SIST EN IEC 61189-5-301:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles

This part of IEC 61189 specifies methods for testing the characteristics of soldering paste using
fine solder particles (hereinafter referred to as solder paste).
This document is applicable to the solder paste using fine solder particle such as type 6, type 7
specified in IEC 61190-1-2 or finer particle sizes.
This type of solder paste is used for connecting wiring and components in high-density printed
circuit boards which are used in electronic or communication equipment and such, equipping
fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 μm or less).
Test methods for the characteristics of solder paste in this document are considering the effect
of surface activation force due to the fine sized solder particles which could affect the test result
by existing test methods.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-301: Allgemeine Prüfverfahren für Materialien und Baugruppen - Lotpaste mit feinen Lotpartikeln

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-301: Méthodes d’essai générales pour les matériaux et les assemblages - Pâte à braser à fines particules de brasage

L'IEC 61189-5-301:2021 spécifie les méthodes pour soumettre à essai les caractéristiques de la pâte à braser à fines particules de brasage (ci-après désignée pâte à braser).
Le présent document s’applique à la pâte à braser à fines particules de brasage, telle que le type 6 et le type 7 spécifiés dans l’IEC 61190-1-2, ou à une pâte à braser à particules plus fines.
Ce type de pâte à braser est utilisé pour connecter des câblages et composants sur des cartes imprimées à haute densité employées dans les équipements électroniques ou de communication ou tout appareillage similaire équipé de câblage fin (par exemple des largeurs minimales de conducteurs et des espaces minimaux entre conducteurs de 60 µm ou moins).
Les méthodes d’essai pour les caractéristiques de la pâte à braser présentées dans le présent document tiennent compte de la force d’activation de la surface due à la finesse des particules de brasage qui peut affecter les résultats d’essais effectués selon les méthodes existantes.

Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne strukture in sestave - 5-301. del: Preskusne metode za materiale in sestave tiskanih vezij - Spajkalna pasta iz drobnih delcev spajke

General Information

• Status: Published
• Publication Date: 14-Jun-2021
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 20-May-2021
• Due Date: 25-Jul-2021
• Completion Date: 15-Jun-2021
• Ref Project: EN IEC 61189-5-301:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 61189-5-301:2021
01-julij-2021
Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne
strukture in sestave - 5-301. del: Preskusne metode za materiale in sestave
tiskanih vezij - Spajkalna pasta iz drobnih delcev spajke
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering
paste using fine solder particles
Ta slovenski standard je istoveten z: EN IEC 61189-5-301:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61189-5-301:2021 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61189-5-301:2021


EUROPEAN STANDARD EN IEC 61189-5-301

NORME EUROPÉENNE

EUROPÄISCHE NORM
April 2021
ICS 31.180

English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 5-301: General
test methods for materials and assemblies - Soldering paste
using fine solder particles
(IEC 61189-5-301:2021)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 5-
ensembles - Partie 5-301: Méthodes d'essai générales pour 301: Allgemeine Prüfverfahren für Materialien und
les matériaux et les assemblages - Pâte à braser à fines Baugruppen - Lötpaste mit feinen Lötpartikeln
particules de brasage (IEC 61189-5-301:2021)
(IEC 61189-5-301:2021)
This European Standard was approved by CENELEC on 2021-04-21. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61189-5-301:2021 E

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SIST EN IEC 61189-5-301:2021
EN IEC 61189-5-301:2021 (E)
European foreword
The text of document 91/1655/CDV, future edition 1 of IEC 61189-5-301, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-5-301:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-01-21
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-04-21
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61189-5-301:2021 was approved by CENELEC as a
European Standard without any modification.
2

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SIST EN IEC 61189-5-301:2021
EN IEC 61189-5-301:2021 (E)
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61189-5-3 2015 Test methods for electrical materials, printed EN 61189-5-3 2015
boards and other interconnection structures
and assemblies - Part 5-3: General test
methods for materials and assemblies -
Soldering paste for printed board
assemblies
IEC 61190-1-2 2014 Attachment materials for electronic EN 61190-1-2 2014
assembly - Part 1-2: Requirements for
soldering pastes for high-quality
interconnects in electronics assembly
ISO 857-2 - Welding and allied processes - Vocabulary - - -
Part 2: Soldering and brazing processes
and related terms

3

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IEC 61189-5-301

®


Edition 1.0 2021-03




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE
colour

inside










Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 5-301: General test methods for materials and assemblies – Soldering

paste using fine solder particles



Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres


structures d’interconnexion et ensembles –

Partie 5-301: Méthodes d’essai générales pour les matériaux et les

assemblages – Pâte à braser à fines particules de brasage











INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.180 ISBN 978-2-8322-9534-2




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN IEC 61189-5-301:2021
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CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Powder particle size distribution measurement . 7
4.1 General . 7
4.2 Powder particle size distribution measurement – Scanning electron
microscope . 7
4.2.1 Object . 7
4.2.2 Equipment/apparatus . 7
4.2.3 Procedure . 7
4.2.4 Evaluation . 7
4.3 Powder particle size distribution measurement – Laser diffraction . 7
4.3.1 Object . 7
4.3.2 Equipment/apparatus . 7
4.3.3 Procedure . 7
4.3.4 Evaluation . 8
4.4 Powder particle size distribution measurement – Digital microscope . 8
4.4.1 Object . 8
4.4.2 Equipment/apparatus . 8
4.4.3 Procedure . 8
4.4.4 Evaluation . 8
5 Solder paste viscosity . 8
5.1 Method A:Trace spiral pump method . 8
5.1.1 Object . 8
5.1.2 Equipment/apparatus . 9
5.1.3 Procedure . 9
5.1.4 Evaluation . 10
5.2 Method B: Spiral pump method (IEC 61189-5-3, Test 5-3X06: Solder paste
viscosity – Spiral pump method (applicable to 300 Pa·s) . 10
5.2.1 Object . 10
5.2.2 Test specimen . 10
5.2.3 Equipment/apparatus . 10
5.2.4 Procedure . 10
5.2.5 Evaluation . 11
5.3 Additional information . 11
6 Printability test. 12
6.1 Object . 12
6.2 Equipment/apparatus . 12
6.3 Procedure . 14
6.4 Evaluation . 14
7 Slump test . 15
7.1 Object . 15
7.2 Equipment/apparatus . 15
7.3 Procedure . 15
7.4 Evaluation . 16
8 Reflow test . 16

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IEC 61189-5-301:2021 © IEC 2021 – 3 –
8.1 Object . 16
8.2 Equipment/apparatus . 16
8.3 Procedure . 16
8.4 Evaluation . 17
9 High temperature observation test . 18
9.1 Object . 18
9.2 Equipment/apparatus . 18
9.3 Procedure . 20
9.4 Evaluation . 21
Annex A (informative)  Example of the test report on powder particle size distribution
measurement . 22
Annex B (informative) Example of the test report on viscosity characteristics . 23
Annex C (informative) Example of the test report on printability test . 24
C.1 Test report form . 24
C.2 Test report entry example . 25
Annex D (informative) Example of the test report on slump test . 26
Annex E (informative) Example of the test report on reflow test . 27
E.1 Test report form . 27
E.2 Test report entry example . 28
Annex F (informative) Example of the test report on high temperature observation test . 29
F.1 Test report form . 29
F.2 Melting property report form . 30
F.3 Entry example for melting property. 30
Annex G (informative) Example pictures of the printing and reflow test . 31
G.1 Printing test . 31
G.2 Reflow test . 32

Figure 1 – Metal mask for printability test . 13
Figure 2 – Test board with slits for splitting . 14
Figure 3 – Temperature profile for slump test . 16
Figure 4 – Temperature profile for reflow test. 17
Figure 5 – Metal mask for high temperature observation test . 19
Figure 6 – Example structure of high temperature observation apparatus . 20

Table 1 – QC procedure for Trace spiral-type viscometer . 9
Table 2 – QC procedure for spiral-type viscometer according to Test 5-3X06
in IEC 61189-5-3 . 11
Table 3 – Evaluation index for printability test . 15
Table 4 – Evaluation index for reflow test . 18

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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 5-301: General test methods for materials and assemblies –
Soldering paste using fine solder particles

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61189-5-301 has been prepared by IEC technical committee TC 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1655/CDV 91/1698/RVC

Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

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SIST EN IEC 61189-5-301:2021
IEC 61189-5-301:2021 © IEC 2021 – 5 –
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 5-301: General test methods for materials and assemblies –
Soldering paste using fine solder particles



1 Scope
This part of IEC 61189 specifies methods for testing the characteristics of soldering paste using
fine solder particles (hereinafter referred to as solder paste).
This document is applicable to the solder paste using fine solder particle such as type 6, type 7
specified in IEC 61190-1-2 or finer particle sizes.
This type of solder paste is used for connecting wiring and components in high-density printed
circuit boards which are used in electronic or communication equipment and such, equipping
fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 µm or less).
Test methods for the characteristics of solder paste in this document are considering the effect
of surface activation force due to the fine sized solder particles which could affect the test result
by existing test methods.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61189-5-3:2015, Test methods for electrical materials, printed boards and other
interconnection structures and assemblies – Part 5-3: General test methods for materials and
assemblies: Soldering paste for printed board assemblies
IEC 61190-1-2:2014, Attachment materials for electronic assembly – Part 1-2: Requirements
for soldering pastes for high-quality interconnects in electronics assembly
ISO 857-2, Welding and allied processes – Vocabulary – Part 2: Soldering and brazing
processes and related terms
3 Terms and definitions
For the purposes of this document, the terms and definitions given in ISO 857-2 and the
following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp

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IEC 61189-5-301:2021 © IEC 2021 – 7 –
3.1
digital microscope
microscope displaying an enlarged image on a screen of a personal computer or a monitor
4 Powder particle size distribution measurement
4.1 General
This measurement is for determining whether or not the solder particle used in the solder paste
complies with the relevant powder particle size type. Solder particle specimen shall be obtained
from the supplier or extracted from the solder paste according to 4.14.4 and 4.14.5 of
IEC 61189-5-3:2015.
4.2 Powder particle size distribution measurement – Scanning electron microscope
4.2.1 Object
The powder particle size distribution of the solder particle is measured using scanning electron
microscope (hereinafter, referred to as SEM).
4.2.2 Equipment/apparatus
SEM (Scanning Electron Microscope): 1 000 times or more magnification with image storage
device.
4.2.3 Procedure
At least 100 solder particles shall be observed using SEM. Observation may be done either
directly or using the acquired SEM image. The solder particle size shall be determined by
assumption that the solder particles are spherical. The solder particle shall be sorted out
according to the assigned classification type specified in Table 2 of IEC 61190-1-2:2014. The
number of sorted solder particle shall be counted and converted into masses.
4.2.4 Evaluation
Express the masses of the particle above, within, and below the nominal size range as
percentages of the mass of the original specimen. Enter the data in the test report. Annex A
shows an example of the test report.
4.3 Powder particle size distribution measurement – Laser diffraction
4.3.1 Object
The powder particle size distribution of the solder powder is measured using laser diffraction
type particle size distribution measuring apparatus.
4.3.2 Equipment/apparatus
a) laser diffraction type particle size distribution measuring apparatus;
b) balance: 0,01 g sensitivity;
c) spatula.
4.3.3 Procedure
Measurement shall be done in accordance with the instructions of the measuring apparatus.
Measure the blank sample to ensure the measuring apparatus is clean enough for measuring.
0,5 g to 10 g of solder powder shall be measured for the particle size distribution.

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4.3.4 Evaluation
Express the masses of the particle above, within, and below the nominal size range as
percentages of the mass of the original specimen. Enter the data in the test report. Annex A
shows an example of the test report.
4.4 Powder particle size distribution measurement – Digital microscope
4.4.1 Object
The powder particle size distribution of the solder powder is measured using a digital
microscope capable of three-dimensional (3D) observation by 3D construction of an acquired
image.
4.4.2 Equipment/apparatus
a) Glass slide
b) 3D digital microscope:
1) 1 000 times or more magnification;
2) equipping telecentric optical system and transmissive illumination which enable high-
precision measurement;
3) equipping an image storage device which is capable of 3D construction from the stored
images.
4.4.3 Procedure
Measurement shall be done in accordance with the instructions of the measuring apparatus. At
least 100 solder particles shall be placed on a glass slide, then observed using a digital
microscope. 3D image shall be stored.
The powder particle size shall be determined by assumption that the solder powders are
spherical. The powders shall be sorted out according to the assigned classification type
specified in Table 2 of IEC 61190-1-2:2014. The number of sorted particles shall be counted
and converted into masses.
4.4.4 Evaluation
Express the masses of the powder above, within, and below the nominal size range as
percentages of the mass of the original specimen. Enter the data in the test report. Annex A
shows an example of the test report form.
5 Solder paste viscosity
5.1 Method A:Trace spiral pump method
5.1.1 Object
This test specifies a standard procedure for determining viscosity-shear rate characteristics and
thixotropy (thixotropic index), which is also close relating to the printability of the solder paste.
Trace spiral viscometer is a coaxial-cylinder rotational type viscometer with a small sample
3
receptance, for example 0,2 cm capacity. Outer barrel of the
...