Field Device Integration (FDI) - Part 4: FDI Packages (IEC 62769-4:2021)

This part of IEC 62769 specifies the FDI Packages. The overall FDI architecture is illustrated
in Figure 1. The architectural components that are within the scope of this document have
been highlighted in Figure 1.

Feldgeräteintegration (FDI) - Teil 4: FDI-Packages (IEC 62769-4:2021)

Intégration des appareils de terrain (FDI) - Partie 4: Paquetages FDI (IEC 62769-4:2021)

IEC 62769-4:2021 est disponible sous forme de IEC 62769-4:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente . L'IEC 62769-4:2021 spécifie les Paquetages FDI. L'architecture FDI complète est représentée à la Figure 1. Les composants architecturaux qui relèvent du domaine d'application du présent document ont été mis en évidence dans la Figure 1.

Integracija procesne naprave (FDI) - 4. del: Paketi FDI (IEC 62769-4:2021)

General Information

Status
Published
Publication Date
25-May-2021
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
31-Mar-2021
Due Date
05-Jun-2021
Completion Date
26-May-2021

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SLOVENSKI STANDARD
SIST EN IEC 62769-4:2021
01-julij-2021
Nadomešča:
SIST EN 62769-4:2015
Integracija procesne naprave (FDI) - 4. del: Paketi FDI (IEC 62769-4:2021)
Field Device Integration (FDI) - Part 4: FDI Packages (IEC 62769-4:2021)
Feldgeräteintegration (FDI) - Teil 4: FDI-Packages (IEC 62769-4:2021)

Intégration des appareils de terrain (FDI) - Partie 4: Paquetages FDI (IEC 62769-4:2021)

Ta slovenski standard je istoveten z: EN IEC 62769-4:2021
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
SIST EN IEC 62769-4:2021 en,fr,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 62769-4:2021
---------------------- Page: 2 ----------------------
SIST EN IEC 62769-4:2021
EUROPEAN STANDARD EN IEC 62769-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2021
ICS 25.040.40; 35.100.05 Supersedes EN 62769-4:2015 and all of its amendments
and corrigenda (if any)
English Version
Field Device Integration (FDI) - Part 4: FDI Packages
(IEC 62769-4:2021)

Intégration des appareils de terrain (FDI) - Partie 4: Feldgeräteintegration (FDI) - Teil 4: FDI-Packages

Paquetages FDI (IEC 62769-4:2021)
(IEC 62769-4:2021)

This European Standard was approved by CENELEC on 2021-03-12. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 62769-4:2021 E
---------------------- Page: 3 ----------------------
SIST EN IEC 62769-4:2021
EN IEC 62769-4:2021 (E)
European foreword

The text of document 65E/761/FDIS, future edition 2 of IEC 62769-4, prepared by SC 65E "Devices

and integration in enterprise systems" of IEC/TC 65 "Industrial-process measurement, control and

automation" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as

EN IEC 62769-4:2021.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2021-12-12

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2024-03-12

document have to be withdrawn

This document supersedes EN 62769-4:2015 and all of its amendments and corrigenda (if any).

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 62769-4:2021 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards

indicated:
IEC 61784-1 NOTE Harmonized as EN IEC 61784-1
IEC 61784-2 NOTE Harmonized as EN IEC 61784-2
IEC 62591 NOTE Harmonized as EN 62591
IEC 62769-2 NOTE Harmonized as EN 62769-2
IEC 62769-3 NOTE Harmonized as EN 62769-3
IEC 62769-5 NOTE Harmonized as EN 62769-5
IEC 62769-7 NOTE Harmonized as EN 62769-7
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SIST EN IEC 62769-4:2021
EN IEC 62769-4:2021 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the

relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available

here: www.cenelec.eu.
Publication Year Title EN/HD Year

IEC 61804 series Function blocks (FB) for process control and EN IEC 61804 series

electronic device description language (EDDL)
IEC 61804-5 2015 Function blocks (FB) for process control and EN 61804-5 2015
electronic device description language (EDDL)
- Part 5: EDDL Builtin library
IEC 62769-1 - Field Device Integration (FDI) - Part 1: EN 62769-1 -
Overview
IEC 62769-6 - Field Device Integration (FDI) - Part 6: EN 62769-6 -
Technology Mapping
ISO/IEC 29500-2 2016 Information technology - Document - -
description and processing languages - Office
Open XML File Formats - Part 2: Open
Packaging Conventions
ISO 639-1 - Codes for the representation of names of - -
languages - Part 1: Alpha-2 code
ISO 32000-1 - Document management_- Portable document - -
format – Part 1: PDF 1.7
Extensible Markup - W3C Recommendation, available at - -
Language (XML) 1.0
XML Schema - W3C Recommendation, available at - -
Definition Language
(XSD) 1.1
ETSI EN 319 132-1 - Electronic Signatures and Infrastructures - -
(ESI); XAdES digital signatures; Part 1:
Building blocks and XAdES baseline
signatures
ETSI TS 101 733 - Electronic Signatures and Infrastructures - -
(ESI); CMS Advanced Electronic Signatures
(CAdES)
FIPS 140-2 - Security Requirements for Cryptographic - -
Modules
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SIST EN IEC 62769-4:2021
---------------------- Page: 6 ----------------------
SIST EN IEC 62769-4:2021
IEC 62769-4
Edition 2.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI) –
Part 4: FDI Packages
Intégration des appareils de terrain (FDI) –
Partie 4: Paquetages FDI
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-9311-9

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN IEC 62769-4:2021
– 2 – IEC 62769-4:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 7

INTRODUCTION ..................................................................................................................... 9

1 Scope ............................................................................................................................ 10

2 Normative references .................................................................................................... 10

3 Terms, definitions, abbreviated terms and conventions .................................................. 11

3.1 Terms and definitions ............................................................................................ 11

3.2 Abbreviated terms ................................................................................................. 12

3.3 Conventions .......................................................................................................... 12

4 FDI Package Model ....................................................................................................... 12

4.1 Overview............................................................................................................... 12

4.2 FDI Package Elements .......................................................................................... 14

4.2.1 Package Catalog ........................................................................................... 14

4.2.2 Electronic Device Description ........................................................................ 14

4.2.3 User Interface Plug-in .................................................................................... 14

4.2.4 Attachment .................................................................................................... 16

4.3 FDI Package Types ............................................................................................... 16

4.3.1 FDI Device Package ...................................................................................... 16

4.3.2 FDI Communication Package ......................................................................... 17

4.3.3 FDI UIP Package ........................................................................................... 18

4.3.4 FDI Profile Package ....................................................................................... 18

5 FDI Package implementation ......................................................................................... 20

5.1 Packaging technology ........................................................................................... 20

5.2 Use of Open Packaging Conventions .................................................................... 20

5.2.1 Unknown parts ............................................................................................... 20

5.2.2 Invalid parts ................................................................................................... 20

5.2.3 Unknown relationships ................................................................................... 20

5.2.4 Interleaving.................................................................................................... 20

5.2.5 Core properties .............................................................................................. 20

5.2.6 Thumbnails .................................................................................................... 20

5.2.7 Digital signatures ........................................................................................... 20

5.3 FDI Package Parts ................................................................................................ 21

5.3.1 Package Catalog ........................................................................................... 21

5.3.2 Electronic Device Description ........................................................................ 22

5.3.3 User Interface Plug-in .................................................................................... 22

5.3.4 Attachments .................................................................................................. 25

6 FDI Package Versioning ................................................................................................ 27

6.1 Version scheme .................................................................................................... 27

6.2 Versioned elements .............................................................................................. 28

6.3 Version Hierarchy ................................................................................................. 28

6.4 UIP Compatibility .................................................................................................. 30

7 Digital Signatures and Registration Certificates ............................................................. 31

7.1 Signed Elements and Certification documents ....................................................... 31

7.2 Signing mechanism ............................................................................................... 32

7.3 FDI Package Originator, FDI Registration Authority............................................... 33

7.4 FDI Host behavior ................................................................................................. 33

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SIST EN IEC 62769-4:2021
IEC 62769-4:2021 © IEC 2021 – 3 –

Annex A (normative) File name conventions ........................................................................ 34

A.1 Identification ......................................................................................................... 34

A.2 FDI Package filename convention ......................................................................... 34

Annex B (informative) FDI Package Creation ....................................................................... 35

B.1 General ................................................................................................................. 35

B.2 Tools and Components ......................................................................................... 35

B.3 Development ......................................................................................................... 35

Annex C (informative) FDI Package deployment .................................................................. 38

C.1 General ................................................................................................................. 38

C.2 Scenarios ............................................................................................................. 38

Annex D (informative) Example ............................................................................................ 41

D.1 General ................................................................................................................. 41

D.2 Open Packaging Conventions ............................................................................... 41

D.3 Creation and Handling of FDI Packages ................................................................ 44

D.4 FDI Device Package Example ............................................................................... 44

Annex E (normative) Schema ............................................................................................... 52

E.1 Target Namespace ................................................................................................ 52

E.2 Catalog ................................................................................................................. 52

E.3 ClassificationIdT ................................................................................................... 52

E.4 CommunicationProfileT ......................................................................................... 52

E.5 CommunicationRoleT ............................................................................................ 52

E.6 CommunicationServerT ......................................................................................... 53

E.7 DeviceTypeT ......................................................................................................... 53

E.8 FdiRegistrationCert ............................................................................................... 54

E.9 FdiRegistrationCertT ............................................................................................. 54

E.10 InterfaceT ............................................................................................................. 55

E.11 ListOfCommunicationProfilesT .............................................................................. 56

E.12 ListOfDeviceImagesT ............................................................................................ 57

E.13 ListOfDeviceTypesT .............................................................................................. 57

E.14 ListOfDocumentsT ................................................................................................ 57

E.15 ListOfInterfacesT .................................................................................................. 58

E.16 ListOfLocalizedStringsT ........................................................................................ 58

E.17 ListOfProtocolSupportFilesT ................................................................................. 58

E.18 ListOfRegDeviceTypesT ....................................................................................... 59

E.19 ListOfRegistrationsT ............................................................................................. 59

E.20 ListOfSupportedDeviceRevisionsT ........................................................................ 60

E.21 ListOfSupportedUipsT ........................................................................................... 60

E.22 ListOfUipVariantsT ................................................................................................ 60

E.23 LocalizedStringT ................................................................................................... 61

E.24 PackageT ............................................................................................................. 61

E.25 PackageTypeT ...................................................................................................... 62

E.26 PlatformT .............................................................................................................. 63

E.27 RegDeviceTypeT .................................................................................................. 63

E.28 RegistrationT ........................................................................................................ 64

E.29 RelationshipIdT ..................................................................................................... 64

E.30 String256T ............................................................................................................ 65

E.31 SupportedUipT ...................................................................................................... 65

E.32 UipCatalog ............................................................................................................ 65

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SIST EN IEC 62769-4:2021
– 4 – IEC 62769-4:2021 © IEC 2021

E.33 UipStyleT .............................................................................................................. 66

E.34 UipT ...................................................................................................................... 66

E.35 UipVariantT ........................................................................................................... 67

E.36 UuidT .................................................................................................................... 67

E.37 VersionSupportedT ............................................................................................... 68

E.38 VersionT ............................................................................................................... 68

Annex F (normative) Communication protocol specific profiles ............................................. 69

Annex G (informative) FDI Package life cycle use cases ...................................................... 70

G.1 New Device Type .................................................................................................. 70

G.2 Replacement of Device ......................................................................................... 70

G.3 Firmware enhancements ....................................................................................... 70

G.4 FDI Package life cycle polices .............................................................................. 71

G.5 FDI Package update ............................................................................................. 71

G.6 FDI Package upgrade ........................................................................................... 71

G.7 FDI Package replacement/exchange ..................................................................... 71

G.8 FDI Package uninstallation ................................................................................... 71

Annex H (normative) Health Status Method .......................................................................... 73

H.1 Background........................................................................................................... 73

H.2 Device Health Status model .................................................................................. 73

H.3 Standard EDD Method signature ........................................................................... 73

H.4 Performance considerations .................................................................................. 74

Annex I (normative) Modular devices ................................................................................... 75

I.1 Concept ................................................................................................................ 75

I.2 EDDL usage profile ............................................................................................... 75

I.3 Processing recommendations ............................................................................... 76

Annex J (normative) FDI Communication Packages for FDI Communication Server ............. 78

J.1 General ................................................................................................................. 78

J.2 Protocol Support File ............................................................................................ 78

J.3 CommunicationProfile definition ............................................................................ 78

J.4 Profile Device ....................................................................................................... 78

J.5 Protocol version information .................................................................................. 78

J.6 Associating a Package with an FDI Communication Server ................................... 78

J.7 Handling of Catalog elements ............................................................................... 78

J.8 Example................................................................................................................ 79

Annex K (normative) FDI Profile for EDDs ............................................................................ 80

K.1 Overview............................................................................................................... 80

K.2 Entry Point to Online handling ............................................................................... 80

K.3 Entry Point to Offline handling............................................................................... 80

K.4 Upload and Download ........................................................................................... 80

K.5 Initial Data Set ...................................................................................................... 80

K.6 Method GetHealthStatus ....................................................................................... 80

K.7 Actions ................................................................................................................. 80

K.8 Shared files .......................................................................................................... 81

Bibliography .......................................................................................................................... 82

Figure 1 – FDI architecture diagram ...................................................................................... 10

Figure 2 – FDI Package Model .............................................................................................. 13

Figure 3 – Architectural mapping .......................................................................................... 13

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SIST EN IEC 62769-4:2021
IEC 62769-4:2021 © IEC 2021 – 5 –

Figure 4 – User Interface Plug-in Reference Model ............................................................... 15

Figure 5 – Multiple FDI Packages referencing a common UIP ............................................... 16

Figure 6 – FDI Device Package ............................................................................................. 17

Figure 7 – FDI Communication Package ............................................................................... 18

Figure 8 – FDI UIP Package ................................................................................................. 18

Figure 9 – FDI Profile Package ............................................................................................. 19

Figure 10 – Device Function and Parameter sets (type- and profile-specific) ........................ 19

Figure 11 – Catalog Element ................................................................................................. 21

Figure 12 – User Interface Plug-in ........................................................................................ 23

Figure 13 – UIP Catalog ....................................................................................................... 24

Figure 14 – FDI Registration Certificate ................................................................................ 27

Figure 15 – Version Hierarchy ............................................................................................... 29

Figure 16 – UIP Version Support concept ............................................................................. 31

Figure 17 – FDI Package signing .......................................................................................... 32

Figure B.1 – Tools used for FDI Package development ......................................................... 36

Figure D.1 – Parts and relationships in a package ................................................................ 41

Figure D.2 – Creating an FDI Package with the content files ................................................. 44

Figure D.3 – FDI Device Package Example ........................................................................... 45

Figure D.4 – User Interface Plug-in Example (fancytrend.uip) ............................................... 48

Figure I.1 – Modular device's package .................................................................................. 75

Table 1 – UIP Platform .......................................................................................................... 15

Table 2 – Package Catalog Part ............................................................................................ 21

Table 3 – EDD part ............................................................................................................... 22

Table 4 – User Interface Plug-in part .................................................................................... 23

Table 5 – UIP Catalog Part ................................................................................................... 24

Table 6 – UIP Variant Part .................................................................................................... 25

Table 7 – Image Part ............................................................................................................ 25

Table 8 – Documentation Part ............................................................................................... 26

Table 9 – Protocol Support File Part ..................................................................................... 26

Table 10 – FDI Registration Certificate Part .......................................................................... 26

Table 11 – Versioned Elements ............................................................................................ 28

Table 12 – Influence on FDI Package Version ....................................................................... 29

Table A.1 – FDI Package Naming Convention ....................................................................... 34

Table D.1 – Examples of standard MIME media types that can be used in FDI

packages .............................................................................................................................. 43

Table D.2 – Examples of FDI custom MIME media types that can be used in FDI

Packages .............................................................................................................................. 43

Table E.1 – Enumerations of CommunicationRoleT .................
...

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