblages électroniques Baugruppen der Elektronik
Partie 1-2: Exigences relatives aux Teil 1-2: Anforderungen an Lotpaste für
crèmes de brasage pour les hochwertige Verbindungen in der
interconnexions de haute qualité Elektronikmontage
dans les assemblages de (IEC 61190-1-2:2002)
composants électroniques
(CEI 61190-1-2:2002)
This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-2:2002 E

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EN 61190-1-2:2002 - 2 -
Foreword
The text of document 91/278/FDIS, future edition 1 of IEC 61190-1-2, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 61190-1-2 on 2002-06-01.
The followin
...