SIST EN IEC 62878-1:2021
(Main)Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
Montageverfahren für eingebettete Bauteile - Teil 1: Fachgrundspezifikation für Trägermaterial mit eingebetteten Bauteilen
Techniques d’assemblage avec appareil(s) integre(s) - Partie 1: Spécification générique pour substrats avec appareil(s) intégré(s)
L'IEC 62878-1:2019 spécifie les exigences et méthodes d’essai génériques relatives aux substrats avec appareils intégrés. Les méthodes fondamentales d'essai pour les matériaux de substrats des cartes imprimées et pour les substrats eux-mêmes sont spécifiées dans l'IEC 61189-3.
La présente partie de l'IEC 62878 est applicable aux substrats avec appareils intégrés fabriqués à partir de matériaux organiques de base, y compris par exemple les appareils actifs ou passifs, les composants discrets formés lors du processus de fabrication des cartes imprimées électroniques, ainsi que les composants de feuilles minces.
La série IEC 62878 ne s'applique ni à la couche de redistribution (RDL – redistribution layer), ni aux modules électroniques définis dans l’IEC 62421.
Tehnologija sestavov z vdelanimi elementi - 1. del: Osnovna specifikacija za substrate z vdelanimi elementi
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 62878-1:2021
01-junij-2021
Tehnologija sestavov z vdelanimi elementi - 1. del: Osnovna specifikacija za
substrate z vdelanimi elementi
Device embedding assembly technology - Part 1: Generic specification for device
embedded substrates
Ta slovenski standard je istoveten z: EN IEC 62878-1:2019
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 62878-1:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN IEC 62878-1:2021
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SIST EN IEC 62878-1:2021
EUROPEAN STANDARD EN IEC 62878-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
December 2019
ICS 31.180; 31.190
English Version
Device embedding assembly technology - Part 1: Generic
specification for device embedded substrates
(IEC 62878-1:2019)
Techniques d’assemblage avec appareil(s) integre(s) - Montageverfahren für eingebettete Bauteile - Teil 1:
Partie 1: Spécification générique pour substrats avec Fachgrundspezifikation für Trägermaterial mit eingebetteten
appareil(s) intégré(s) Bauteilen
(IEC 62878-1:2019) (IEC 62878-1:2019)
This European Standard was approved by CENELEC on 2019-11-18. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62878-1:2019 E
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EN IEC 62878-1:2019 (E)
European foreword
The text of document 91/1597/FDIS, future edition 1 of IEC 62878-1, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 62878-1:2019.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2020-08-18
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2022-11-18
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62878-1:2019 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-1:2013 NOTE Harmonized as EN 60068-1:2014 (not modified)
IEC 60068-2-45 NOTE Harmonized as EN 60068-2-45
IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58
IEC/TR 61340-5-2 NOTE Harmonized as CLC/TR 61340-5-2
IEC 62421 NOTE Harmonized as EN 62421
2
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EN IEC 62878-1:2019 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-1 - Environmental testing - Part 2-1: Tests - EN 60068-2-1 -
Test A: Cold
IEC 60068-2-2 - Environmental testing - Part 2-2: Tests - EN 60068-2-2 -
Test B: Dry heat
IEC 60068-2-6 - Environmental testing - Part 2-6: Tests - EN 60068-2-6 -
Test Fc: Vibration (sinusoidal)
IEC 60068-2-14 - Environmental testing - Part 2-14: Tests - EN 60068-2-14 -
Test N: Change of temperature
IEC 60068-2-21 - Environmental testing - Part 2-21: Tests - EN 60068-2-21 -
Test U: Robustness of terminations and
integral mounting devices
IEC 60068-2-27 - Environmental testing - Part 2-27: Tests - EN 60068-2-27 -
Test Ea and guidance: Shock
IEC 60068-2-69 - Environmental testing – Part 2-69: Tests – EN 60068-2-69 -
Test Te/Tc: Solderability testing of
electronic components and printed boards
by the wetting balance (force
measurement) method
IEC 60068-2-78 - Environmental testing - Part 2-78: Tests - EN 60068-2-78 -
Test Cab: Damp heat, steady state
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61340-5-1 - Electrostatics - Part 5-1: Protection of EN 61340-5-1 -
electronic devices from electrostatic
phenomena - General requirements
3
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EN IEC 62878-1:2019 (E)
Publication Year Title EN/HD Year
IEC 61340-5-3 - Electrostatics - Part 5-3: Protection of EN 61340-5-3 -
electronic devices from electrostatic
phenomena - Properties and requirements
classification for packaging intended for
electrostatic discharge sensitive devices
IEC 61760-4 - Surface mounting technology - Part 4: EN 61760-4 -
Classification, packaging, labelling and
handling of moisture sensitive devices
IEC 62137-1-4 - Surface mounting technology - EN 62137-1-4 -
Environmental and endurance test
methods for surface mount solder joint -
Part 1-4: Cyclic bending test
IEC 62878-1-1 - Device embedded substrate - Part 1-1: EN 62878-1-1 -
Generic specification - Test methods
IEC/TR 62878-2-2 - Device embedded substrate - Part 2-2: - -
Guidelines - Electrical testing
IEC/TS 62878-2-1 - Device embedded substrate - Part 2-1: - -
Guidelines - General description of
technology
IEC/TS 62878-2-3 - Device embedded substrate - Part 2-3: - -
Guidelines - Design guide
IEC/TS 62878-2-4 - Device embedded substrate - Part 2-4: - -
Guidelines - Test element groups (TEG)
J-STD 033 - Handling, Packing, Shipping, and Use of - -
Moisture/Reflow and/or Process Sensitive
Components
4
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IEC 62878-1
®
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
Device embedding assembly technology –
Part 1: Generic specification for device embedded substrates
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 31.190 ISBN 978-2-8322-7460-6
Warning! Make sure that you obtained this publication from an authorized distributor.
® Registered trademark of the International Electrotechnical Commission
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– 2 – IEC 62878-1:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Value chain . 8
4.1 System description. 8
4.1.1 Generic design variants . 8
4.1.2 Generic value chain . 8
4.2 Elements of the value chain . 9
4.2.1 General . 9
4.2.2 System manufacturer . 9
4.2.3 Components manufacturer . 9
4.2.4 Material manufacturer . 10
4.2.5 Submodule manufacturer . 10
4.2.6 Board manufacturer . 10
4.2.7 Assembly manufacturer . 10
4.3 Traceability . 10
5 Safety aspects of base material and components . 10
6 Design and structure of device embedded substrate . 11
6.1 Basic rules for layer description . 11
6.2 Design for embedding and testability . 11
6.3 Safety aspects of design . 11
7 Embedding technology . 11
7.1 Basic technologies for embedding . 11
7.2 Basic requirements to embedding technology . 11
7.2.1 Cleanliness of components, submodules and process . 11
7.2.2 ESD . 11
7.2.3 Moisture sensitivity . 11
7.2.4 Defects . 12
8 Tests and measuring methods . 12
8.1 Standard atmospheric conditions . 12
8.1.1 Standard atmospheric conditions for testing . 12
8.1.2 Referee conditions . 12
8.1.3 Reference conditions . 13
8.2 Electrical performance tests . 13
8.2.1 General . 13
8.2.2 Electrical test levels . 13
8.2.3 Protection of DES and test equipment . 13
8.2.4 Accuracy of measurement . 14
8.2.5 Test structures. 15
8.2.6 Mechanical performance tests . 15
8.2.7 Resistance to soldering heat . 15
8.2.8 Solderability. 16
8.2.9 Shock . 16
8.2.10 Vibration (sinusoidal) . 16
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8.2.11 Resistance to solvents . 16
8.3 Climatic performance tests . 16
8.3.1 Dry heat . 16
8.3.2 Cold. 17
8.3.3 Damp heat, steady state . 17
8.3.4 Change of temperature . 17
9 Transportation, handling and packing material . 18
9.1 Humidity / Temperature / Environmental protection . 18
9.2 Mechanical protection . 18
9.3 ESD . 18
10 General requirements . 18
Bibliography . 19
Figure 1 – Value chain and interfaces . 9
Table 1 – Referee conditions . 12
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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –
Part 1: Generic specification for device embedded substrates
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62878-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this International Standard is based on the following documents:
FDIS Report on voting
91/1597/FDIS 91/1616/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62878 series, published under the general title Device embedded
substrate, can be found on the IEC website.
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Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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INTRODUCTION
This document is a generic specification for device-embedded substrates fabricated by
embedding discrete active and/or passive electronic devices into one or multiple inner layers
of an organic substrate with electric connections by means of vias, conductor plating,
conductive paste, and printing. Other special technologies for the realization of conductive or
isolating structures and electronic components functions inside of substrates, like electronic
modules or redistribution layers of integrated circuit packages are not covered by this
document.
The device-embedded substrate can be used as a substrate to mount SMDs or THDs to form
electronic circuits, as conductor and insulator layers can be formed after embedding
electronic devices.
The purpose of this series of documents is to obtain common understanding in structures, test
methods, design and fabrication processes and use of device-embedded substrate in the
industry. These documents do not specify details of the manufacturing processes, design
criteria and requirements, as those normally constitute intellectual property of the
manufacturers and are very specific to the individual embedding technologies and
applications.
Generic specification
The generic specification covers all subjects mainly common to device-embedded substrates
for use in electronic equipment, such as terminology, methods of measurement and tests.
Where the individual subjects require the prescription of conditions or parameters specific to
the particular sub-family or type of embedded substrates, such prescriptions are required to
be given by one of the subordinate specifications.
The numeric reference of the generic specification is IEC 62878-1.
Sectional and detail specifications (requirements to technology and components)
Sectional specifications cover all subjects additional to those given in the generic
specification, which are specific to a defined sub-group of device-embedded substrate
technologies. These subjects normally are preferred values for characteristics, additional test
methods and relevant prescriptions for test methods given in the generic specification,
prescriptions for sampling and for the preparation of specimens, recommended test severities
and preferred acceptance criteria. The sectional specification also outlines the structure and
scope of the test schedules that are to be applied in all subordinate detail specifications.
The numeric reference of the sectional and related detail specifications is IEC 62878-3-x.
Guidelines and supporting documentation
Supporting documentation and guidelines provide information in addition to the provisions of
generic, sectional and detail specifications.
The numeric reference of supporting documentation and guidelines is IEC 62878-2-x.
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DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –
Part 1: Generic specification for device embedded substrates
1 Scope
This part of IEC 62878 specifies the generic requirements and test methods for device-
embedded substrates. The basic test methods for printed board substrate materials and
substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of
organic base material, which includes, for example, active or passive devices, discrete
components formed in the fabrication process of electronic printed boards, and sheet-formed
components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic
modules defined in IEC 62421.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-21, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
IEC 60068-2-69, Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing
of electronic components and printed boards by the wetting balance (force measurement)
method
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60194-2, Printed board design, manufacture and assembly – Vocabulary – Part 2:
Common usage in electronic technologies as well as printed board and electronic assembly
technologies
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
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IEC 61340-5-3, Electrostatics – Part 5-3: Protection of electronic devices from electrostatic
phenomena – Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices
IEC 61760-4, Surface mounting technology – Part 4: Classification, packaging, labelling and
handling of moisture sensitive devices
IEC 62137-1-4, Surface mounting technology – Environmental and endurance test methods
for surface mount solder joint – Part 1-4: Cyclic bending test
IEC 62878-1-1, Device embedded substrate – Part 1-1: Generic specification – Test methods
IEC TS 62878-2-1, Device embedded substrate – Part 2-1: Guidelines – General description
of technology
IEC TR 62878-2-2, Device embedded substrate – Part 2-2: Guidelines – Electrical testing
IEC TS 62878-2-3, Device Embedded Substrate – Part 2-3: Guidelines – Design Guide
IEC TS 62878-2-4, Device Embedded Substrate – Part 2-4: Guidelines – Test element groups
(TEG)
J-STD 033, Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process
Sensitive Components
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194-2 and the
following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
device-embedded substrate
DES
substrate in which one or more active devices (semiconductor device) and/or passive devices
(e.g. resistor or capacitor) are formed using thick-film technology or by embedding them
within the substrate
4 Value chain
4.1 System description
4.1.1 Generic design variants
Generic design variants are described in IEC TS 62878-2-1.
4.1.2 Generic value chain
The business model shown in Figure 1 shows the supply routes and communication along the
value chain.
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Figure 1 – Value chain and interfaces
4.2 Elements of the value chain
4.2.1 General
All materials have to be aligned with the embedding technology and the components to be
embedded. Composition and processability of the materials and components for embedding
shall be compatible.
The detail specification for the base material shall be defined by the board or submodule
manufacturer. Generic specifications such as "FR4" are not specific enough.
4.2.2 System manufacturer
The requirements to the electronic system normally are determined by the system (equipment)
manufacturer and can contain requirements such as functionality, use conditions
(environmental and electrical), field performance, reliability, useful lifetime, restriction of
substances and further customer-specific requirements. These requirements shall be
deployed through the total value chain, e.g. by requirement sheets, so that assembly design
and processing, device-embedded substrate design and processing, as well as the
components and materials fit together, and can contribute to the fulfilment of those
requirements. The strategy for electrical tests shall be planned and confirmed by the involved
partners in accordance with IEC 62878-1-1 and IEC TR 62878-2-2, taking into consideration
component test specifications and tests at board and system level.
This deployment process can be supported in form of a failure mode and effect analysis
(FMEA) or by similar tools. A concept for the qualification of processes, components and
materials shall be agreed at a very early stage of development (see also IEC TS 62878-2-4).
4.2.3 Components manufacturer
The generic requirements of components are related to the embedding technology used, and
shall be sp
...
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