SIST EN 61190-1-2:2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

EN IEC 61190-1-2 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1.

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage

Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques

IEC 61190-1-2:2014-02(en-fr) spécifie les exigences d'ordre général relatives à la caractérisation et à l'essai des pâtes à braser utilisées pour obtenir des interconnexions électroniques de haute qualité dans l'assemblage de composants électroniques. La présente norme sert de document de contrôle de la qualité et n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:  a) modification des dimensions granulométriques de la poudre à braser dans le Tableau 2;  b) ajout d'informations relatives à la 'Condition et profil de refusion' en Annexe B;  c) ajout d'une nouvelle Annexe C.

Povezovalni materiali za elektronske sestave - 1-2. del: Zahteve za spajkalne paste za visokokakovostne povezave v elektronskih sestavih (IEC 61190-1-2:2014)

Standard EN IEC 61190-1-2 določa splošne zahteve za določanje značilnosti in preskušanje spajkalnih past za visokokakovostne elektronske povezave v elektronskih sestavih. Ta standard se uporablja kot dokument za nadzor kakovosti in ni namenjen neposredni navezavi na zmogljivost materiala pri procesu izdelave. Informacije, povezane s karakterizacijo talil, nadzorom kakovosti in dokumentacijo o naročilu za talila za spajkanje in talila, ki vsebujejo materiale, so navedene v standardu IEC 61190-1-1.

General Information

• Status: Published
• Publication Date: 12-Aug-2014
• ICS: 25.160.50 - Brazing and soldering
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 14-Jul-2014
• Due Date: 18-Sep-2014
• Completion Date: 13-Aug-2014
• Ref Project: EN 61190-1-2:2014 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Relations

• Replaces: SIST EN 61190-1-2:2007 - Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
• Effective Date: 29-Jan-2023
• Amends: SIST EN 61190-1-2:2007 - Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
• Effective Date: 05-Jun-2012
• Revised: SIST EN 61190-1-2:2007 - Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
• Effective Date: 06-May-2014
• Replaces: SIST EN 61190-1-2:2007 - Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
• Effective Date: 07-Jun-2022

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61190-1-2:2014
01-september-2014
1DGRPHãþD
SIST EN 61190-1-2:2007
Povezovalni materiali za elektronske sestave - 1-2. del: Zahteve za spajkalne paste
za visokokakovostne povezave v elektronskih sestavih (IEC 61190-1-2:2014)
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering
pastes for high-quality interconnects in electronics assembly
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an
Lotpaste für hochwertige Verbindungen in der Elektronikmontage
Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences
relatives aux pâtes à braser pour les interconnexions de haute qualité dans les
assemblages de composants électroniques
Ta slovenski standard je istoveten z: EN 61190-1-2:2014
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61190-1-2:2014 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61190-1-2:2014

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SIST EN 61190-1-2:2014


EUROPEAN STANDARD EN 61190-1-2

NORME EUROPÉENNE

EUROPÄISCHE NORM
May 2014
ICS 31.190 Supersedes EN 61190-1-2:2007
English Version
Attachment materials for electronic assembly - Part 1-2:
Requirements for soldering pastes for high-quality interconnects
in electronics assembly
(IEC 61190-1-2:2014)
Matériaux de fixation pour les assemblages électroniques - Verbindungsmaterialien für Baugruppen der Elektronik - Teil
Partie 1-2: Exigences relatives aux pâtes à braser pour les 1-2: Anforderungen an Lotpaste für hochwertige
interconnexions de haute qualité dans les assemblages de Verbindungen in der Elektronikmontage
composants électroniques (IEC 61190-1-2:2014)
(CEI 61190-1-2:2014)
This European Standard was approved by CENELEC on 2014-03-26. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61190-1-2:2014 E

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SIST EN 61190-1-2:2014
EN 61190-1-2:2014 - 2 -
Foreword
The text of document 91/1154A/FDIS, future edition 3 of IEC 61190-1-2, prepared by IEC/TC 91
"Electronics assembly technology " was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61190-1-2:2014.

The following dates are fixed:
(dop) 2014-12-26
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement

(dow) 2017-03-26
• latest date by which the national
standards conflicting with the
document have to be withdrawn

This document supersedes EN 61190-1-2:2007.

EN 61190-1-2:2014 includes the following significant technical changes with respect to EN 61190-1-
2:2007:

a) modification of the solder powder size in Table 2;
b) addition of the information of “Reflow condition and profile” in Annex B;
c) addition of a new Annex C.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 61190-1-2:2014 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:

IEC 61189-5:2006 NOTE Harmonised as EN 61189-5:2006 (not modified).
IEC 61189-6:2006 NOTE Harmonised as EN 61189-6:2006 (not modified).

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SIST EN 61190-1-2:2014
- 3 - EN 61190-1-2:2014
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year


IEC 60194 - Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions


IEC 61189-5-3 - Test methods for electrical materials, EN 61189-5-3 -
interconnection structures and assemblies -
Part 5-3: Test methods for printed board
assemblies: Soldering paste


IEC 61190-1-1 - Attachment materials for electronic - -
assemblies -
Part 1-1: Requirements for soldering fluxes


IEC 61190-1-3 - Attachment materials for electronic assembly - EN 61190-1-3 -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications


ISO 9454-2 - Soft soldering fluxes - Classification and EN ISO 9454-2 -
requirements -
Part 2: Performance requirements

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SIST EN 61190-1-2:2014

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SIST EN 61190-1-2:2014




IEC 61190-1-2

®


Edition 3.0 2014-02




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Attachment materials for electronic assembly –

Part 1-2: Requirements for soldering pastes for high-quality interconnects in

electronics assembly




Matériaux de fixation pour les assemblages électroniques –

Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de


haute qualité dans les assemblages de composants électroniques













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX T


ICS 31.190 ISBN 978-2-83221-423-7



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61190-1-2:2014
– 2 – 61190-1-2  IEC:2014
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Standardized description for products . 8
5 Test methods . 8
6 Requirements . 9
6.1 General . 9
6.2 Conflict . 9
6.3 Alloy composition . 9
6.4 Flux characterization and inspection . 9
6.4.1 General . 9
6.4.2 Shelf life . 10
6.5 Solder powder particle size . 10
6.5.1 Powder size determination . 10
6.5.2 Powder size . 10
6.5.3 Solder powder particle shape. 11
Metal per cent . 11
6.6
6.7 Viscosity . 11
6.7.1 General . 11
6.7.2 Methods of determining viscosity . 11
6.8 Slump and smear test . 12
6.8.1 General . 12
6.8.2 Test with 0,2 mm thick stencil . 12
6.8.3 Test with 0,1 mm thick stencil . 12
6.9 Solder ball test . 13
6.9.1 General . 13
6.9.2 Type 1-4 powder . 13
6.9.3 Type 5-7 powder . 13
Tack test . 14
6.10
6.11 Wetting . 14
6.12 Labelling . 14
7 Quality assurance provisions . 15
7.1 Responsibility for inspection . 15
7.1.1 General . 15
7.1.2 Responsibility for compliance . 16
7.1.3 Test equipment and inspection facilities . 16
7.1.4 Inspection conditions . 16
7.2 Classification for inspections . 16
7.3 Inspection report form . 16
7.4 Qualification inspection . 16
7.4.1 General . 16
7.4.2 Sample size . 17
7.4.3 Inspection routine . 17
7.5 Quality conformance . 17

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SIST EN 61190-1-2:2014
61190-1-2  IEC:2014 – 3 –
7.5.1 General . 17
7.5.2 Sampling plan . 17
7.5.3 Rejected lots . 17
8 Preparation for delivery . 17
9 Additional information – Performance and shelf life extension inspections . 18
Annex A (normative) Test report on solder paste . 19
Annex B (informative) Reflow condition and profile . 20
Annex C (informative) Typical comparison of particle size distributions between laser
diffraction method and screen method . 21
Bibliography . 22

Figure 1 – Slump test stencil thickness, 0,20 mm . 12
Figure 2 – Slump test stencil thickness, 0,10 mm . 13
Figure 3 – Solder ball test standards . 15
Figure C.1 – Typical comparison between laser diffraction and sieving . 21

Table 1 – Standardized solder paste description . 8
Table 2 – Standard solder powders . 10
Table 3 – Test methods for particle size distribution . 11
Table 4 – Solder paste qualification inspection . 17
Table 5 – User inspection for solder paste prior to use . 18
Table A.1 – Solder paste inspection report form . 19

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SIST EN 61190-1-2:2014
– 4 – 61190-1-2  IEC:2014
INTERNATIONAL ELECTROTECHNICAL COMMISSION
______________

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics assembly


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61190-1-2 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This third edition cancels and replaces the second edition published in 2007. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of “Reflow condition and profile” in Annex B;
c) addition of a new Annex C.

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SIST EN 61190-1-2:2014
61190-1-2  IEC:2014 – 5 –
The text of this standard is based on the following documents:
CDV Report on voting
91/1154A/FDIS 91/1166/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61190 series, published under the general title Attachment
materials for electronic assembly, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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SIST EN 61190-1-2:2014
– 6 – 61190-1-2  IEC:2014
INTRODUCTION
This part of IEC 61190 defines the characteristics of solder paste through the definitions of
properties and specification of test methods and inspection criteria. Materials include solder
powder and solder paste flux blended to produce solder paste. Solder powders are classified
according to both shape and size distribution of the particles. It is not the intention of this
standard to exclude those particle sizes or distributions not specifically listed. For flux
properties of solder paste, including classification and testing, see IEC 61190-1-1.
The requirements for solder paste are defined in general terms. In practice, where more
stringent requirements are necessary, additional requirements may be defined by mutual
agreement between the user and supplier. Users are cautioned to perform tests (beyond the
scope of this specification) to determine the acceptability of the solder paste for specific
processes.
This standard is intended to be applicable to all types of solder paste used for soldering in
general, as well as for soldering in electronics assembly. The solder pastes involved relate to
all aspects of application. Generic specifications for soldering pastes are given in ISO 9454-2.

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SIST EN 61190-1-2:2014
61190-1-2  IEC:2014 – 7 –
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics assembly



1 Scope
This part of IEC 61190 specifies general requirements for the characterization and testing of
solder pastes used to make high-quality electronic interconnections in electronics assembly.
This standard serves as a quality control document and is not intended to relate directly to the
material's performance in the manufacturing process.
Related information on flux characterization, quality control and procurement documentation
for solder flux and flux containing material may be found in IEC 61190-1-1.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
1
IEC 61189-5-3 , Test methods for electrical materials, interconnection structures and
assemblies – Part 5-3: Test methods for printed board assemblies: Soldering paste
IEC 61190-1-1, Attachment materials for electronic assembly – Part 1-1: Requirements for
soldering fluxes for high quality interconnections in electronics assembly
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
ISO 9454-2, Soft soldering fluxes – classification and requirements – Part 2: Performance
requirements
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194, as well as
the following apply.
3.1
drying
ambient or heating process to evaporate volatile components from solder paste which may, or
may not, result in melting of rosin/resin
3.2
rheology
___________
1
To be published.

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SIST EN 61190-1-2:2014
– 8 – 61190-1-2  IEC:2014
study of the change in form and the flow of matter, generally characterized by elasticity,
viscosity, and plasticity
3.3
lead free solder
solder alloy which lead content is equal to, or less than 0,10 % by mass
3.4
thinner
thinner paste
solvent or paste system with, or without, activator which is added to solder paste to replace
evaporated solvents, adjust viscosity, or reduce solids content
3.5
viscosity
internal friction of a fluid, caused by molecular attraction, which makes it resist a tendency to
flow, expressed in pascal-seconds (Pa·s)
4 Standardized description for products
The solder paste product shall be described as outlined in Table 1.
Table 1 – Standardized solder paste description
Alloy Flux Powder size Nominal metal Viscosity
a
designation classification type content
b
Designation from Classification from Type no. Weight per cent Pa·s
IEC 61190-1-3 IEC 61190-1-1
or ISO 9454-2
a
 As defined and determined in IEC 61190-1-1 for low (L), moderate (M), and high (H) activity of the flux residues.
b
See Table 2.

5 Test methods
The test methods used in this standard are taken from IEC 61189-5-3:
Test methods for electrical materials, interconnection structures and assemblies –
Part 5-3:Test methods for printed board assemblies: Soldering paste:
2
5-3X01 Paste flux viscosity – T-Bar spindle method (5X02)
2
5-3X02 Spread test, liquid or extracted solder flux and solder paste (5X03)
5-3X03 Solder paste viscosity – t-bar spin spindle method (applicable for 300 Pa-s to
2
1 600 Pa-s) (5X04)
5-3X04 Solder paste viscosity – t-bar spindle method (applicable at less than 300 Pa-s)
2
(5X05)
2
5-3X05 Solder paste viscosity – spiral pump method (for 300 Pa-s to 1 600 Pa-s) (5X06)
5-3X06 Solder paste viscosity – spiral pump method (applicable at less than 300 Pa-s)
2
(5X07)
2
5-3X07 Solder paste – slump test (5X08)
___________
2
(5X0x ) ; Test number in IEC 61189-5:2006, see Bibliography.

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SIST EN 61190-1-2:2014
61190-1-2  IEC:2014 – 9 –
2
5-3X08 Solder paste – solder ball test (5X09)
2
5-3X09 Solder paste – tack test (5X10)
2
5-3X10 Solder paste – wetting test (5X11)
3
5-3X11 Solder powder particle size distribution – screen method (6X01)
3
5-3X12 Solder powder particle size distribution – measuring microscope method (6X02)
3
5-3X13 Solder powder particle size distribution – optical image analyzer method (6X03)
3
5-3X14 Solder powder particle size distribution – Measuring laser diffraction method (6X04)
3
5-3X15 Determination of maximum solder powder particle size ( 6X05)
2
5-3X16 Solder paste metal content by weight (6X06)
6 Requirements
6.1 General
Except when otherwise specified in the design or assembly drawings, or instructions by the
user, the soldering pastes covered by this standard shall conform with 6.2 to 6.12.
6.2 Conflict
In the event of conflict between the requirements of this standard and other requirements of
the applicable acquisition documents, the precedence in which documents shall govern in
descending order is as follows:
a) the applicable acquisition document;
b) the applicable specification sheet/drawing;
c) this standard;
d) applicable normative references.
6.3 Alloy composition
The alloy composition of the solder pastes shall be characterized by the supplier in
accordance with the alloy characterization requirements specified in IEC 61190-1-3 and shall
be inspected in accordance with the alloy inspection requirements of IEC 61190-1-3. The
results of these inspections should be recorded on the report form included in IEC 61190-1-3
and the alloy type shall be recorded on the solder paste report form (see Table A.1).
The percentage of each element in an alloy shall be determined by any standard analytical
procedure. Wet chemistry shall be used as the reference procedure.
6.4 Flux characterization and inspection
6.4.1 General
The fluxes in solder pastes shall be characterized by the supplier in accordance with the flux
characterization requirements specified in IEC 61190-1-1 and shall be inspected in
accordance with the flux inspection requirements of IEC 61190-1-1. The results of these
inspections should be recorded on the report form included in IEC 61190-1-1 and the flux type
shall be recorded on the solder paste report form (see Table A.1). If the reflow temperature is
unsuitable for inspection, a different reflow temperature should be agreed upon by user and
supplier.
___________
3
(6X0x ) ; Test number in IEC 61189-6:2006, see Bibliography.

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SIST EN 61190-1-2:2014
– 10 – 61190-1-2  IEC:2014
6.4.2 Shelf life
If the shelf life of the solder paste has expired, but the paste still meets performance testing,
then it may be used. Paste which has been re-qualified can only be used directly after re-
qualification.
6.5 Solder powder particle size
6.5.1 Powder size determination
Powder size determination shall be made using this standard. Alternate test procedures may
be agreed upon by user and supplier.
6.5.2 Powder size
6.5.2.1 General
When tested in accordance with 6.5.2.2, the powder size shall be classified by type as per a
standard sieve size or the nearest sieve size shown which matches the valu
...