Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles

This part of IEC 61189 specifies methods for testing the characteristics of soldering paste using
fine solder particles (hereinafter referred to as solder paste).
This document is applicable to the solder paste using fine solder particle such as type 6, type 7
specified in IEC 61190-1-2 or finer particle sizes.
This type of solder paste is used for connecting wiring and components in high-density printed
circuit boards which are used in electronic or communication equipment and such, equipping
fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 μm or less).
Test methods for the characteristics of solder paste in this document are considering the effect
of surface activation force due to the fine sized solder particles which could affect the test result
by existing test methods.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-301: Allgemeine Prüfverfahren für Materialien und Baugruppen - Lötpaste mit feinen Lötpartikeln

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-301: Méthodes d’essai générales pour les matériaux et les assemblages - Pâte à braser à fines particules de brasage

L'IEC 61189-5-301:2021 spécifie les méthodes pour soumettre à essai les caractéristiques de la pâte à braser à fines particules de brasage (ci-après désignée pâte à braser). Le présent document s’applique à la pâte à braser à fines particules de brasage, telle que le type 6 et le type 7 spécifiés dans l’IEC 61190-1-2, ou à une pâte à braser à particules plus fines. Ce type de pâte à braser est utilisé pour connecter des câblages et composants sur des cartes imprimées à haute densité employées dans les équipements électroniques ou de communication ou tout appareillage similaire équipé de câblage fin (par exemple des largeurs minimales de conducteurs et des espaces minimaux entre conducteurs de 60 µm ou moins). Les méthodes d’essai pour les caractéristiques de la pâte à braser présentées dans le présent document tiennent compte de la force d’activation de la surface due à la finesse des particules de brasage qui peut affecter les résultats d’essais effectués selon les méthodes existantes.

Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne strukture in sestave - 5-301. del: Preskusne metode za materiale in sestave tiskanih vezij - Spajkalna pasta iz drobnih delcev spajke

General Information

Status
Published
Publication Date
14-Jun-2021
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
20-May-2021
Due Date
25-Jul-2021
Completion Date
15-Jun-2021

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SLOVENSKI STANDARD
SIST EN IEC 61189-5-301:2021
01-julij-2021
Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne
strukture in sestave - 5-301. del: Preskusne metode za materiale in sestave
tiskanih vezij - Spajkalna pasta iz drobnih delcev spajke

Test methods for electrical materials, printed boards and other interconnection structures

and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering

paste using fine solder particles
Ta slovenski standard je istoveten z: EN IEC 61189-5-301:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61189-5-301:2021 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61189-5-301:2021
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SIST EN IEC 61189-5-301:2021
EUROPEAN STANDARD EN IEC 61189-5-301
NORME EUROPÉENNE
EUROPÄISCHE NORM
April 2021
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 5-301: General
test methods for materials and assemblies - Soldering paste
using fine solder particles
(IEC 61189-5-301:2021)

Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und

imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 5-

ensembles - Partie 5-301: Méthodes d'essai générales pour 301: Allgemeine Prüfverfahren für Materialien und

les matériaux et les assemblages - Pâte à braser à fines Baugruppen - Lötpaste mit feinen Lötpartikeln

particules de brasage (IEC 61189-5-301:2021)
(IEC 61189-5-301:2021)

This European Standard was approved by CENELEC on 2021-04-21. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 61189-5-301:2021 E
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SIST EN IEC 61189-5-301:2021
EN IEC 61189-5-301:2021 (E)
European foreword

The text of document 91/1655/CDV, future edition 1 of IEC 61189-5-301, prepared by IEC/TC 91

"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN IEC 61189-5-301:2021.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2022-01-21

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2024-04-21

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 61189-5-301:2021 was approved by CENELEC as a

European Standard without any modification.
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SIST EN IEC 61189-5-301:2021
EN IEC 61189-5-301:2021 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),

the relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available

here: www.cenelec.eu.
Publication Year Title EN/HD Year

IEC 61189-5-3 2015 Test methods for electrical materials, printed EN 61189-5-3 2015

boards and other interconnection structures
and assemblies - Part 5-3: General test
methods for materials and assemblies -
Soldering paste for printed board
assemblies
IEC 61190-1-2 2014 Attachment materials for electronic EN 61190-1-2 2014
assembly - Part 1-2: Requirements for
soldering pastes for high-quality
interconnects in electronics assembly
ISO 857-2 - Welding and allied processes - Vocabulary - - -
Part 2: Soldering and brazing processes
and related terms
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SIST EN IEC 61189-5-301:2021
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SIST EN IEC 61189-5-301:2021
IEC 61189-5-301
Edition 1.0 2021-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 5-301: General test methods for materials and assemblies – Soldering
paste using fine solder particles
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles –
Partie 5-301: Méthodes d’essai générales pour les matériaux et les
assemblages – Pâte à braser à fines particules de brasage
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-9534-2

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN IEC 61189-5-301:2021
– 2 – IEC 61189-5-301:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 4

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms and definitions ...................................................................................................... 6

4 Powder particle size distribution measurement ................................................................ 7

4.1 General ................................................................................................................... 7

4.2 Powder particle size distribution measurement – Scanning electron

microscope ............................................................................................................. 7

4.2.1 Object .............................................................................................................. 7

4.2.2 Equipment/apparatus ....................................................................................... 7

4.2.3 Procedure ........................................................................................................ 7

4.2.4 Evaluation ....................................................................................................... 7

4.3 Powder particle size distribution measurement – Laser diffraction ........................... 7

4.3.1 Object .............................................................................................................. 7

4.3.2 Equipment/apparatus ....................................................................................... 7

4.3.3 Procedure ........................................................................................................ 7

4.3.4 Evaluation ....................................................................................................... 8

4.4 Powder particle size distribution measurement – Digital microscope ....................... 8

4.4.1 Object .............................................................................................................. 8

4.4.2 Equipment/apparatus ....................................................................................... 8

4.4.3 Procedure ........................................................................................................ 8

4.4.4 Evaluation ....................................................................................................... 8

5 Solder paste viscosity ...................................................................................................... 8

5.1 Method A:Trace spiral pump method ....................................................................... 8

5.1.1 Object .............................................................................................................. 8

5.1.2 Equipment/apparatus ....................................................................................... 9

5.1.3 Procedure ........................................................................................................ 9

5.1.4 Evaluation ..................................................................................................... 10

5.2 Method B: Spiral pump method (IEC 61189-5-3, Test 5-3X06: Solder paste

viscosity – Spiral pump method (applicable to 300 Pa·s) ....................................... 10

5.2.1 Object ............................................................................................................ 10

5.2.2 Test specimen ............................................................................................... 10

5.2.3 Equipment/apparatus ..................................................................................... 10

5.2.4 Procedure ...................................................................................................... 10

5.2.5 Evaluation ..................................................................................................... 11

5.3 Additional information ........................................................................................... 11

6 Printability test............................................................................................................... 12

6.1 Object ................................................................................................................... 12

6.2 Equipment/apparatus ............................................................................................ 12

6.3 Procedure ............................................................................................................. 14

6.4 Evaluation ............................................................................................................. 14

7 Slump test ..................................................................................................................... 15

7.1 Object ................................................................................................................... 15

7.2 Equipment/apparatus ............................................................................................ 15

7.3 Procedure ............................................................................................................. 15

7.4 Evaluation ............................................................................................................. 16

8 Reflow test .................................................................................................................... 16

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SIST EN IEC 61189-5-301:2021
IEC 61189-5-301:2021 © IEC 2021 – 3 –

8.1 Object ................................................................................................................... 16

8.2 Equipment/apparatus ............................................................................................ 16

8.3 Procedure ............................................................................................................. 16

8.4 Evaluation ............................................................................................................. 17

9 High temperature observation test ................................................................................. 18

9.1 Object ................................................................................................................... 18

9.2 Equipment/apparatus ............................................................................................ 18

9.3 Procedure ............................................................................................................. 20

9.4 Evaluation ............................................................................................................. 21

Annex A (informative) Example of the test report on powder particle size distribution

measurement ........................................................................................................................ 22

Annex B (informative) Example of the test report on viscosity characteristics ....................... 23

Annex C (informative) Example of the test report on printability test ..................................... 24

C.1 Test report form .................................................................................................... 24

C.2 Test report entry example ..................................................................................... 25

Annex D (informative) Example of the test report on slump test ........................................... 26

Annex E (informative) Example of the test report on reflow test ........................................... 27

E.1 Test report form .................................................................................................... 27

E.2 Test report entry example ..................................................................................... 28

Annex F (informative) Example of the test report on high temperature observation test ........ 29

F.1 Test report form .................................................................................................... 29

F.2 Melting property report form .................................................................................. 30

F.3 Entry example for melting property........................................................................ 30

Annex G (informative) Example pictures of the printing and reflow test ................................ 31

G.1 Printing test .......................................................................................................... 31

G.2 Reflow test ............................................................................................................ 32

Figure 1 – Metal mask for printability test .............................................................................. 13

Figure 2 – Test board with slits for splitting ........................................................................... 14

Figure 3 – Temperature profile for slump test ........................................................................ 16

Figure 4 – Temperature profile for reflow test........................................................................ 17

Figure 5 – Metal mask for high temperature observation test ................................................ 19

Figure 6 – Example structure of high temperature observation apparatus ............................. 20

Table 1 – QC procedure for Trace spiral-type viscometer ........................................................ 9

Table 2 – QC procedure for spiral-type viscometer according to Test 5-3X06

in IEC 61189-5-3 ................................................................................................................... 11

Table 3 – Evaluation index for printability test ....................................................................... 15

Table 4 – Evaluation index for reflow test .............................................................................. 18

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SIST EN IEC 61189-5-301:2021
– 4 – IEC 61189-5-301:2021 © IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 5-301: General test methods for materials and assemblies –
Soldering paste using fine solder particles
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence between

any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 61189-5-301 has been prepared by IEC technical committee TC 91: Electronics assembly

technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1655/CDV 91/1698/RVC

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.
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SIST EN IEC 61189-5-301:2021
IEC 61189-5-301:2021 © IEC 2021 – 5 –

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/standardsdev/publications.

A list of all parts in the IEC 61189 series, published under the general title Test methods for

electrical materials, printed boards and other interconnection structures and assemblies, can

be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under webstore.iec.ch in the data related to the

specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct understanding

of its contents. Users should therefore print this document using a colour printer.

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SIST EN IEC 61189-5-301:2021
– 6 – IEC 61189-5-301:2021 © IEC 2021
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 5-301: General test methods for materials and assemblies –
Soldering paste using fine solder particles
1 Scope

This part of IEC 61189 specifies methods for testing the characteristics of soldering paste using

fine solder particles (hereinafter referred to as solder paste).

This document is applicable to the solder paste using fine solder particle such as type 6, type 7

specified in IEC 61190-1-2 or finer particle sizes.

This type of solder paste is used for connecting wiring and components in high-density printed

circuit boards which are used in electronic or communication equipment and such, equipping

fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 µm or less).

Test methods for the characteristics of solder paste in this document are considering the effect

of surface activation force due to the fine sized solder particles which could affect the test result

by existing test methods.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies.

For undated references, the latest edition of the referenced document (including any

amendments) applies.

IEC 61189-5-3:2015, Test methods for electrical materials, printed boards and other

interconnection structures and assemblies – Part 5-3: General test methods for materials and

assemblies: Soldering paste for printed board assemblies

IEC 61190-1-2:2014, Attachment materials for electronic assembly – Part 1-2: Requirements

for soldering pastes for high-quality interconnects in electronics assembly

ISO 857-2, Welding and allied processes – Vocabulary – Part 2: Soldering and brazing

processes and related terms
3 Terms and definitions

For the purposes of this document, the terms and definitions given in ISO 857-2 and the

following apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
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SIST EN IEC 61189-5-301:2021
IEC 61189-5-301:2021 © IEC 2021 – 7 –
3.1
digital microscope

microscope displaying an enlarged image on a screen of a personal computer or a monitor

4 Powder particle size distribution measurement
4.1 General

This measurement is for determining whether or not the solder particle used in the solder paste

complies with the relevant powder particle size type. Solder particle specimen shall be obtained

from the supplier or extracted from the solder paste according to 4.14.4 and 4.14.5 of

IEC 61189-5-3:2015.
4.2 Powder particle size distribution measurement – Scanning electron microscope
4.2.1 Object

The powder particle size distribution of the solder particle is measured using scanning electron

microscope (hereinafter, referred to as SEM).
4.2.2 Equipment/apparatus

SEM (Scanning Electron Microscope): 1 000 times or more magnification with image storage

device.
4.2.3 Procedure

At least 100 solder particles shall be observed using SEM. Observation may be done either

directly or using the acquired SEM image. The solder particle size shall be determined by

assumption that the solder particles are spherical. The solder particle shall be sorted out

according to the assigned classification type specified in Table 2 of IEC 61190-1-2:2014. The

number of sorted solder particle shall be counted and converted into masses.
4.2.4 Evaluation

Express the masses of the particle above, within, and below the nominal size range as

percentages of the mass of the original specimen. Enter the data in the test report. Annex A

shows an example of the test report.
4.3 Powder particle size distribution measurement – Laser diffraction
4.3.1 Object

The powder particle size distribution of the solder powder is measured using laser diffraction

type particle size distribution measuring apparatus.
4.3.2 Equipment/apparatus
a) laser diffraction type particle size distribution measuring apparatus;
b) balance: 0,01 g sensitivity;
c) spatula.
4.3.3 Procedure

Measurement shall be done in accordance with the instructions of the measuring apparatus.

Measure the blank sample to ensure the measuring apparatus is clean enough for measuring.

0,5 g to 10 g of solder powder shall be measured for the particle size distribution.

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4.3.4 Evaluation

Express the masses of the particle above, within, and below the nominal size range as

percentages of the mass of the original specimen. Enter the data in the test report. Annex A

shows an example of the test report.
4.4 Powder particle size distribution measurement – Digital microscope
4.4.1 Object

The powder particle size distribution of the solder powder is measured using a digital

microscope capable of three-dimensional (3D) observation by 3D construction of an acquired

image.
4.4.2 Equipment/apparatus
a) Glass slide
b) 3D digital microscope:
1) 1 000 times or more magnification;

2) equipping telecentric optical system and transmissive illumination which enable high-

precision measurement;

3) equipping an image storage device which is capable of 3D construction from the stored

images.
4.4.3 Procedure

Measurement shall be done in accordance with the instructions of the measuring apparatus. At

least 100 solder particles shall be placed on a glass slide, then observed using a digital

microscope. 3D image shall be stored.

The powder particle size shall be determined by assumption that the solder powders are

spherical. The powders shall be sorted out according to the assigned classification type

specified in Table 2 of IEC 61190-1-2:2014. The number of sorted particles shall be counted

and converted into masses.
4.4.4 Evaluation

Express the masses of the powder above, within, and below the nominal size range as

percentages of the mass of the original specimen. Enter the data in the test report. Annex A

shows an example of the test report form.
5 Solder paste viscosity
5.1 Method A:Trace spiral pump method
5.1.1 Object

This test specifies a standard procedure for determining viscosity-shear rate characteristics and

thixotropy (thixotropic index), which is also close relating to the printability of the solder paste.

Trace spiral viscometer is a coaxial-cylinder rotational type viscometer with a small sample

receptance, for example 0,2 cm capacity. Outer barrel of the
...

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