SIST EN 61837-3:2016

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosure

This part of IEC 61837 deals with standard outlines and terminal lead connections as they
apply to SMDs for frequency control and selection in metal enclosures and is based on
IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices.

Oberflächenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und -selektion - Norm-Gehäusemaße und Anschlüsse - Teil 3: Metallgehäuse

Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence - Encombrements normalisés et connexions des sorties - Partie 3: Enveloppes métalliques

L'IEC 61837-3:2015 est applicable aux enveloppes métalliques normalisées et connexions des sorties des dispositifs à montage en surface pour la commande et le choix de la fréquence; elle est fondée sur l'IEC 61240, qui a normalisé les règles de tracé des dessins d'encombrement des dispositifs à montage en surface. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- Le dessin d'encombrement est défini comme un ensemble de dessins composé de quatre vues, à savoir la vue de dessus, la vue de face, la vue de droite et la vue de dessous, la vue de droite ayant été dessinée en option dans l'édition précédente.
- La hauteur du boîtier (G1) a été supprimée, la hauteur totale étant exprimée par la lettre-symbole G ou par un numéro en indice.
- Les dimensions de l'espacement entre les sorties sont présentées par la position centrale des sorties et sa valeur de base e est de 2,54 x n mm (n étant un entier) et 1,27 x n mm pour des dimensions de boîtier inférieures à 6 mm (voir l'IEC 61240:2012, 5.5). Si l'espacement entre les sorties n'est pas un multiple de la valeur de base, un numéro d'indice tel que e1, e2 est associé, par exemple e1, e2, etc. En présence de plusieurs valeurs d'espacement, le numéro en indice est suivi d'un trait d'union et de numéros tels que e1-1, e1-2 , etc.
- Dans les surfaces de contact des sorties, les longueurs de chaque plaquette de sortie sont désormais exprimées avec des valeurs maximales pour les besoins du client. Elles étaient exprimées en valeurs minimales dans l'édition précédente de l'IEC 61837-3.
- En présence de plusieurs enveloppes identiques de hauteur différente, chacune d'elles était exprimée par une barre oblique (/) et un numéro à deux chiffres placé après le nom de type de base. Les références d'identité sont données dans le tableau de la feuille.
- Les configurations des enveloppes ont été révisées comme indiqué au Tableau 1.

Površinsko nameščeni piezoelektrični elementi za regulacijo frekvence in filtriranje - Standardni okrovi in žični priključki - 3. del: Kovinski okrov

Ta del standarda IEC 61837 obravnava standardne mere in priključne izvode, ki se uporabljajo pri površinsko nameščenih piezoelektričnih elementih (SMD) za regulacijo in izbiranje frekvence na kovinskih okrovih, in temelji na standardu IEC 61240, ki je standardiziral pravila za prikaz tehničnih risb površinsko montiranih naprav.

General Information

• Status: Published
• Publication Date: 16-Feb-2016
• ICS: 31.140 - Piezoelectric devices
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 18-Jan-2016
• Due Date: 24-Mar-2016
• Completion Date: 17-Feb-2016
• Ref Project: EN 61837-3:2015 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures

Relations

• Replaces: SIST EN 61837-3:2001 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections -- Part 3: Metal enclosures
• Effective Date: 30-Jul-2013
• Replaces: SIST EN 61837-3:2001 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections -- Part 3: Metal enclosures
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61837-3:2016
01-marec-2016
1DGRPHãþD
SIST EN 61837-3:2001
3RYUãLQVNRQDPHãþHQLSLH]RHOHNWULþQLHOHPHQWL]DUHJXODFLMRIUHNYHQFHLQILOWULUDQMH
6WDQGDUGQLRNURYLLQåLþQLSULNOMXþNLGHO.RYLQVNLRNURY
Surface mounted piezoelectric devices for frequency control and selection - Standard
outlines and terminal lead connections - Part 3: Metal enclosure
Ta slovenski standard je istoveten z: EN 61837-3:2015
ICS:
31.140 3LH]RHOHNWULþQHLQ Piezoelectric and dielectric
GLHOHNWULþQHQDSUDYH devices
SIST EN 61837-3:2016 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61837-3:2016

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SIST EN 61837-3:2016


EUROPEAN STANDARD EN 61837-3

NORME EUROPÉENNE

EUROPÄISCHE NORM
December 2015
ICS 31.140 Supersedes EN 61837-3:2000
English Version
Surface mounted piezoelectric devices for frequency control and
selection - Standard outlines and terminal lead connections -
Part 3: Metal enclosures
(IEC 61837-3:2015)
Dispositifs piézoélectriques à montage en surface pour la Oberflächenmontierbare piezoelektrische Bauteile zur
commande et le choix de la fréquence - Encombrements Frequenzstabilisierung und -selektion - Norm-
normalisés et connexions des sorties - Partie 3: Enveloppes Gehäusemaße und Anschlüsse - Teil 3: Metallgehäuse
métalliques (IEC 61837-3:2015)
(IEC 61837-3:2015)
This European Standard was approved by CENELEC on 2015-05-20. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.



European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61837-3:2015 E

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SIST EN 61837-3:2016
EN 61837-3:2015 (E)
European foreword
The text of document 49/1118/FDIS, future edition 2 of IEC 61837-3, prepared by IEC/TC 49
"Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61837-3:2015.

The following dates are fixed:
• latest date by which the document has (dop) 2016-06-04
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2018-05-20
• latest date by which the national
standards conflicting with the
document have to be withdrawn

This document supersedes EN 61837-3:2000.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 61837-3:2015 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60122-3:2010 NOTE  Harmonized as EN 60122-3:2010 (not modified).
IEC 60191-6:2009 NOTE  Harmonized as EN 60191-6:2009 (not modified).
IEC 60368-1:2000 NOTE  Harmonized as EN 60368-1:2000 (not modified).
A1:2004 A1:2004
IEC 60368-2-2:1996 NOTE  Harmonized as EN 60368-2-2:1999 (not modified).
IEC 60368-3:2010 NOTE  Harmonized as EN 60368-3:2010 (not modified).
IEC 60679-1:2007 NOTE  Harmonized as EN 60679-1:2007 (not modified).
IEC 60679-3:2012 NOTE  Harmonized as EN 60679-3:2013 (not modified).
IEC 60862-1:2003 NOTE  Harmonized as EN 60862-1:2003 (not modified).
IEC 60862-2:2012 NOTE  Harmonized as EN 60862-2:2012 (not modified).
IEC 60862-3:2003 NOTE  Harmonized as EN 60862-3:2003 (not modified).
ISO 1101:2012 NOTE  Harmonized as EN ISO 1101:2013 (not modified).
2

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SIST EN 61837-3:2016
EN 61837-3:2015 (E)

Annex ZA
(normative)


Normative references to international publications
with their corresponding European publications


The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.


NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.


Publication Year Title EN/HD Year
IEC 61240 2012 Piezoelectric devices - Preparation of EN 61240 2012
outline drawings of surface-mounted
devices (SMD) for frequency control and
selection - General rules

3

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SIST EN 61837-3:2016

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SIST EN 61837-3:2016



IEC 61837-3

®


Edition 2.0 2015-04




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Surface mounted piezoelectric devices for frequency control and selection –

Standard outlines and terminal lead connections –

Part 3: Metal enclosures




Dispositifs piézoélectriques à montage en surface pour la commande et le choix

de la fréquence – Encombrements normalisés et connexions des sorties –


Partie 3: Enveloppes métalliques













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.140 ISBN 978-2-8322-2598-1



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61837-3:2016
– 2 – IEC 61837-3:2015  IEC 2015
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Configuration of enclosures . 5
4 Designation of types . 5
5 Metal enclosure dimensions. 6
6 Lead connections . 6
7 Designation of metal enclosures . 6
Bibliography . 20

Table 1 – Revised configurations . 6
Table 2 – Designation of metal enclosures . 7

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SIST EN 61837-3:2016
IEC 61837-3:2015  IEC 2015 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SURFACE MOUNTED PIEZOELECTRIC
DEVICES FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 3: Metal enclosures

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses
arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61837-3 has been prepared by IEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection.
This second edition cancels and replaces the first edition published in 2000. It constitutes a
technical revision.
This International Standard is to be read in conjunction with IEC 61240:2012.
This edition includes the following significant technical changes with respect to the previous
edition:
• The outline drawing is defined as one set of drawings consisting of four views, which are the
view from above, the front view, the view from the right, and the view from below; the view
from the right was drawn optionally in the previous edition.

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SIST EN 61837-3:2016
– 4 – IEC 61837-3:2015  IEC 2015
• The height of package (G ) is eliminated, instead total height is expressed by the symbol
1
letter G or with a subscript number.
• The dimensions of terminal lead spacing are shown by the centre position of the terminal
leads and its basic value e is 2.54 × n mm (n is an integer) and 1,27 × n mm for package
dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not
a multiple of the basic value, a subscript number such as e , e is attached, e.g. e , e , etc.

1 2 1 2
If there are plural spacing values, the subscript number is followed by a hyphen and numbers
such as e , e , etc.
1-1 1-2
• In terminal land areas, the lengths of each terminal pad are now expressed with maximum
values for consumer’s convenience. They were expressed as minimum values in the
previous edition of IEC 61837-3.
• If there are plural identical enclosures with different height, each enclosure was expressed
by a dash (/) and a two-digit number after the basic type name. The identity references are
given in the table of the sheet.
• The configurations of the enclosures were revised as shown in Table 1.
The text of this standard is based on the following documents:
FDIS Report on voting
49/1118/FDIS 49/1140/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61837 series, published under the general title Surface mounted
piezoelectric devices for frequency control and selection – Standard outlines and terminal lead
connections, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 61837-3:2016
IEC 61837-3:2015  IEC 2015 – 5 –
SURFACE MOUNTED PIEZOELECTRIC
DEVICES FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 3: Metal enclosures



1 Scope
This part of IEC 61837 deals with standard outlines and terminal lead connections as they
apply to SMDs for frequency control and selection in metal enclosures and is based on
IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
IEC 61240:2012, Piezoelectric devices – Preparation of outline drawings of surface mounted
devices (SMD) for frequency control and selection – General rules
3 Configuration of enclosures
The enclosures of the surface-mounted devices are made of metal with the formed lead
terminals based on the descriptive designation system for semiconductors – devices package.
All SMD enclosures described in this part of IEC 61837 are special surface mount types.
Therefore, the following designator is used.
– SMS (Surface-Mounted, Special)
4 Designation of types
The type designator consists of four parts as follows:
B C
A D

A: Configuration symbol of enclosures:
– SMS (Surface-Mounted, Special).
B: Structure of terminal leads
– L: folded leads type;
– J: folded leads type.
If there is a leadless type, it will have no mark.
See Clause 3 of IEC 61240:2012, Classification of SMD.
C:
...