SIST EN 61189-3:2008

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major changes with regard to the previous edition concern the addition of 25 new test methods and the deletion of Annex B.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles -- Partie 3: Méthodes d'essai des structures d'interconnexion (cartes imprimées)

La CEI 61189-3:2007 constitue un recueil de méthodes d'essai représentant les méthodologies et les modes opératoires qui peuvent être appliqués pour soumettre à essais les matériaux utilisés pour fabriquer des structures d'interconnexion (cartes imprimées) et des ensembles. Les modifications techniques majeures par rapport à l'édition précédente concernent l'ajout de 25 nouveaux essais, comme suit:
- 6 V: Méthodes d'essais visuels: 3V01, 3V02 et 3V03;
- 7 D: Méthodes d'essais dimensionnels: 3D03;
- 8 C: Méthodes d'essais chimiques: 3C02, 3C13 et 3C14;
- 9 M: Méthodes d'essais mécaniques: 3M01, 3M03, 3M04, 3M07 et 3M09;
- 10 E: Méthodes d'essais électriques: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 et 3E18;
- 11 N: Méthodes d'essais d'environnement: 3N03, 3N07 et 3N12;
- 12 X: Méthodes d'essais divers: 3X01.

Preskusne metode za električne materiale, tiskane plošče, povezovalne strukture in sestave - 3. del: Preskusne metode za povezovalne strukture (tiskanih plošč) (IEC 61189-3:2007)

General Information

• Status: Published
• Publication Date: 27-Apr-2008
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 24-Jan-2008
• Due Date: 01-Sep-2008
• Completion Date: 28-Apr-2008
• Ref Project: EN 61189-3:2008 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Relations

• Replaces: SIST EN 61189-3:2001/A1:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
• Effective Date: 01-Jan-2011
• Replaces: SIST EN 61189-3:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
• Effective Date: 01-Jan-2011

Standards Content (Sample)

SLOVENSKI STANDARD
01-junij-2008
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SIST EN 61189-3:2001
SIST EN 61189-3:2001/A1:2001
3UHVNXVQHPHWRGH]DHOHNWULþQHPDWHULDOHWLVNDQHSORãþHSRYH]RYDOQHVWUXNWXUH
LQVHVWDYHGHO3UHVNXVQHPHWRGH]DSRYH]RYDOQHVWUXNWXUHWLVNDQLKSORãþ
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Test methods for electrical materials, printed boards and other interconnection structures
and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles -- Partie 3: Méthodes d'essai des structures
d'interconnexion (cartes imprimées)
Ta slovenski standard je istoveten z: EN 61189-3:2008
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 61189-3
NORME EUROPÉENNE
January 2008
EUROPÄISCHE NORM
ICS 31.180 Supersedes EN 61189-3:1997 + A1:1999

English version
Test methods for electrical materials, printed boards
and other interconnection structures and assemblies -
Part 3: Test methods for interconnection structures (printed boards)
(IEC 61189-3:2007)
Méthodes d'essai pour les matériaux Prüfverfahren für Elektromaterialien,
électriques, les cartes imprimées Leiterplatten und andere Verbindungs-
et autres structures d'interconnexion strukturen und Baugruppen -
et ensembles - Teil 3: Prüfverfahren für Verbindungs-
Partie 3: Méthodes d'essai des structures strukturen (Leiterplatten)
d'interconnexion (cartes imprimées) (IEC 61189-3:2007)
(CEI 61189-3:2007)
This European Standard was approved by CENELEC on 2007-12-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2008 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61189-3:2008 E
Foreword
The text of document 91/698/FDIS, future edition 2 of IEC 61189-3, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61189-3 on 2007-12-01.
This European Standard supersedes EN 61189-3:1997 + A1:1999.
The major technical changes with regard to EN 61189-3:1997 + A1:1999 concern the addition of 25 new
tests, as follows:
– 6 V: Visual test methods: 3V01, 3V02 and 3V03;
– 7 D: Dimensional test methods: 3D03;
– 8 C: Chemical test methods: 3C02, 3C13 and 3C14;
– 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09;
– 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18;
– 11 N: Environmental test methods: 3N03, 3N07 and 3N12;
– 12 X: Miscellaneous test methods: 3X01.
EN 61189-3:2007 also includes the deletion of Annex B: Conversion table, as the referred documents
have been withdrawn. Should anyone wish to consult such information, they should refer to
EN 61189-3:1997.
The new general title of EN 61189 series is Test methods for electrical materials, printed boards and
other interconnection structures and assemblies. Titles of existing standards in this series will be updated
at the time of revision.
This standard should be used in conjunction with the following parts:
Part 1: General test methods and methodology
Part 2: Test methods for materials for interconnection structures
Part 5: Test methods for printed board assemblies
Part 6: Test methods for materials used in manufacturing electronic assemblies
It should also be read in conjunction with the series EN 60068, Environmental testing.
The following dates were fixed:

– latest date by which the EN has to be implemented

at national level by publication of an identical
(dop) 2008-09-01
national standard or by endorsement

– latest date by which the national standards conflicting
(dow) 2010-12-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61189-3:2007 was approved by CENELEC as a European
Standard without any modification.
__________
– 3 – EN 61189-3:2008
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60051 Series Direct acting indicating analogue electrical EN 60051 Series
measuring instruments and their accessories

1)
IEC 60068-1 1988 Environmental testing - EN 60068-1 1994
Part 1: General and guidance
IEC 60068-2-20 1979 Environmental testing -

+ A2 1987 Part 2: Tests - Test T: Soldering HD 323.2.20 S3 1988

2) 3)
IEC 60068-2-78 – Environmental testing - EN 60068-2-78 2001
Part 2-78: Tests - Test Cab: Damp heat,
steady state
2)
IEC 60169-15 – Radio-frequency connectors - – –
Part 15: R.F. coaxial connectors with inner
diameter of outer conductor 4,13 mm
(0,163 in) with screw coupling - Characteristic
impedance 50 ohms (Type SMA)
IEC 60454-1 1992 Specifications for pressure-sensitive EN 60454-1 1994
adhesive tapes for electrical purposes -
Part 1: General requirements
IEC 60454-3-1 1998 Pressure-sensitive adhesive tapes for EN 60454-3-1 1998
electrical purposes -
Part 3-1: Specifications for individual
materials - PVC film tapes with
pressure-sensitive adhesive
2) 3)
IEC 60584-1 – Thermocouples - EN 60584-1 1995
Part 1: Reference tables
2) 3)
IEC 60695-11-5 – Fire hazard testing - EN 60695-11-5 2005
Part 11-5: Test flames - Needle-flame test
method - Apparatus, confirmatory test
arrangement and guidance
1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1.
2)
Undated reference.
3)
Valid edition at date of issue.

Publication Year Title EN/HD Year
IEC 61188-1-2 1998 Printed boards and printed board EN 61188-1-2 1998
assemblies - Design and use -
Part 1-2: Generic requirements - Controlled
impedance
IEC 61189-1 1997 Test methods for electrical materials, EN 61189-1 1997
interconnection structures and assemblies -
Part 1: General test methods and
methodology
2) 3)
IEC 61190-1-1 – Attachment materials for electronic EN 61190-1-1 2002
assembly -
Part 1-1: Requirements for soldering fluxes
for high quality interconnections in electronics
assembly
2) 3)
IEC 61190-1-2 – Attachment materials for electronic EN 61190-1-2 2007
assembly -
Part 1-2: Requirements for soldering paste for
high quality interconnects in electronics
assembly
IEC 62326-4 1996 Printed boards - EN 62326-4 1997
Part 4: Rigid multilayer printed boards with
interlayer connections - Sectional
specification
IEC 62326-4-1 1996 Printed boards - EN 62326-4-1 1997
Part 4: Rigid multilayer printed boards with
interlayer connections - Sectional
specification -
Section 1: Capability Detail Specification -
Performance levels A, B and C
4)
ISO 4046 1978 Paper, board, pulp and related terms - – –
Vocabulary
5) 5)
ISO 9002 1994 Quality systems - Model for quality EN ISO 9002 1994
assurance in production, installation and
servicing
ISO 9453 2006 Soft solder alloys - Chemical compositions EN ISO 9453 2006
and forms
4)
ISO 4046 has been withdrawn and replaced by ISO 4046, Parts 1 to 5.
5)
Withdrawn.
IEC 61189-3
Edition 2.0 2007-10
INTERNATIONAL
STANDARD
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 3: Test methods for interconnection structures (printed boards)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
XE
ICS 31.180 ISBN 2-8318-9324-0
– 2 – 61189-3 © IEC:2007(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope and object .7
2 Normative references.7
3 Accuracy, precision and resolution .8
4 Catalogue of approved test methods .11
5 P: Preparation/conditioning test methods .11
6 V: Visual test methods .11
7 D: Dimensional test methods .14
8 C: Chemical test methods .17
9 M: Mechanical test methods.30
10 E: Electrical test methods .48
11 N: Environmental test methods .75
12 X: Miscellaneous test methods.93

Annex A (informative) Worked examples. 117

Figure 1 – Glow wire .19
Figure 2 – Test apparatus .20
Figure 3a – Horizontal specimen – Flame applied to surface.24
Figure 3b – Horizontal specimen – Flame applied to edge .24
Figure 3c – Vertical specimen – Lower edge horizontal – Flame applied to edge .25
Figure 3d – Vertical specimen – Lower edge horizontal – Flame applied to surface .25
Figure 3e – Needle burner test – Side views of test board and burner .26
Figure 3 – Needle burner test .26
Figure 4 – Flux type classification by copper mirror test .30
Figure 5 – Copper foil for peel test .33
Figure 5a – Hold down clamping system.32
Figure 5b – Single load mode .32
Figure 5c – Multiple load mode.32
Figure 5d – Keyhole hold down fixture .33
Figure 6 – Bow.36
Figure 7 – Twist .36
Figure 8 – Test set-up for bow measurement.37
Figure 9 – Specimen set-up for twist measurement.37
Figure 10a – Specimen set-up for referee test for twist, raised parallel surfaces .39
Figure 10b – Specimen setup for referee test for twist, supporting jacks or blocks .39
Figure 10c – Specimen setup for referee test for twist measurements.39
Figure 10 – Specimen setup for referee test .39
Figure 11 – Bow measurement .
...