Space product assurance - Derating - EEE components

This Standard applies to all parties involved at all levels in the realization of space segment hardware and its interfaces.
The objective of this Standard is to provide customers with a guaranteed performance and reliability up to the equipment end-of-life. To this end, the following are specified:
- Load ratios or limits to reduce stress applied to components;
- Application rules and recommendations.

Raumfahrtproduktsicherung - Herabsetzen/Unterlastung von EEE-Komponenten

Assurance produit des projets spatiaux - Détarage des composants EEE

Zagotavljanje varnih proizvodov v vesoljski tehniki - Zmanjšanje števila komponent EEE

Ta standard se uporablja za vse, ki so na vseh ravneh vključeni v realizacijo vesoljske strojne opreme in njenih vmesnikov.
Cilj tega standarda je strankam zagotoviti zajamčeno zmogljivost in zanesljivost do konca življenjskega cikla opreme. V ta namen so določeni naslednji elementi:
– razmerja ali omejitve obremenitve za zmanjšanje stresa za komponente;
– pravila in priporočila glede uporabe.

General Information

Status
Published
Public Enquiry End Date
28-Apr-2021
Publication Date
23-Jan-2022
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
29-Dec-2021
Due Date
05-Mar-2022
Completion Date
24-Jan-2022

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Standards Content (sample)

SLOVENSKI STANDARD
SIST EN 16602-30-11:2022
01-marec-2022
Nadomešča:
SIST EN 16602-30-11:2015
Zagotavljanje varnih proizvodov v vesoljski tehniki - Zmanjšanje števila
komponent EEE
Space product assurance - Derating - EEE components
Raumfahrtproduktsicherung - Herabsetzen/Unterlastung von EEE-Komponenten
Assurance produit des projets spatiaux - Détarage des composants EEE
Ta slovenski standard je istoveten z: EN 16602-30-11:2021
ICS:
49.140 Vesoljski sistemi in operacije Space systems and
operations
SIST EN 16602-30-11:2022 en,fr,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN 16602-30-11:2022
---------------------- Page: 2 ----------------------
SIST EN 16602-30-11:2022
EUROPEAN STANDARD EN 16602-30-11
NORME EUROPÉENNE
EUROPÄISCHE NORM
December 2021
ICS 49.140
Supersedes EN 16602-30-11:2014
English version
Space product assurance - Derating - EEE components

Assurance produit des projets spatiaux - Détarage des Raumfahrtproduktsicherung -

composants EEE Herabsetzen/Unterlastung von EEE-Komponenten
This European Standard was approved by CEN on 5 December 2021.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for

giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical

references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to

any CEN and CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by

translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC

Management Centre has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,

Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,

Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,

Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2021 CEN/CENELEC All rights of exploitation in any form and by any means
Ref. No. EN 16602-30-11:2021 E
reserved worldwide for CEN national Members and for
CENELEC Members.
---------------------- Page: 3 ----------------------
SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
Table of contents

European Foreword .................................................................................................. 6

Introduction ............................................................................................................... 7

1 Scope....................................................................................................................... 8

2 Normative references ............................................................................................. 9

3 Terms, definitions and abbreviated terms ......................................................... 10

3.1 Terms from other standards ................................................................................... 10

3.2 Terms specific to the present standard ................................................................... 10

3.3 Abbreviated terms .................................................................................................. 11

3.4 Nomenclature ......................................................................................................... 12

4 User responsibility ............................................................................................... 14

5 Derating ................................................................................................................. 15

5.1 Overview ................................................................................................................ 15

5.2 Principles of derating .............................................................................................. 15

5.3 Applicability and component selection .................................................................... 16

5.4 Derating parameters .............................................................................................. 18

5.5 Additional rules and recommendations ................................................................... 19

6 Tables for load ratios or limits ............................................................................ 20

6.1 Overview ................................................................................................................ 20

6.2 Capacitors: ceramic - family-group code: 01-01 and 01-02 .................................... 21

6.3 Capacitors: solid tantalum - family-group code: 01-03 ............................................ 22

6.4 Capacitors: non-solid tantalum - family-group code: 01-04 ..................................... 24

6.5 Capacitors: Plastic metallized - family-group code: 01-05 ...................................... 25

6.6 Capacitors: glass and porcelain - family-group code: 01-06 ................................... 27

6.7 Capacitors: mica and reconstituted mica - family-group code: 01-07 ...................... 28

6.8 Capacitors: feedthrough - family-group code: 01-10 ............................................... 29

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SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
6.9 Capacitors: semiconductor technology (MOS type) - family-group code: 01-

11 ........................................................................................................................... 30

6.10 Capacitors: miscellaneous (variable capacitors) - family-group code: 01-99 ........... 31

6.11 Connectors - family-group code: 02-01, 02-02, 02-03, 02-07 and 02-09 ................. 32

6.12 Connectors RF - family-group code: 02-05 ............................................................. 34

6.13 Piezo-electric devices: crystal resonator - family-group code: 03-01 ...................... 35

6.14 Diodes - family-group code: 04-01, 04-02, 04-03, 04-04, 04-06, 04-08, 04-

10 and 04-14 .......................................................................................................... 36

6.15 Diodes: RF/microwave - family-group code: 04-05, 04-11 to 04-13, 04-15,

04-16 and 04-17 ..................................................................................................... 38

6.16 Feedthrough filters - family-group code: 05-01 ....................................................... 39

6.17 Fuses: Cermet (metal film on ceramic) - family-group code: 06-01 ......................... 40

6.18 Inductors and transformers - family-group code: 07-01 to 07-03 and 14-01 ............ 41

6.19 Integrated circuits: logic - family-group code: 08-10, 08-20, 08-21, 08-29 to

08-42, and 08-80 .................................................................................................... 42

6.20 Integrated circuits: non-volatile memories - family-group code: 08-22, 08-23

and 08-24 ............................................................................................................... 44

6.21 Integrated circuits: linear - family-group code: 08-50 to 08-60 and 08-69 ............... 46

6.22 Integrated circuits: linear converters - family-group code: 08-61 and 08-62 ............ 48

6.23 Integrated circuits: MMICs - family-group code: 08-95 ............................................ 49

6.24 Integrated circuits: miscellaneous - family-group code: 08-99 ................................ 51

6.25 Relays and switches - family-group code: 09-01, 09-02 and 16-01 ........................ 52

6.26 Resistors - family-group code: 10-01 to 10-11 ........................................................ 55

6.27 Thermistors - family-group code: 11-01 to 11-03 .................................................... 59

6.28 Transistors: bipolar - family-group code: 12-01 to 12-04 and 12-09 ........................ 60

6.29 Transistors: FET - family-group code: 12-05 and 12-06 .......................................... 62

6.30 Transistors: RF: bipolar - family-group code: 12-10 and 12-13 ............................... 64

6.31 Transistors: RF: FET - family-group code: 12-12, 12-14, 12-15(FET) and 12-

16(FET) .................................................................................................................. 67

6.32 Wires and cables - family-group code: 13-01 to 13-03 ............................................ 70

6.33 Opto-electronics - family-group code: 18-01 to 18-05 ............................................. 74

6.34 RF passive components: family-group code: 30-01, 30-07, 30-09, 30-10 and

30-99 ...................................................................................................................... 75

6.35 Fibre optic components: fibre and cable: family-group-code: 27-01 ........................ 77

6.36 Hybrids ................................................................................................................... 78

Bibliography ............................................................................................................ 89

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SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
Figures

Figure 5-1: Parameter stress versus strength relationship ................................................... 16

Tables

Table 6-1: Derating of parameters for capacitors family-group code 01-01 and 01-02 ......... 21

Table 6-2: Derating of parameters for capacitors family-group code 01-03 .......................... 22

Table 6-3: Derating of parameters for capacitors family-group code .................................... 24

Table 6-4: Derating of parameters for capacitors family-group code 01-05 .......................... 26

Table 6-5: Derating of parameters for capacitors family-group code 01-06 .......................... 27

Table 6-6: Derating of parameters for capacitors family-group code 01-07 .......................... 28

Table 6-7: Derating of parameters for capacitors family-group code 01-10 .......................... 29

Table 6-8: Derating of parameters for capacitors family-group code 01-11 .......................... 30

Table 6-9: Derating of parameters for capacitors family-group code 01-99 .......................... 31

Table 6-10: Derating of parameters for connectors family-group code 02-01, 02-02,

02-03, 02-07 and 02-09 ..................................................................................... 32

Table 6-11: Derating of parameters for connectors RF family-group code 02-05 ...................... 34

Table 6-12: Derating of parameters for piezo-electric devices family-group code 03-

01 ...................................................................................................................... 35

Table 6-13: Derating of parameters for Diode (signal/switching, rectifier including

Schottky, pin) ..................................................................................................... 36

Table 6-14: Derating of parameters for Diode (Zener, reference, transient

suppression) ...................................................................................................... 37

Table 6-15: Derating of parameters for Diodes family-group code 04-05, 04-11 to 04-

13, 04-15, 04-16 and 04-17 ............................................................................... 38

Table 6-16: Derating of parameters for Feedthrough filters family-group code 05-01 ........... 39

Table 6-17: Derating of parameters for Fuses family-group code 06-01 ............................... 40

Table 6-18: Derating of parameters for Inductors and transformers family-group code

07-01 to 07-03 and 14-01 .................................................................................. 41

Table 6-19: Derating of parameters for Integrated circuits family-group code: 08-10,

08-20, 08-21, 08-29 to 08-42, and 08-80 ........................................................... 42

Table 6-20: Derating of parameters for Integrated circuits family-group code: 08-22,

08-23 and 08-24 ................................................................................................ 44

Table 6-21: Derating of parameters for Integrated circuits family-group code 08-50 to

08-60 and 08-69 ................................................................................................ 47

Table 6-22: Derating of parameters for Integrated circuits family-group code 08-61

and 08-62 .......................................................................................................... 48

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SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)

Table 6-23:Derating of parameters for non-custom MMICs .................................................. 50

Table 6-24: Derating of parameters for Relays and switches family-group code 09-

01, 09-02 and 16-01 .......................................................................................... 53

Table 6-25: Derating of parameters for Metal film precision resistor (type RNC,

except RNC 90) ................................................................................................. 55

Table 6-26: Derating of parameters for Metal film semi-precision resistor (type RLR) .......... 55

Table 6-27: Derating of parameters for Foil resistor (type RNC 90) ...................................... 56

Table 6-28: Derating of parameters Wire-wound high precision resistor (type RBR

56) ..................................................................................................................... 56

Table 6-29: Derating of parameters for Wire-wound power resistor (type RWR, RER) ......... 57

Table 6-30: Derating of parameters for Chip resistor (RM), network resistor ........................ 57

Table 6-31: Derating of parameters for Carbon composition resistor ................................... 57

Table 6-32: Derating of parameters for Heaters ................................................................... 58

Table 6-33: Derating of parameters for Thick Film Power .................................................... 58

Table 6-34: Derating of parameters for Thermistors family-group code 11-01 to 11-03 ........ 59

Table 6-35: Derating of parameters for Transistors family-group code 12-01 to 12-04

and 12-09 .......................................................................................................... 60

Table 6-36: Derating of parameters for Transistors family-group code 12-05 and 12-

06 ...................................................................................................................... 62

Table 6-37: Derating of parameters for Transistors family-group code 12-10 and 12-

13 ...................................................................................................................... 65

Table 6-38: Derating of parameters for Transistors family-group code 12-12, 12-14,

12-15(FET) and 12-16(FET) .............................................................................. 68

Table 6-39: <> ...................................................................................................... 70

Table 6-40: <> ...................................................................................................... 70

Table 6-41: Derating factor for bundles (fully loaded) ........................................................... 72

Table 6-42: Additional factor for partially loaded bundles ..................................................... 72

Table 6-43: Derating of parameters for Opto-electronics family-group code 18-01 to

18-05 ................................................................................................................. 74

Table 6-44: Derating of parameters for RF passive components from family-group

code 30-01, 30-07, 30-09, 30-10 and 30-99 - Low power < 5 W ........................ 75

Table 6-45: Derating of parameters for RF passive components from family-group

code 30-01, 30-07, 30-09, 30-10 and 30-99 - Low power ≥ 5 W ........................ 75

Table 6-46: Derating of parameters for Fibre optic components ........................................... 77

---------------------- Page: 7 ----------------------
SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
European Foreword
This document (EN 16602-30-11:2021) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN
(Germany).
This document (EN 16602-30-11:2021) originates from ECSS-Q-ST-30-11C
Rev.2.
This European Standard shall be given the status of a national standard,
either by publication of an identical text or by endorsement, at the latest by
June 2022, and conflicting national standards shall be withdrawn at the latest
by June 2022.
Attention is drawn to the possibility that some of the elements of this
document may be the subject of patent rights. CEN [and/or CENELEC] shall
not be held responsible for identifying any or all such patent rights.
This document supersedes EN 16602-30-11:2014.
The main changes with respect to EN 16602-30-11:2014 are listed below:
- Implementation of Change Requests,
- Addition of clause 6.26.2.9 “Thick Film Power”
- Informative Annex B “ESCC Exceptions” deleted
- Informative Annex C “Example of single wires rating currents
calculation for the wires most commonly used for space applications”
added
This document has been prepared under a standardization request given to
CEN by the European Commission and the European Free Trade
Association.
This document has been developed to cover specifically space systems and
has therefore precedence over any EN covering the same scope but with a
wider domain of applicability (e.g. : aerospace).
According to the CEN-CENELEC Internal Regulations, the national
standards organizations of the following countries are bound to implement
this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech
Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of
Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland,
Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
---------------------- Page: 8 ----------------------
SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
Introduction
This Standard specifies derating requirements applicable to electronic,
electrical and electromechanical components.
Derating is a long standing practice applied to components used on
spacecraft. Benefits of this practice are now proven, but for competitiveness
reasons, it becomes necessary to find an optimized reliability. Too high a
derating can lead to over-design, over-cost and over-sizing of components,
the direct consequence being excess volume and weight. The aim is to obtain
reliable and high performance equipment without over-sizing of the
components. For this reason and if possible, this Standard provides derating
requirements depending on mission duration and mean temperature, taking
into account demonstrated limits of component capabilities.
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SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
Scope

This Standard applies to all parties involved at all levels in the realization of

space segment hardware and its interfaces.
The objective of this Standard is to provide customers with a guaranteed
performance and reliability up to the equipment end-of-life. To this end, the
following are specified:
• Load ratios or limits to reduce stress applied to components;
• Application rules and recommendations.
This standard may be tailored for the specific characteristics and constraints
of a space project, in accordance with ECSS-S-ST-00.
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SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references, subsequent amendments to, or revisions of any of these
publications do not apply. However, parties to agreements based on this
ECSS Standard are encouraged to investigate the possibility of applying the
most recent editions of the normative documents indicated below. For
undated references the latest edition of the publication referred to applies.
EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS system - Glossary of terms
EN 16602-60 ECSS-Q-ST-60 Space product assurance - Electrical, electronic and
electromechanical (EEE) components
EN 16602-60-13 ECSS-Q-ST-60-13 Commercial electrical, electronic and
electromechanical (EEE) components
EN 16602-60-15 ECSS-Q-ST-60-15 Radiation hardness assurance - EEE components
ESCC 2269010 Evaluation test programme for monolithic
microwave integrated circuits (MMICS)
ESCC 2265010 Evaluation Test Programme for Discrete
Microwave Semiconductors
ESCC Derating Component Derating - Deviations to ECSS-Q-ST-
deviations 30-11:
https://escies.org/webdocument/showArticle?id=82
5&groupid=6
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SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
Terms, definitions and abbreviated terms
3.1 Terms from other standards
a. For the purpose of this Standard, the terms and definitions from
ECSS-ST-00-01 apply.
1. component
2. derating
3. performance
3.2 Terms specific to the present standard
ambient temperature
temperature surrounding a component
bundle
set of two or more wires arranged in parallel ,tied or laced together.
case temperature
temperature on the component package surface
hot spot temperature
highest measured or predicted temperature within any component
junction temperature
highest measured or predicted temperature at the junction within a
semiconductor or micro-electronic device
NOTE Predicted temperature can be taken as Tcase +
thermal resistance between junction and case
times actual power (Watt) of the device.
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SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
load ratio
permissible operating level after derating has been applied; given as a
percentage of a parameter rating
operating conditions
parameter stress and environment (temperature, vibration, shock and
radiation) in which components are expected to operate
rating
maximum parameter value specified and guaranteed by the component
manufacturer and component procurement specification
NOTE Rating is considered as a limit not to be
exceeded during operation and constitutes in
most cases the reference for derating.
surge
strong rush or sweep
transient
brief change in the state of a system
3.3 Abbreviated terms
For the purpose of this Standard, the abbreviated terms from
ECSS-S-ST-00-01 and the following apply:
Abbreviation Meaning
analog to digital
A/D
application specific integrated circuit
ASIC
capacitance
dynamic random access memory
DRAM
electrical erasable programmable read only
EEPROM
memory
erasable programmable read only memory
EPROM
European Space Component Coordination
ESCC
equivalent series resistance
ESR
frequency
field effect transistor
FET
gallium arsenide
GaAs
International Organization for Standardization
ISO
---------------------- Page: 13 ----------------------
SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
Abbreviation Meaning
indium phosphide
InP
light emitting diode
LED
metal on silicon
MOS
specification of the US Department of Defense
MIL (spec)
monolithic microwave integrated circuit
MMIC
National Aeronautics and Space Administration
NASA
power
programmable read only memory
PROM
radiation hardened
RadHard
insulation resistance
radio-frequency
single event burn-out
SEBO
single event gate rupture
SEGR
silicon, silicon germanium
Si, SiGe
safe operating area
SOA
static random access memory
SRAM
junction temperature
absolute maximum rated junction temperature
Tjmax
operating temperature
Top
collector-emitter voltage
VCE
3.4 Nomenclature
The following nomenclature applies throughout this document:
a. The word “shall” is used in this Standard to express requirements. All
the requirements are expressed with the word “shall”.
b. The word “should” is used in this Standard to express
recommendations. All the recommendations are expressed with the
word “should”.
NOTE It is expected that, during tailoring,
recommendations in this document are
either converted into requirements or
tailored out.
c. The words “may” and “need not” are used in this Standard to express
positive and negative permissions, respectively. All the positive
---------------------- Page: 14 ----------------------
SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
permissions are expressed with the word “may”. All the negative
permissions are expressed with the words “need not”.
d. The word “can” is used in this Standard to express capabilities or
possibilities, and therefore, if not accompanied by one of the previous
words, it implies descriptive text.
NOTE In ECSS “may” and “can” have completely
different meanings: “may” is normative
(permission), and “can” is descriptive.
e. The present and past tenses are used in this Standard to express
statements of fact, and therefore they imply descriptive text.
---------------------- Page: 15 ----------------------
SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
User responsibility
a. The user of this Standard shall verify that the ordered assurance level
of procured components is compatible with the intended application.
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SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
Derating
5.1 Overview
The term derating refers to the intentional reduction of electrical, thermal
and mechanical stresses on components to levels below their specified rating.
Derating is a means of extending component life, increasing reliability and
enhancing the end-of-life performance of equipment.
Derating participates in the protection of components from unexpected
application anomalies and board design variations.
The load ratios or limits given in clause 6 were derived from information
available at the time of writing this Standard and do not preclude further
derating for specific applications.
This Standard also defines how to handle transients.
5.2 Principles of derating
The component parameter strength defines the limits and the performance
component technology in the particular application and varies from
manufacturer to manufacturer, from type to type, and from lot to lot and can
be represented by a statistical distribution. Likewise, component stress can be

represented by a statistical distribution. Figure 5-1 illustrates the strength of a

component and the stress applied at a given time, where each characteristic is
represented by a probability density function.
A component operates in a reliable way if its parameter strength exceeds the
parameter stress. The designer should ensure that the stress applied does not
exceed the component parameter strength. This is represented by the
intersection (shaded area) in Figure 5-1. The larger the shaded area, the
higher the possibility of failure becomes.
There are two ways, which may be used simultaneously, in which the shaded
area can be decreased:
• Decrease the stress applied (which moves the stress distribution to the
left).
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SIST EN 16602-30-11:2022
EN 16602-30-11:2021 (E)
• Increase the component parameter strength (by selecting over-sized
components) thereby moving the strength distribution to the right.
The goal is to minimize the stress-to-strength ratio of the component.
Derating moves the parameter stress distribution to the left while the
selection processes applied to the components for space applications
contribute to moving the parameter strength distribution to the right. The
selection processes also reduce the uncertainty associated with the
component parameter strength.
Derating reduces the probability of failure, improves the end-of-life
performance of components and provides additional design margins.
Another effect of derating is to provide a safety margin for design. It allows
integrating parameter distribution from one component to another, and from
one procurement to another.
probability
strength
density
stress distribution
distribution
region of stress and strength
interference where failures
can occur
parameter
Figure 5-1: Parameter stress versus strength relationship
5.3 Applicability and component selection
5.3.1 Overview
This Standard applies to all components, selected for space applications, that
are used for a significant duration. The meaning of “significant duration” is a
period that contributes to the component life, for instance, one month is
considered to be a significant duration. These requirements apply to
screened components procured in accordance with approved space
specifications.
This Standard only applies to approved components for which quality was
proven after rigorous testi
...

SLOVENSKI STANDARD
oSIST prEN 16602-30-11:2021
01-april-2021
Zagotavljanje varnih proizvodov v vesoljski tehniki - Zmanjšanje števila
komponent EEE
Space product assurance - Derating - EEE components
Raumfahrtproduktsicherung - Herabsetzen/Unterlastung von EEE-Komponenten
Assurance produit des projets spatiaux - Détarage des composants EEE
Ta slovenski standard je istoveten z: prEN 16602-30-11
ICS:
49.140 Vesoljski sistemi in operacije Space systems and
operations
oSIST prEN 16602-30-11:2021 en,fr,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
oSIST prEN 16602-30-11:2021
---------------------- Page: 2 ----------------------
oSIST prEN 16602-30-11:2021
EUROPEAN STANDARD
DRAFT
prEN 16602-30-11
NORME EUROPÉENNE
EUROPÄISCHE NORM
February 2021
ICS 49.140
Will supersede EN 16602-30-11:2014
English version
Space product assurance - Derating - EEE components

Assurance produit des projets spatiaux - Détarage des Raumfahrtproduktsicherung -

composants EEE Herabsetzen/Unterlastung von EEE-Komponenten

This draft European Standard is submitted to CEN members for enquiry. It has been drawn up by the Technical Committee

CEN/CLC/JTC 5.

If this draft becomes a European Standard, CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal

Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any

alteration.

This draft European Standard was established by CEN and CENELEC in three official versions (English, French, German). A

version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own

language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,

Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,

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Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are

aware and to provide supporting documentation.Recipients of this draft are invited to submit, with their comments, notification

of any relevant patent rights of which they are aware and to provide supporting documentation.

Warning : This document is not a European Standard. It is distributed for review and comments. It is subject to change without

notice and shall not be referred to as a European Standard.
CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels

© 2021 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. prEN 16602-30-11:2021 E

reserved worldwide for CEN national Members and for
CENELEC Members.
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Table of contents

European Foreword ...................................................................................... 7

Introduction ................................................................................................... 8

1 Scope........................................................................................................... 9

2 Normative references ............................................................................... 10

3 Terms, definitions and abbreviated terms ............................................. 11

3.1 Terms from other standards ...................................................................... 11

3.2 Terms specific to the present standard ...................................................... 11

3.3 Abbreviated terms ..................................................................................... 12

4 User responsibility ................................................................................... 14

5 Derating ..................................................................................................... 15

5.1 Overview ................................................................................................... 15

5.2 Principles of derating ................................................................................. 15

5.3 Applicability and component selection ....................................................... 16

5.4 Derating parameters ................................................................................. 18

5.5 Additional rules and recommendations ...................................................... 19

6 Tables for load ratios or limits ................................................................ 20

6.1 Overview ................................................................................................... 20

6.2 Capacitors: ceramic - family-group code: 01-01 and 01-02 ....................... 20

6.3 Capacitors: solid tantalum - family-group code: 01-03 ............................... 21

6.4 Capacitors: non-solid tantalum - family-group code: 01-04 ........................ 23

6.5 Capacitors: Plastic metallized - family-group code: 01-05 ......................... 24

6.6 Capacitors: glass and porcelain - family-group code: 01-06 ...................... 25

6.7 Capacitors: mica and reconstituted mica - family-group code: 01-07 ......... 26

6.8 Capacitors: feedthrough - family-group code: 01-10 .................................. 27

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6.9 Capacitors: semiconductor technology (MOS type) - family-group code: 01-

11 .............................................................................................................. 28

6.10 Capacitors: miscellaneous (variable capacitors) - family-group code: 01-

99 .............................................................................................................. 29

6.11 Connectors - family-group code: 02-01, 02-02, 02-03, 02-07 and 02-09 .... 30

6.12 Connectors RF - family-group code: 02-05 ................................................ 32

6.13 Piezo-electric devices: crystal resonator - family-group code: 03-01 ......... 33

6.14 Diodes - family-group code: 04-01, 04-02, 04-03, 04-04, 04-06, 04-08, 04-

10 and 04-14 ............................................................................................. 34

6.15 Diodes: RF/microwave - family-group code: 04-05, 04-11 to 04-13, 04-15,

04-16 and 04-17 ........................................................................................ 36

6.16 Feedthrough filters - family-group code: 05-01 .......................................... 37

6.17 Fuses: Cermet (metal film on ceramic) - family-group code: 06-01 ............ 38

6.18 Inductors and transformers - family-group code: 07-01 to 07-03 and 14-

01 .............................................................................................................. 39

6.19 Integrated circuits: logic - family-group code: 08-10, 08-20, 08-21, 08-29 to

08-42, and 08-80 ....................................................................................... 40

6.20 Integrated circuits: non-volatile memories - family-group code: 08-22, 08-23

and 08-24 .................................................................................................. 41

6.21 Integrated circuits: linear - family-group code: 08-50 to 08-60 and 08-69 .. 43

6.22 Integrated circuits: linear converters - family-group code: 08-61 and 08-62 45

6.23 Integrated circuits: MMICs - family-group code: 08-95 ............................... 46

6.24 Integrated circuits: miscellaneous - family-group code: 08-99 ................... 47

6.25 Relays and switches - family-group code: 09-01, 09-02 and 16-01 ........... 48

6.26 Resistors - family-group code: 10-01 to 10-11 ........................................... 51

6.27 Thermistors - family-group code: 11-01 to 11-03 ....................................... 55

6.28 Transistors: bipolar - family-group code: 12-01 to 12-04 and 12-09 ........... 56

6.29 Transistors: FET - family-group code: 12-05 and 12-06 ............................. 57

6.30 Transistors: RF: bipolar - family-group code: 12-10 and 12-13 .................. 59

6.31 Transistors: RF: FET - family-group code: 12-12, 12-14, 12-15(FET) and 12-

16(FET) ..................................................................................................... 62

6.32 Wires and cables - family-group code: 13-01 to 13-03 ............................... 64

6.33 Opto-electronics - family-group code: 18-01 to 18-05 ................................ 68

6.34 RF passive components: family-group code: 30-01, 30-07, 30-09, 30-10 and

30-99 ......................................................................................................... 69

6.35 Fibre optic components: fibre and cable: family-group-code: 27-01 ........... 71

6.36 Hybrids ...................................................................................................... 72

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Bibliography ................................................................................................ 83

Figures

Figure 5-1: Parameter stress versus strength relationship ...................................... 16

Tables
Table 6-1: Derating of parameters for capacitors family-group code 01-01 and 01-

02 ......................................................................................................... 21

Table 6-2: Derating of parameters for capacitors family-group code 01-03 ............. 22

Table 6-3: Derating of parameters for capacitors family-group code ....................... 23

Table 6-4: Derating of parameters for capacitors family-group code 01-05 ............. 24

Table 6-5: Derating of parameters for capacitors family-group code 01-06 ............. 25

Table 6-6: Derating of parameters for capacitors family-group code 01-07 ............. 26

Table 6-7: Derating of parameters for capacitors family-group code 01-10 ............. 27

Table 6-8: Derating of parameters for capacitors family-group code 01-11 ............. 28

Table 6-9: Derating of parameters for capacitors family-group code 01-99 ............. 29

Table 6-10: Derating of parameters for connectors family-group code 02-01, 02-02,

02-03, 02-07 and 02-09 ........................................................................ 30

Table 6-11: Derating of parameters for connectors RF family-group code 02-05 .... 32

Table 6-12: Derating of parameters for piezo-electric devices family-group code 03-

01 ......................................................................................................... 33

Table 6-13: Derating of parameters for Diode (signal/switching, rectifier including

Schottky, pin) ........................................................................................ 34

Table 6-14: Derating of parameters for Diode (Zener, reference, transient

suppression) ......................................................................................... 35

Table 6-15: Derating of parameters for Diodes family-group code 04-05, 04-11 to 04-

13, 04-15, 04-16 and 04-17 .................................................................. 36

Table 6-16: Derating of parameters for Feedthrough filters family-group code 05-

01 ......................................................................................................... 37

Table 6-17: Derating of parameters for Fuses family-group code 06-01 .................. 38

Table 6-18: Derating of parameters for Inductors and transformers family-group code

07-01 to 07-03 and 14-01 ..................................................................... 39

Table 6-19: Derating of parameters for Integrated circuits family-group code: 08-10,

08-20, 08-21, 08-29 to 08-42, and 08-80 .............................................. 40

Table 6-20: Derating of parameters for Integrated circuits family-group code: 08-22,

08-23 and 08-24 ................................................................................... 42

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Table 6-21: Derating of parameters for Integrated circuits family-group code 08-50 to

08-60 and 08-69 ................................................................................... 44

Table 6-22: Derating of parameters for Integrated circuits family-group code 08-61

and 08-62 ............................................................................................. 45

Table 6-23:Derating of parameters for non-custom MMICs ..................................... 46

Table 6-24: Derating of parameters for Relays and switches family-group code 09-

01, 09-02 and 16-01 ............................................................................. 49

Table 6-25: Derating of parameters for Metal film precision resistor (type RNC,

except RNC 90) .................................................................................... 51

Table 6-26: Derating of parameters for Metal film semi-precision resistor (type

RLR) ..................................................................................................... 52

Table 6-27: Derating of parameters for Foil resistor (type RNC 90) ......................... 52

Table 6-28: Derating of parameters Wire-wound high precision resistor (type RBR

56) ........................................................................................................ 52

Table 6-29: Derating of parameters for Wire-wound power resistor (type RWR,

RER)..................................................................................................... 53

Table 6-30: Derating of parameters for Chip resistor (RM), network resistor ........... 53

Table 6-31: Derating of parameters for Carbon composition resistor ...................... 53

Table 6-32: Derating of parameters for Heaters ...................................................... 54

Table 6-33: Derating of parameters for Thick Film Power ....................................... 54

Table 6-34: Derating of parameters for Thermistors family-group code 11-01 to 11-

03 ......................................................................................................... 55

Table 6-35: Derating of parameters for Transistors family-group code 12-01 to 12-04

and 12-09 ............................................................................................. 56

Table 6-36: Derating of parameters for Transistors family-group code 12-05 and 12-

06 ......................................................................................................... 58

Table 6-37: Derating of parameters for Transistors family-group code 12-10 and 12-

13 ......................................................................................................... 60

Table 6-38: Derating of parameters for Transistors family-group code 12-12, 12-14,

12-15(FET) and 12-16(FET) ................................................................. 62

Table 6-39: <> ......................................................................................... 64

Table 6-40: <> ......................................................................................... 64

Table 6-41: Derating factor for bundles (fully loaded) .............................................. 66

Table 6-42: Additional factor for partially loaded bundles ........................................ 67

Table 6-43: Derating of parameters for Opto-electronics family-group code 18-01 to

18-05 .................................................................................................... 68

Table 6-44: Derating of parameters for RF passive components from family-group
code 30-01, 30-07, 30-09, 30-10 and 30-99 - Low power < 5 W ........... 69
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Table 6-45: Derating of parameters for RF passive components from family-group
code 30-01, 30-07, 30-09, 30-10 and 30-99 - Low power  5 W ........... 70

Table 6-46: Derating of parameters for Fibre optic components .............................. 71

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European Foreword
This document (prEN 16602-30-11:2021) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN
(Germany).
This document (prEN16602-30-11:2021) originates from ECSS-Q-ST-30-11C
Rev.2 DIR1.
This document is currently submitted to the Enquiry.
This document will supersede EN 16602-30-11:2014. [if applicable].
The main changes with respect to EN 16602-30-11:2014 are listed below:
- Implementation of Change Requests,
- …
NOTE: CHANGE LOG WILL BE COMPLETED BEFORE PUBLICATION
This document has been developed to cover specifically space systems and
will therefore have precedence over any EN covering the same scope but with
a wider do-main of applicability (e.g. : aerospace).
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Introduction
This Standard specifies derating requirements applicable to electronic,
electrical and electromechanical components.
Derating is a long standing practice applied to components used on
spacecrafts. Benefits of this practice are now proven, but for competitiveness
reasons, it becomes necessary to find an optimized reliability. Too high a
derating can lead to over-design, over-cost and over-sizing of components, the
direct consequence being excess volume and weight. The aim is to obtain
reliable and high performance equipment without over-sizing of the
components. For this reason and if possible, this Standard provides derating
requirements depending on mission duration and mean temperature, taking
into account demonstrated limits of component capabilities.
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Scope

This Standard applies to all parties involved at all levels in the realization of

space segment hardware and its interfaces.
The objective of this Standard is to provide customers with a guaranteed
performance and reliability up to the equipment end-of-life. To this end, the
following are specified:
 Load ratios or limits to reduce stress applied to components;
 Application rules and recommendations.

This standard may be tailored for the specific characteristics and constraints of

a space project, in accordance with ECSS-S-ST-00.
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Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references, subsequent amendments to, or revisions of any of these
publications do not apply. However, parties to agreements based on this ECSS
Standard are encouraged to investigate the possibility of applying the most
recent editions of the normative documents indicated below. For undated
references the latest edition of the publication referred to applies.
EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS system - Glossary of terms
EN 16602-60 ECSS-Q-ST-60 Space product assurance - Electrical, electronic
and electromechanical (EEE) components
ESCC 2269010 Evaluation test programme for monolithic
microwave integrated circuits (MMICS)
ESCC 2265010 Evaluation Test Programme for Discrete
Microwave Semiconductors
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Terms, definitions and abbreviated terms
3.1 Terms from other standards
a. For the purpose of this Standard, the terms and definitions from
ECSS-ST-00-01 apply.
1. component
2. derating
3. performance
3.2 Terms specific to the present standard
3.2.1 ambient temperature
temperature surrounding a component
3.2.2 bundle
set of two or more wires arranged in parallel ,tied or laced together.
3.2.3 case temperature
temperature on the component package surface
3.2.4 hot spot temperature
highest measured or predicted temperature within any component
3.2.5 junction temperature
highest measured or predicted temperature at the junction within a
semiconductor or micro-electronic device
NOTE Predicted temperature can be taken as Tcase +
thermal resistance between junction and case
times actual power (Watt) of the device.
3.2.6 load ratio
permissible operating level after derating has been applied; given as a
percentage of a parameter rating
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3.2.7 operating conditions
parameter stress and environment (temperature, vibration, shock and
radiation) in which components are expected to operate
3.2.8 RadPack
package designed to provide some form of radiation protection
3.2.9 rating
maximum parameter value specified and guaranteed by the component
manufacturer and component procurement specification
NOTE Rating is considered as a limit not to be exceeded
during operation and constitutes in most cases
the reference for derating.
3.2.10 surge
strong rush or sweep
[Collins dictionary and thesaurus]
3.2.11 transient
brief change in the state of a system
[Collins dictionary and thesaurus]
3.3 Abbreviated terms
For the purpose of this Standard, the abbreviated terms from ECSS-S-ST-00-01
and the following apply:
Abbreviation Meaning
analog to digital
A/D
application specific integrated circuit
ASIC
capacitance
dynamic random access memory
DRAM
electrical erasable programmable read only
EEPROM
memory
erasable programmable read only memory
EPROM
European Space Component Coordination
ESCC
equivalent series resistance
ESR
frequency
field effect transistor
FET
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Abbreviation Meaning
gallium arsenide
GaAs
International Organization for Standardization
ISO
indium posphide
InP
light emitting diode
LED
metal on silicon
MOS
specification of the US Department of Defense
MIL (spec)
monolithic microwave integrated circuit
MMIC
National Aeronautics and Space
NASA
Administration
power
programmable read only memory
PROM
radiation hardened
RadHard
insulation resistance
radio-frequency
single event burn-out
SEBO
single event gate rupture
SEGR
silicon, silicon germanium
Si, SiGe
safe operating area
SOA
static random access memory
SRAM
junction temperature
absolute maximum rated junction temperature
Tjmax
operating temperature
Top
collector-emitter voltage
VCE
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User responsibility
a. The user of this Standard shall verify that the ordered assurance level of
procured components is compatible with the intended application.
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Derating
5.1 Overview
The term derating refers to the intentional reduction of electrical, thermal and
mechanical stresses on components to levels below their specified rating.
Derating is a means of extending component life, increasing reliability and
enhancing the end-of-life performance of equipment.
Derating participates in the protection of components from unexpected
application anomalies and board design variations.
The load ratios or limits given in clause 6 were derived from information
available at the time of writing this Standard and do not preclude further
derating for specific applications.
This Standard also defines how to handle transients.
5.2 Principles of derating
The component parameter strength defines the limits and the performance
component technology in the particular application and varies from
manufacturer to manufacturer, from type to type, and from lot to lot and can
be represented by a statistical distribution. Likewise, component stress can be

represented by a statistical distribution. Figure 5-1 illustrates the strength of a

component and the stress applied at a given time, where each characteristic is
represented by a probability density function.
A component operates in a reliable way if its parameter strength exceeds the
parameter stress. The designer should ensure that the stress applied does not
exceed the component parameter strength. This is represented by the
intersection (shaded area) in Figure 5-1. The larger the shaded area, the higher
the possibility of failure becomes.
There are two ways, which may be used simultaneously, in which the shaded
area can be decreased:
 Decrease the stress applied (which moves the stress distribution to the
left).
 Increase the component parameter strength (by selecting over-sized
components) thereby moving the strength distribution to the right.
The goal is to minimize the stress-to-strength ratio of the component. Derating

moves the parameter stress distribution to the left while the selection processes

applied to the components for space applications contribute to moving the
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parameter strength distribution to the right. The selection processes also
reduce the uncertainty associated with the component parameter strength.
Derating reduces the probability of failure, improves the end-of-life
performance of components and provides additional design margins.
Another effect of derating is to provide a safety margin for design. It allows
integrating parameter distribution from one component to another, and from
one procurement to another.
Figure 5-1: Parameter stress versus strength relationship
5.3 Applicability and component selection
5.3.1 Overview
This Standard applies to all components, selected for space applications, that
are used for a significant duration. The meaning of “significant duration” is a
period that contributes to the component life, for instance, one month is
considered to be a significant duration. These requirements apply to screened
components procured in accordance with approved space specifications.
This Standard only applies to approved components for which quality was
proven after rigorous testing in accordance with ECSS-Q-ST-60.
Derating applies on normal operational conditions, where “normal” is
opposed to “fault” and “Operational” indicates all functional modes of the
unit.
Derating analysis is performed at the equipment maximum hot acceptance
temperature, unless otherwise specified.
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5.3.2 Requirements
a. Derating shall be applied in consideration of temperature limits
recommended by the manufacturer.
b. The derating requirements of this Standard shall not be used as a
justification to upgrade the quality level of components.
c. The derating requirements shall be taken into account at the beginning
of the design cycle of an equipment for any consequential design trade-
off to be made..
NOTE It is important to pay specific attention to
breadboards and engineering models where
parameter derating was not considered.
d. For families and groups of components excluded from this Standard
due to the lack of experimental data and failure history, the user shall
consult a component design and reliability specialist to apply the
requirements of this Standard.
e. Components may be excluded from this Standard if they are used for
short durations of less than one month provided the device ratings are
not exceeded, and it is ensured that the applied stress level does not
exceed the component maximum rating.
NOTE For example, components used in solar generator
deployment systems, redundancy commutation
and launchers (except in some specific cases,
noted family by family).
f. The derating requirements are not applicable to test conditions for
which the maximum ratings shall not be exceeded.
NOTE For example, circuit or equipment level
qualification and EMC.
g. Derating requirements are not applicable to fault conditions, for which
the maximum rating shall not be exceeded, with the exception defined
in 5.3.2h.
h. Where components are required to operate in protection mode or in fail-
safe mode in order to prevent failure propagation, the components
concerned shall meet the derating requirements and application rules
when performing the protection or fail-safe function under the worst
failure case.
NOTE 1 Short circuit is an example of failure propagation.
NOTE 2 Example of protection or fail-safe function under
the worst failure case: highest stress applied to
the components that can last throughout the
mission.
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5.3.3 Requirements ESCC exceptions
a. For a particular type or manufacturer, when a specific derating rule is
defined in the appendix of the approved
...

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